Patent classifications
B23Q2703/04
System and method for damping machine-induced vibrations in a workpiece
A system for damping machine-induced vibration in a workpiece includes a plurality of workpiece holders to hold the workpiece in a work cell. The system also includes a machine tool located in the work cell. The machine tool performs a machining operation on the workpiece while the workpiece is held by the plurality of workpiece holders. The system further includes a damping apparatus coupled to the workpiece. The damping apparatus controls machine-induced vibrations in the workpiece during the machining operation.
TENSIONING CYLINDER DEVICE
The invention relates to a tensioning cylinder device, comprising a housing (2) and and at least partly longitudinally movable piston-rod unit (30, 34) arranged therein, and comprising a compensating element in the form of a bellows body (18) having bellows folds, which is longitudinally variable and has a media-carrying connection to a compressible medium accommodated in a medium chamber (12) in the housing (2).
WHEEL MILLING WINDOW FIXTURE
Disclosed is a wheel milling window device, composed of a bottom plate, guide blocks, clamping slide blocks, mounting keys, hydraulic cylinders, hydraulic pipelines, connecting blocks, pressure claws, first rotating shafts, second rotating shafts, end face blocks, a mandrel, a mandrel seat, a locking jackscrew, a mandrel height adjusting post, a mandrel guide post, a mandrel guide post locking screw, a locking ring, circumferential positioning posts and circumferential slide blocks. The device can reduce the manufacturing cost, shorten the manufacturing period, effectively reduce the time for replacing a fixture and improve the efficiency of milling a wheel window.
SYSTEM AND METHOD FOR DAMPING MACHINE-INDUCED VIBRATIONS IN A WORKPIECE
A system for damping machine-induced vibration in a workpiece includes a plurality of workpiece holders to hold the workpiece in a work cell. The system also includes a machine tool located in the work cell. The machine tool performs a machining operation on the workpiece while the workpiece is held by the plurality of workpiece holders. The system further includes a damping apparatus coupled to the workpiece. The damping apparatus controls machine-induced vibrations in the workpiece during the machining operation.
ADDITIVE LATHE THAT PRINTS IN CYLINDRICAL COORDINATES
An additive lathe integrates the advantages of additive manufacturing (also called 3d printing) with the cylindrical motion of a lathe to reduce material waste, print times, and increase creative potential. A post-processing system allows for an improved surface finishing on parts. The additive lathe no longer prints in cartesian (X, Y, Z) coordinates as other 3D printers and instead prints using cylindrical (R, Theta, Z) coordinates. The traditional bed or build plate is replaced with a horizontal cylindrical starter bar, on which 3D printed material is deposited along and around the bar. Essentially, the additive lathe works like a conventional lathe, but in reverse. Instead of taking a cylinder and slowly removing material as the part spins, the additive lathe adds material along and around the bar iteratively building up the part. The finishing mechanism allows for the creation of a smooth outer finish on printed parts while still in the printer.
AUTONOMOUS PRODUCTION LINE
An autonomous production line for machining work pieces e.g. by sawing, milling, boring or grinding and proposes a roller conveyor with machining stations, a placement station and an unloading station. Machining robots machine the work pieces at the machining stations while the work pieces are supported on suction tables.
Wafer Carrier, Method for Manufacturing the Same and Method for Carrying a Wafer
A wafer carrier comprises a first foil, a second foil, and a chamber between the first and the second foil. The first foil has a perforation and is used for carrying the wafer. The first and the second foil are connected to each other so as to form the chamber. The chamber is configured to be evacuated to form a vacuum in the chamber, the vacuum causes an underpressure at the perforation, the underpressure forms a carrying force to the wafer to be carried.
Adjustable part holding fixture, system and method
There is provided an adjustable part holding fixture, system and method. The fixture has a base assembly with a container and a phase change material contained within the container. The fixture has a control device to convert the phase change material between a non-rigid state and a rigid state. The fixture has a plurality of part holding assemblies, each having a base anchoring portion for insertion into and positioning in the phase change material, and a part attachment portion configured to releasably attach to a surface of a part being held by the fixture. The phase change material in the non-rigid state allows for positioning of the base anchoring portion and adjusting to the part being held, and the phase change material in the rigid state holds the base anchoring portion in a desired position and holds the part in place during one or more processes performed on the part.
Chucking apparatus for a workpiece with honeycomb structure
A chucking apparatus for a workpiece with honeycomb structure includes a table that can be supplied with vacuum and a clamping plate which can be placed on the table and which accommodates the workpiece in the region of an already profiled surface determined by the face ends of the honeycombs, whose receiving surface, which corresponds to the profiled surface of the workpiece, is provided with suction openings to the table. In order to provide advantageous chucking conditions, the clamping plate has an open-cell structure.
Wafer carrier, method for manufacturing the same and method for carrying a wafer
A wafer carrier comprises a first foil, a second foil, and a chamber between the first and the second foil. The first foil has a perforation and is used for carrying the wafer. The first and the second foil are connected to each other so as to form the chamber. The chamber is configured to be evacuated to form a vacuum in the chamber, the vacuum causes an underpressure at the perforation, the underpressure forms a carrying force to the wafer to be carried.