Systems and methods for angle polishing of the end faces of a plurality of optical connectors are provided. Systems are provided that include a connector defining a longitudinal axis, and at least two ferrules mounted with respect to the connector and arranged in a side-by-side orientation. The end faces of the connectors are movable relative to the connector and such movement facilitates lateral orientation of the angle polished end faces of the ferrules relative to the connector when in the mating position. Various mechanisms and methods for facilitating movement of the ferrules relative to the connector are disclosed to achieve the desired lateral polish orientation of the ferrule end faces.

A method for processing a silicon wafer, the method including cutting an ingot to form a wafer, extracting from measured shape data a cross-sectional profile, the cross-sectional profile passing through the center of the wafer and being aligned with a cutting direction of an ingot, interpolating the shape data with a fixed and pre-determined step size, fitting a first second-degree polynomial to the cross-sectional profile, determining a residual profile by subtracting the polynomial from the cross-sectional profile, fitting a second second-degree polynomial to the residual profile using a sliding window of pre-determined width to determine a position, height, and curvature of each peak and valley of the residual profile, determining a waviness parameter based on the position, height, and curvature of each peak and valley of the residual profile, and further processing the wafer based on the waviness parameter and a predetermined waviness threshold.

The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).

The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).

Systems and methods for angle polishing of the end faces of a plurality of optical connectors are provided. Systems are provided that include a connector defining a longitudinal axis, and at least two ferrules mounted with respect to the connector and arranged in a side-by-side orientation. The end faces of the connectors are movable relative to the connector and such movement facilitates lateral orientation of the angle polished end faces of the ferrules relative to the connector when in the mating position. Various mechanisms and methods for facilitating movement of the ferrules relative to the connector are disclosed to achieve the desired lateral polish orientation of the ferrule end faces.

Systems and methods for angle polishing of the end faces of a plurality of optical connectors are provided. Systems are provided that include a connector defining a longitudinal axis, and at least two ferrules mounted with respect to the connector and arranged in a side-by-side orientation. The end faces of the connectors are movable relative to the connector and such movement facilitates lateral orientation of the angle polished end faces of the ferrules relative to the connector when in the mating position. Various mechanisms and methods for facilitating movement of the ferrules relative to the connector are disclosed to achieve the desired lateral polish orientation of the ferrule end faces.

A multi-wheel grinder tool that is comprised of a support platform, a motor, a grinder portion, a pulley system, a set of four pad drivers, a set of four square bearing housings, a set of four pad holders, a set of pins and a plurality of pads. The multi-wheel grinder tool is used polish edges of counter tops.

A multi-wheel grinder tool that is comprised of a support platform, a motor, a grinder portion, a pulley system, a set of four pad drivers, a set of four square bearing housings, a set of four pad holders, a set of pins and a plurality of pads. The multi-wheel grinder tool is used polish edges of counter tops.

There is provided a method for manufacturing a semiconductor device, including: attracting a semiconductor device wafer by a chuck mechanism and rotating the semiconductor device wafer horizontally; rotating a rotary blade horizontally by a vertical spindle to which ultrasonic waves are applied; trimming an outer peripheral end portion of the semiconductor device wafer that is horizontally rotating by the rotary blade that is horizontally rotating, to form a groove in the outer peripheral end portion; correcting a tip shape of the rotary blade that is horizontally rotating by a blade-forming grinding wheel during the trimming; and grinding one main surface of the semiconductor device wafer that is horizontally rotating by a cup grinding wheel that is horizontally rotating after the trimming.

An apparatus and a method which can perform different processes, such as polishing and cleaning, on a surface of a substrate, such as a wafer, with a single processing head, and can process the surface of the substrate efficiently are disclosed. The apparatus includes: a substrate holder configured to hold a substrate and rotate the substrate; and a processing head configured to bring scrubbing tapes into contact with a first surface of the substrate to process the first surface. The processing head includes: pressing members arranged to press the scrubbing tapes against the first surface of the substrate; position switching devices configured to be able to switch positions of the pressing members between processing positions and retreat positions; tape feeding reels configured to feed the scrubbing tapes, respectively; and tape take-up reels configured to take up the scrubbing tapes, respectively.