A workpiece spindle for a magnetic-shoe external cylindrical grinding machine a spindle for rotating a ring-shaped workpiece, a holding device for holding the ring-shaped workpiece and a hydraulic magnetic core lifting device coupled to the spindle and to the holding device to vary an axial spacing between the holding device and the spindle. The holding device has a magnetic shoe for clamping the ring-shaped workpiece in the holding device.

A transport carrier includes a carrier body being able to hold a substrate that is a deposition target, by which the substrate is transported in a deposition apparatus while being held, wherein the carrier body includes magnetic chucking means which magnetically chucks a mask which shields a non-deposition region of the substrate through the substrate and holds the mask in a state in which the mask has come into contact with a film formation surface of the substrate.

A transport carrier includes a carrier body being able to hold a substrate that is a deposition target, by which the substrate is transported in a deposition apparatus while being held, wherein the carrier body includes magnetic chucking means which magnetically chucks a mask which shields a non-deposition region of the substrate through the substrate and holds the mask in a state in which the mask has come into contact with a film formation surface of the substrate.

A deposition apparatus includes a transport mechanism including a transport carrier which holds and transports a substrate and transport modules which constitute a transport path through which the transport carrier moves, an alignment chamber in which the substrate held by the transport carrier is loaded and a mask is positioned and fixed to the loaded substrate, a deposition chamber in which the substrate held by the transport carrier is loaded from the alignment chamber and deposition materials are deposited on the loaded substrate, and control means which controls a magnetic force generated between a plurality of magnets arranged in the transport carrier in a transport direction of the substrate and a plurality of coils arranged to face the plurality of magnets in each transport module by applying a current or a voltage to the plurality of coils.

A deposition apparatus includes a transport mechanism including a transport carrier which holds and transports a substrate and transport modules which constitute a transport path through which the transport carrier moves, an alignment chamber in which the substrate held by the transport carrier is loaded and a mask is positioned and fixed to the loaded substrate, a deposition chamber in which the substrate held by the transport carrier is loaded from the alignment chamber and deposition materials are deposited on the loaded substrate, and control means which controls a magnetic force generated between a plurality of magnets arranged in the transport carrier in a transport direction of the substrate and a plurality of coils arranged to face the plurality of magnets in each transport module by applying a current or a voltage to the plurality of coils.

An electrostatic chuck solves the problem of wafer sticking by providing conductive paths on raised embossments that are bridged together and are connected to ground that support the wafer substrate above the surface of the electrostatic chuck. Further, laterally spaced electrode patterns and electrode elements which are spaced laterally and longitudinally away from the raised embossments reduce or eliminate electrical coupling during wafer clamping between conductively coated embossments and the electrode elements, thereby creating a low resistance path for charges remaining on the wafer after declamping to promptly travel to ground. The conductive bridge and electrode pattern configuration also substantially reduces or eliminates any charge build up on the conductive bridge(s) during clamping in order that charge build up in islands (worn portions of the insulator layer of the main field area) do not affect the charge dissipation from the wafer substrate through the conductive bridges to ground.

An electrostatic chuck has a structure in which an electrostatic electrode is embedded in a disk-like ceramic plate and attracts a wafer that is placed on the ceramic plate and that has a diameter smaller than that of the ceramic plate by Johnsen-Rahbek force. The electrostatic chuck includes an insulating film that has an electric resistance larger than that of the ceramic plate in an annular region of a front surface of the ceramic plate from an outer circumferential edge of the ceramic plate to the inside of an outer circumferential edge of the wafer that is placed on the ceramic plate.

A turning system allows for slow revolution of a shaft at variable angles so that the work pieces such as cup can be operated on. The work piece could be attached by a hollow cylinder that magnetically attaches to the shaft of the system by placing the hollow cylinder on the shaft. As the shaft enter it contacts an attachment device such as a magnet to hold the work piece on the shaft.

A turning system allows for slow revolution of a shaft at variable angles so that the work pieces such as cup can be operated on. The work piece could be attached by a hollow cylinder that magnetically attaches to the shaft of the system by placing the hollow cylinder on the shaft. As the shaft enter it contacts an attachment device such as a magnet to hold the work piece on the shaft.

A work holder includes: a first holding part having three attracting members that are arranged circumferentially apart from each other to attract an axial end face of an annular work; and a second holding part having a contacting member that is held in contact with an inner periphery or outer periphery of the work and restricts radial movement of the work.