The machine for grinding sheet-like elements, particularly tiles and slabs made of ceramic material, natural stone, glass or the like, includes a base framework, means for advancing at least one sheet-like element on a movement plane (A) along an advancement direction (B), the sheet-like element being provided with a pair of opposite first sides to be ground and a front side transversal to the first sides and defining the advancement front of the sheet-like element, means for machining the first sides adapted to intercept the sheet-like element in the motion thereof along the advancement direction (B), means for square-positioning the sheet-like element on the movement plane (A) comprising at least one abutment element which defines at least two support points adapted to contact the front side for arranging it in a position orthogonal to the advancement direction (B).

The machine for grinding sheet-like elements, particularly tiles and slabs made of ceramic material, natural stone, glass or the like, includes a base framework, means for advancing at least one sheet-like element on a movement plane (A) along an advancement direction (B), the sheet-like element being provided with a pair of opposite first sides to be ground and a front side transversal to the first sides and defining the advancement front of the sheet-like element, means for machining the first sides adapted to intercept the sheet-like element in the motion thereof along the advancement direction (B), means for square-positioning the sheet-like element on the movement plane (A) comprising at least one abutment element which defines at least two support points adapted to contact the front side for arranging it in a position orthogonal to the advancement direction (B).

The present invention has an object of providing a stepped wafer that can prevent a resist from remaining after development, and a method for manufacturing the stepped wafer. The stepped wafer according to the present invention is a stepped wafer having a step and whose main surface is thinner in a center portion and is thicker in an outer periphery. The step includes a curved surface with a radius of curvature ranging from 300 m to 1800 m.

To provide a polishing apparatus capable of polishing bevel portions of varying shape by selecting a suitable polishing recipe, based on a state before polishing. The polishing apparatus 100 comprises: a holding/polishing unit 102 for holding and polishing a workpiece W1; and an identifying unit 104 for identifying data 104a associated with a state of the peripheral portion of the substrate W1 before polishing. The holding/polishing unit 102 comprises: a holder 106 for holding and rotating the substrate W1; and a polisher 108 for polishing the peripheral portion of the substrate W1 by pressing a polishing member against the peripheral portion. A polishing-condition determiner 110 determines a polishing condition, based on data 104a indicating to which type, of a plurality of shape-related types, the shape of a given peripheral portion belongs.

A polishing apparatus which can keep a width of a polishing tool constant when a peripheral portion of a substrate is polished by the polishing tool is disclosed. The polishing apparatus includes a substrate holder 3 configured to hold a substrate W and to rotate the substrate W, and a pressing pad 50 configured to press a polishing tool 23 against a peripheral portion of the substrate W held by the substrate holder 3. The pressing pad 50 includes an elastic member 55 having a pressing surface 55a configured to press the polishing tool 23 against the peripheral portion of the substrate W and a support member 56 configured to support the elastic member 55. The support member 56 has a recess 57 formed in a front surface 56a of the support member 56, the elastic member 55 being capable of entering the recess 57.

A grinding method, an OGS substrate and a manufacturing method of an OGS mother substrate are provided. The grinding method is used to grind the OGS substrate comprising a base substrate, wherein a shielding pattern is formed inside a periphery region of the base substrate, a reference mark is formed above the shielding pattern, the grinding method comprises: grinding an edge of the base substrate to form a chamfer; identifying edges of the reference mark and the base substrate; calculating a position distance between an outer edge of the reference mark and the edge of the base substrate corresponding thereto based on the identified edges of the reference mark and the base substrate; judging whether the position distance is smaller than a first distance; if it is judged that the position distance is smaller than the first distance, stopping grinding; otherwise, continuing to grind.

An OGS substrate and a grinding method thereof are provided. The OGS substrate includes a base substrate, wherein a shielding pattern is formed inside a periphery region of the base substrate, a reference mark is formed above the shielding pattern, the grinding method comprises: grinding an edge of the base substrate to form a chamfer; identifying edges of the reference mark and the base substrate; calculating a position distance between an outer edge of the reference mark and the edge of the base substrate corresponding thereto based on the identified edges of the reference mark and the base substrate; judging whether the position distance is smaller than a first distance; if it is judged that the position distance is smaller than the first distance, stopping grinding; otherwise, continuing to grind.

A material trimming system used with a table saw having a rotationally driven arbor, a table with a specialized tray to retain an article to be trimmed, the system including a core structure with a core rotational axis that attaches to the arbor that has an arbor rotational axis. The system also includes a peripheral ring that is about a ring rotational axis, wherein the peripheral ring removably engages the core structure, wherein the peripheral ring includes an outer peripheral element that is operational to trim a material of the article to a selected configuration. In addition, included in the system has a cover having a cover rotational axis, the cover having a mechanism to be removably attachable to the core structure that is operational to removably retain the peripheral ring to the core structure, wherein the arbor, core, ring, and cover rotational axes are all coincident to one another.

An OGS substrate and a grinding method thereof are provided. The OGS substrate includes a base substrate, wherein a shielding pattern is formed inside a periphery region of the base substrate, a reference mark is formed above the shielding pattern, the grinding method comprises: grinding an edge of the base substrate to form a chamfer; identifying edges of the reference mark and the base substrate; calculating a position distance between an outer edge of the reference mark and the edge of the base substrate corresponding thereto based on the identified edges of the reference mark and the base substrate; judging whether the position distance is smaller than a first distance; if it is judged that the position distance is smaller than the first distance, stopping grinding; otherwise, continuing to grind.

A method for manufacturing a semiconductor device includes chucking in which a semiconductor device wafer is attached to an upper surface of a chuck mechanism with its device surface down; and edge trimming performed after the chucking, wherein the edge trimming comprises: rotating the semiconductor device water horizontally by the chuck mechanism; rotating a rotating blade horizontally by a vertical spindle to which an ultrasonic wave is applied and trimming a circumferential side surface of the semiconductor device wafer by the rotating blade.