An edge narrowing method for a display panel is disclosed. The method includes the steps of providing the display panel, a grinding apparatus and a polishing apparatus; tilting the display panel so that the first substrate and a grinding member of the grinding apparatus have a first grinding angle therebetween; grinding the first substrate and the light-shielding area with the grinding apparatus while the display panel is tilted at the first grinding angle, thereby forming a first grinding end surface; stopping grinding of the first substrate and the light-shielding area when the width of the light-shielding area is between 0.35 and 1 mm; and polishing the first grinding end surface with the polishing apparatus to form a first end surface.

A substrate processing apparatus includes a chuck configured to hold a substrate horizontally; a processing unit configured to press a processing tool against an outer periphery of the substrate held by the chuck to process the substrate; and a lower cup configured to collect a processing residue falling from the substrate over an entire circumference of the substrate. The lower cup is provided with a discharge opening through which the processing residue is discharged.

A substrate processing apparatus which reliably prevents a cleaning liquid containing foreign particles from falling from a polishing head onto a substrate is disclosed. The substrate processing apparatus includes a rotating and holding mechanism, a polishing head, and a head cleaning device configured to supply the cleaning liquid to the polishing head to clean the polishing head during polishing and/or after polishing of the substrate.

An edge trimming method for cutting an outer peripheral portion of a workpiece having a chamfered part on the outer peripheral portion. The method includes a cut in step of relatively moving a rotating cutting blade and a chuck table to cause the blade to cut into the outer peripheral portion, a cutting step of, after the cut in step, rotating the chuck table and causing the outer peripheral portion to be cut, to form an annular step, and a moving step of, after the cutting step, moving the blade in a direction of its axis of rotation to form another annular step adjacent to the first-mentioned annular step. The cut in, cutting, and moving steps are repeated in this order, and a stepped oblique region is formed on the outer peripheral portion, with a thickness increasing from an outermost peripheral edge toward an inner side of the workpiece.

A method for manufacturing a semiconductor device includes chucking in which a semiconductor device wafer is attached to an upper surface of a chuck mechanism with its device surface down; and edge trimming performed after the chucking, wherein the edge trimming comprises: rotating the semiconductor device water horizontally by the chuck mechanism; rotating a rotating blade horizontally by a vertical spindle to which an ultrasonic wave is applied and trimming a circumferential side surface of the semiconductor device wafer by the rotating blade.

A substrate processing apparatus includes: a holding portion configured to hold a substrate including a bevel and an end surface in a peripheral edge portion of the substrate; a rotator configured to rotate the holding portion; a polishing head configured to be brought into contact with the peripheral edge portion of the substrate held by the holding portion and to polish the peripheral edge portion of the substrate; and a holder to which the polishing head is installed.

A multi-wheel grinder tool that is comprised of a support platform, a motor, a grinder portion, a pulley system, a set of four pad drivers, a set of four square bearing housings, a set of four pad holders, a set of pins and a plurality of pads. The multi-wheel grinder tool is used polish edges of counter tops.

A multi-wheel grinder tool that is comprised of a support platform, a motor, a grinder portion, a pulley system, a set of four pad drivers, a set of four square bearing housings, a set of four pad holders, a set of pins and a plurality of pads. The multi-wheel grinder tool is used polish edges of counter tops.

A substrate processing apparatus includes: a holding portion configured to hold a substrate including a bevel and an end surface in a peripheral edge portion of the substrate; a rotator configured to rotate the holding portion; a polishing head configured to be brought into contact with the peripheral edge portion of the substrate held by the holding portion and to polish the peripheral edge portion of the substrate; and a holder to which the polishing head is installed.

Systems and methods for angle polishing of the end faces of a plurality of optical connectors are provided. Systems are provided that include a connector defining a longitudinal axis, and at least two ferrules mounted with respect to the connector and arranged in a side-by-side orientation. The end faces of the connectors are movable relative to the connector and such movement facilitates lateral orientation of the angle polished end faces of the ferrules relative to the connector when in the mating position. Various mechanisms and methods for facilitating movement of the ferrules relative to the connector are disclosed to achieve the desired lateral polish orientation of the ferrule end faces.