A method for manufacturing a structure on a surface of a workpiece (1) is disclosed, the method having the following steps: applying a liquid base layer (2) onto the surface of the workpiece (1); spraying on at least one droplet (3) into the not yet congealed base layer (2), wherein the at least one droplet (3) at least partially, preferably completely, penetrates into the base layer (2); fixing the base layer (2); and at least partially removing the at least one droplet (3).

Further, a second method having the following steps is disclosed: spraying on at least one droplet (3) onto the surface of the workpiece (1); applying a liquid base layer (2) onto the surface of the workpiece (1), wherein the base layer (2) flows around the at least one droplet (3) and preferably at least partially covers the at least one droplet (3); fixing the base layer (2); at least partially removing the at least one droplet (3).

Finally, a device for performing the methods is disclosed.

A method for processing a surface (2) of a workpiece (1) is disclosed. Besides, a device for performing the method is disclosed.

A method for processing a surface (2) of a workpiece (1) is disclosed. Besides, a device for performing the method is disclosed.

An exterior material may be configured to form an exterior of a home appliance, the exterior material includes a base material having a hierarchical circular structure pattern on the surface. The hierarchical circular structure pattern may include a plurality of circular structures having diameters different from each other, and a pattern density may be, in percentage of area of the surface, about 20 to 90%.

An exterior material may be configured to form an exterior of a home appliance, the exterior material includes a base material having a hierarchical circular structure pattern on the surface. The hierarchical circular structure pattern may include a plurality of circular structures having diameters different from each other, and a pattern density may be, in percentage of area of the surface, about 20 to 90%.

A grinding or sanding machine for grinding or sanding a surface of a workpiece includes a transportation device for transporting a work piece, a revolving grinding or sanding belt, and at least one pressure beam for exerting a pressure toward the transportation device. A plate is provided that is movable in a plane perpendicular to the direction in which pressure is exerted. The plate is disposed between the belt and the pressure beam. A drive device randomly moves the plate in plate movement directions in terms of either or both direction and speed.

A grinding or sanding machine for grinding or sanding a surface of a workpiece includes a transportation device for transporting a work piece, a revolving grinding or sanding belt, and at least one pressure beam for exerting a pressure toward the transportation device. A plate is provided that is movable in a plane perpendicular to the direction in which pressure is exerted. The plate is disposed between the belt and the pressure beam. A drive device randomly moves the plate in plate movement directions in terms of either or both direction and speed.

A surface treatment apparatus in the form of an attachment for use with mobile hydraulic equipment which incorporates one or more grinding head. The apparatus incorporates components such as a gimbal and a linkage which further enhance the ability of the grinding head to achieve uniform surface treatment results on uneven surfaces. The linkage may also serve as a lever to prop up the weight of the apparatus on the surface and thereby allowing personnel safe and convenient access to service abrasive tooling bits on the underside of the grinding head. The purpose of such an apparatus is to achieve greater productivity without sacrificing quality of surface treatment finished results when treating a surface.

A surface treatment apparatus in the form of an attachment for use with mobile hydraulic equipment which incorporates one or more grinding head. The apparatus incorporates components such as a gimbal and a linkage which further enhance the ability of the grinding head to achieve uniform surface treatment results on uneven surfaces. The linkage may also serve as a lever to prop up the weight of the apparatus on the surface and thereby allowing personnel safe and convenient access to service abrasive tooling bits on the underside of the grinding head. The purpose of such an apparatus is to achieve greater productivity without sacrificing quality of surface treatment finished results when treating a surface.

A wafer processing method includes a liquid supplying step of supplying a liquid to the front side of a wafer, a close contact making step of pressing a protective film against the front side of the wafer with the liquid interposed therebetween, thereby bringing the protective film into close contact with the front side of the wafer, a protective member fixing step of covering the protective film, with a protective member formed from a liquid resin curable by external stimulus, thereby fixing the protective member through the protective film to the front side of the wafer, a grinding step of grinding the back side of the wafer to reduce the thickness of the wafer, and a peeling step of peeling the protective film and the protective member from the wafer thinned by the grinding step.