A machine-tool including a machining module equipped with a tool-holder and a work-holder, and an optical measuring device-for the three-dimensional measurement of the relative position between the tool-holder and the work-holder. The optical measuring device includes an optical system mounted on the work-holder and a target mounted on the tool-holder. The target includes a useful face forming a positioning reference that can be placed in the optical axis of the optical system.

A machining system includes a machining unit and a moving apparatus configured to move the machining unit. The machining unit includes a rotating tool for rotating about an axis in a vertical direction, an upper surface abutting member configured to be abutted against an upper surface of a work, an end face abutting member configured to be abutted against an end face of the work between an upper edge and an lower edge of the work, and a vertical moving unit configured to change a position of the upper surface abutting member in the vertical direction with respect to the rotating tool. The rotating tool includes a machining portion main body, a first machining portion provided on a lower side of the machining portion main body, and a second machining portion provided on an upper side of the machining portion main body.

A three-dimensional target capable of serving as a positioning reference, including, on a useful face, a first structure and a second structure. The first structure defines a planar reference face divided up between at least a first portion whose surface is reflective according to a diffuse reflection, and a second portion whose surface is reflective according to a specular reflection, the second portion being divided up according to a series of localized zones positioned in the first portion. The second structure has an inclined face relative to the planar reference face. Applicable to three-dimensional optical measurement of the relative position between a first object and a second object.

A bonding apparatus configured to bond a first substrate and a second substrate includes a first holder configured to hold the first substrate; a second holder configured to hold the second substrate; a first imaging device provided at the first holder and configured to image the second substrate held by the second holder; a first light irradiating device provided at the first holder and configured to irradiate light to the second substrate when the second substrate is imaged; a second imaging device provided at the second holder and configured to image the first substrate held by the first holder; and a second light irradiating device provided at the second holder and configured to irradiate light to the first substrate when the first substrate is imaged. Each of the first light irradiating device and the second light irradiating device is connected to a first light source configured to irradiate white light.

The present disclosure is directed to calibrating position detection for a tool. The tool can use a sensor to detect a first value of a parameter. The tool can use a motor to extend the working member of the tool towards a working surface. The tool can include a base. The tool can detect, with the working member in contact with the working service, a second value of the parameter. The tool can determine a z-axis position of the working member relative to the working surface.

Provided is an inclination measuring device with excellent convenience. An inclination measuring device includes: an optical system (sensor head) configured to irradiate a measurement object with an irradiated light ray from a light source and receive a reflected light ray from a measurement surface; a light receiving unit including at least one spectroscope configured to separate the reflected light ray into wavelength components, and a detector in which a plurality of light receiving elements are disposed; a light guide including a plurality of cores; and a processor configured to calculate an inclination angle of the measurement surface based on reflected light rays with respect to a plurality of irradiated light rays with which a plurality of positions on the measurement surface are irradiated.

A testbed device includes high performance actuators, a video microscopy system and a plurality of high resolution, throughput sensors adapted or configured for collecting data that may be used in predictive modelling of machine processes.

A method includes receiving information indicative of a first worksite plan, determining a travel path extending along a work surface, causing a mobile machine to traverse the travel path, and receiving first sensor information associated with the work surface from a sensor of the mobile machine. The method also includes generating a second worksite plan based at least partly on the first sensor information, and providing instructions to a slave machine which, when executed by a controller of the slave machine, cause the controller of the slave machine to control the slave machine to perform at least part of the second worksite plan. The method further includes receiving second sensor information determined by the sensor of the mobile machine, and generating at least one of a safety metric and an accuracy metric based at least partly on the second sensor information.

A target body includes a plurality of markers, which together form a target for optically capturing and for determining a position and/or alignment of the target body from the captured markers, in particular for determining a position and/or an alignment of a movable part of a coordinate measuring machine, a robot, a material application machine or a machine tool. The target body includes a plurality of surface regions. The surface regions are oriented in different directions. At least one of the markers is arranged in a surface region. In addition, an arrangement which includes a target body and a method for determining a position and/or an alignment of the target body are provided.

A machine control device includes: an imaging control unit that controls the imaging device to capture two images at two different imaging positions; an imaging position information acquiring unit that acquires positional information of the two imaging positions; a measurement distance restoring unit that restores a measurement distance of the object based on two images, distance information between two imaging positions, and a parameter of the imaging device by using a stereo camera method; and a predetermined precision position calculating unit that calculates distance information between the two imaging positions at which the measurement precision of the object satisfies a predetermined precision based on the two images, the measurement distance of the object, and the parameter of the imaging device, in which the machine control device controls the position and orientation of the imaging device based on the distance information between the two imaging positions, and changes two imaging positions.