The present disclosure provides an apparatus and a method for polishing a semiconductor substrate in semiconductor device manufacturing. The apparatus can include: a carrier configured to hold the substrate; a polishing pad configured to polish a first surface of the substrate; a chemical mechanical polishing (CMP) slurry delivery arm configured to dispense a CMP slurry onto the first surface of the substrate; and a pad conditioner configured to condition the polishing pad. In some embodiments, the pad conditioner can include: a conditioning disk configured to scratch the polishing pad; a conditioning arm configured to rotate the conditioning disk; a plurality of magnetic screws configured to secure the conditioning disk onto the conditioning arm and including a respective plurality of screw heads; and a plurality of blocking devices respectively positioned beneath the plurality of screw heads and configured to block debris particles from entering a respective plurality of screw holes.

The invention relates to a method for the multi-stage grinding of workpieces (20) made of hard mineral materials using a robot (10). To this end, the workpiece (20) is moved into a processing region (21) and measured and/or oriented there by the robot (10). The robot (10) comprises a grinding head (11) by way of which it then takes up a first abrasive (14) preferably from a storage container (30) and starts a first grinding process. After the first grinding process is complete, the robot (10) releases the first abrasive (14) again and then takes up a second abrasive (14), preferably from the same or some other storage container (30). Then the robot (10) starts a second grinding process, and after the latter is complete, releases the second abrasive (14) again. One or more further grinding processes may be provided, but the grinding method can also be finished after the second grinding process. If further grinding processes are provided, the robot (10) first of all takes up the respective abrasive (14), carries out the grinding process and releases the abrasive (14) again. After the final grinding process is complete, the workpiece (20) is removed from the processing region (21). Furthermore, the invention also comprises a plant (26) for carrying out the method and a stripping device (40), a storage container (30) and a vacuum table (50), by means of which the method can be carried out.

The invention relates to a method for the multi-stage grinding of workpieces (20) made of hard mineral materials using a robot (10). To this end, the workpiece (20) is moved into a processing region (21) and measured and/or oriented there by the robot (10). The robot (10) comprises a grinding head (11) by way of which it then takes up a first abrasive (14) preferably from a storage container (30) and starts a first grinding process. After the first grinding process is complete, the robot (10) releases the first abrasive (14) again and then takes up a second abrasive (14), preferably from the same or some other storage container (30). Then the robot (10) starts a second grinding process, and after the latter is complete, releases the second abrasive (14) again. One or more further grinding processes may be provided, but the grinding method can also be finished after the second grinding process. If further grinding processes are provided, the robot (10) first of all takes up the respective abrasive (14), carries out the grinding process and releases the abrasive (14) again. After the final grinding process is complete, the workpiece (20) is removed from the processing region (21). Furthermore, the invention also comprises a plant (26) for carrying out the method and a stripping device (40), a storage container (30) and a vacuum table (50), by means of which the method can be carried out.

An object of the invention is to provide a calibration apparatus which enables the pressing force of the polishing pad to be adjusted by a simple method without the need of removing a stage on which a substrate can be placed. One embodiment of the invention provides a calibration apparatus for a bevel polishing system for polishing a bevel portion of a substrate, comprising: a load measuring device capable of measuring a pressing load from a polishing pad of the bevel polishing system; and a base plate capable of having the load measuring device placed thereon, wherein the base plate is capable of being fixed on a vacuum suction table which is capable of having a substrate placed thereon.

An abrasive rotary tool includes a tool shank a flexible planar section positioned opposite the tool shank. The flexible planar section forms a first abrasive external surface on a first side of the flexible planar section and a second abrasive external surface on a second side of the flexible planar section. The flexible planar section facilitates abrading, corners of a workpiece across multiple angles relative to the axis of rotation for the rotary tool through bending of the flexible planar section when the abrasive external surfaces are applied to a corner of the workpiece.

A method for cutting a display panel is provided by the disclosure. The display panel includes a substrate, a cover plate provided opposite to the substrate, multiple display components sandwiched between the substrate and the cover plate, and encapsulation glue sandwiched between the substrate and the cover plate and surrounding the multiple display components. The method includes: forming multiple display modules by cutting the substrate and the cover plate of the display panel at a position between adjacent display components; and edging a display module obtained through the cutting with an edging machine by a distance from an edge of the display module to inward of the encapsulation glue, until the encapsulation glue is grinded to a preset width. A design of slim bezel can be achieved for the display panel with high accuracy by the method for cutting the display panel according to the disclosure.

The machine for grinding sheet-like elements, particularly tiles and slabs made of ceramic material, natural stone, glass or the like, includes a base framework, means for advancing at least one sheet-like element on a movement plane (A) along an advancement direction (B), the sheet-like element being provided with a pair of opposite first sides to be ground and a front side transversal to the first sides and defining the advancement front of the sheet-like element, means for machining the first sides adapted to intercept the sheet-like element in the motion thereof along the advancement direction (B), means for square-positioning the sheet-like element on the movement plane (A) comprising at least one abutment element which defines at least two support points adapted to contact the front side for arranging it in a position orthogonal to the advancement direction (B).

A polishing apparatus which can keep a width of a polishing tool constant when a peripheral portion of a substrate is polished by the polishing tool is disclosed. The polishing apparatus includes a substrate holder 3 configured to hold a substrate W and to rotate the substrate W and a pressing pad 50 configured to press a polishing tool 23 against a peripheral portion of the substrate W held by the substrate holder 3. The pressing pad 50 includes an elastic member 55 having a pressing surface 55a configured to press the polishing tool 23 against the peripheral portion of the substrate W and a support member 56 configured to support the elastic member 55. The support member 56 has a recess 57 formed in a front surface 56a of the support member 56, the elastic member 55 being capable of entering the recess 57.

A chamfering apparatus including chamfering part for removing notch, cleaning part for cleaning and drying wafer, and chamfered-shape measuring part for measuring chamfered shape, each of chamfering and cleaning part, and chamfered-shape measuring part including rotatable stage for holding wafer and control unit for controlling rotational positions of rotatable stage and wafer, rotatable stage having reference position serving as reference of rotational positions at beginning of rotation, wherein wafer is held wherein rotational position of wafer at beginning of rotation relative to reference position is at same rotational position on all rotatable stages, and control unit to control rotational position of wafer to be at predetermined position at beginning and end of rotation. As a result, the chamfering apparatus and method for manufacturing notchless wafer allowing appropriate feedback control even in notchless wafer, suppress variation in chamfered shape dimension, and achieve desired cross-sectional shape precision of wafer chamfered portion.

A mirror-finishing chamfer polishing is applied using an abrasive-grain-free polishing solution to a chamfered portion of a semiconductor wafer having an oxide film on a top side or the top and bottom sides of the semiconductor wafer and having no oxide film on the chamfered portion. Further, prior to the mirror-finishing chamfer polishing, a pre-finish mirror chamfer polishing is applied using an abrasive-grain-containing polishing solution to the chamfered portion of the semiconductor wafer having the oxide film on the top side or the top and bottom sides and on the chamfered portion.