Methods, systems, and apparatus, including medium-encoded computer program products, for computer aided design and manufacture of physical structures using subtractive manufacturing systems and techniques include, in one aspect, a method including obtaining information regarding a geometry of a part to be machined by a computer-controlled manufacturing system from a workpiece; based on the information regarding the geometry, identifying machine components to be used by the computer-controlled manufacturing system during machining the part; determining a position for the machining of the part with respect to at least one of the machine components, to even out wear on the machine components, based on data indicating previous positions, movements and wear of components associated with the computer-controlled manufacturing system; and providing instructions usable by the computer-controlled manufacturing system, wherein the instructions are configured to cause the computer-controlled manufacturing system to use the position for the machining.

Methods, systems, and apparatus, including medium-encoded computer program products, for computer aided design and manufacture of physical structures using subtractive manufacturing systems and techniques include, in one aspect, a method including obtaining information regarding a geometry of a part to be machined by a computer-controlled manufacturing system from a workpiece; based on the information regarding the geometry, identifying machine components to be used by the computer-controlled manufacturing system during machining the part; determining a position for the machining of the part with respect to at least one of the machine components, to even out wear on the machine components, based on data indicating previous positions, movements and wear of components associated with the computer-controlled manufacturing system; and providing instructions usable by the computer-controlled manufacturing system, wherein the instructions are configured to cause the computer-controlled manufacturing system to use the position for the machining.

Provided is a disclosure for a cutting device configured to control a linear speed of a cutting wheel as the cutting wheel gets smaller with use.

Provided is a disclosure for a cutting device configured to control a linear speed of a cutting wheel as the cutting wheel gets smaller with use.

A machine tool includes: an imaging unit for capturing an image of a tool from a side of the tool; a shape extraction unit for extracting the shape of the tool from the image of the tool captured by the imaging unit; a wear detection unit for detecting the degree of wear of the tool based on the shape of the tool; and a changing unit for changing at least one of the pitch and the depth of cut according to the degree of wear.

A receiving unit of a length measurement control apparatus receives fitting information that indicates a fitting state between parts of a product that was assembled from a group of parts including members machined using a tool. A determination unit of the length measurement control apparatus determines whether to measure a length dimension of the tool in order to correct the machining position in accordance with a change in the length dimension of the tool, on the basis of whether the fitting state indicated in the fitting information received by the receiving unit is outside a threshold range.

The numerical controller creates a machining path on which a wire electrode is moved by analyzing blocks of a machining program, and creates interpolation data indicating an amount of movement for each interpolation period on the machining path. Further, the numerical controller calculates a length of the wire electrode used for machining (machined surface length) for each interpolation period, calculates a consumption amount of the wire electrode for each interpolation period, calculates a compensation amount for compensating the amount of movement based on the interpolation data, on the basis of the calculated consumption amount and compensates the amount of movement indicated by the interpolation data, based on the calculated compensation amount.

A substrate processing apparatus includes a substrate polishing unit 40 having a polishing pad for polishing a wafer W, and a top ring 41 for holding a wafer and pressing the wafer against the polishing pad. An elastic membrane 80 for holding a surface opposite to a polishing surface of the wafer W is attached to the top ring 41 as a consumable. The elastic membrane 80 is provided with a plurality of strain sensors 85 and 86 for measuring strain occurring in the elastic membrane 80 during polishing, and data of an amount of strain is read to a control device 15 by detection units 90 and 91. The control device 15 sets a processing condition such as a polishing recipe for the wafer W based on strain information of the elastic membrane 80 measured by the strain sensors.

A substrate processing apparatus includes a substrate polishing unit 40 having a polishing pad for polishing a wafer W, and a top ring 41 for holding a wafer and pressing the wafer against the polishing pad. An elastic membrane 80 for holding a surface opposite to a polishing surface of the wafer W is attached to the top ring 41 as a consumable. The elastic membrane 80 is provided with a plurality of strain sensors 85 and 86 for measuring strain occurring in the elastic membrane 80 during polishing, and data of an amount of strain is read to a control device 15 by detection units 90 and 91. The control device 15 sets a processing condition such as a polishing recipe for the wafer W based on strain information of the elastic membrane 80 measured by the strain sensors.

Provided is a disclosure for a cutting device configured to control a linear speed of a cutting wheel as the cutting wheel gets smaller with use.