A polishing apparatus capable of forming a step-shaped recess having a right-angled cross section in an edge portion of a substrate, such as a wafer, is disclosed. The polishing apparatus includes: a substrate rotating device configured to rotate the substrate about a rotation axis; a first roller having a first circumferential surface configured to press a polishing tape against the edge portion of the substrate; and a second roller having a second circumferential surface in contact with the first circumferential surface. The second roller has a tape stopper surface that restricts movement of the polishing tape in a direction away from the rotation axis. The tape stopper surface is located radially outward of the first circumferential surface.

A device has laterally mobile pressure devices on belt sanders in throughfeed, which are brought into position so that workpieces detected by detectors are sanded in a laterally limited area in the longitudinal direction. An arrangement of such pressure arrangements represents, for example, a segmented sanding pad. The method of lateral movement of its segments and the devices created for this purpose enable, among other things, the sanding of frames in the wood grain direction of their individual parts and/or their center panel as well as the application of sanding patterns to workpiece surfaces.

Wheel back cavity groove processing equipment is disclosed in the present application, which includes a lower lifting system, a central brush system, groove brush systems, a synchronous clamping and rotating system, a left brush system, a right brush system, an upper lifting system and the like. The wheel back cavity groove processing equipment not only may be used for removing burrs from wheel back cavity grooves, but also may be used for removing burrs from bolt holes, a center hole, spoke edges and transverse corners, and simultaneously has the characteristics of high automation degree, high removal efficiency, advanced process, strong generality, and high safety and stability.

Wheel back cavity groove processing equipment is disclosed in the present application, which includes a lower lifting system, a central brush system, groove brush systems, a synchronous clamping and rotating system, a left brush system, a right brush system, an upper lifting system and the like. The wheel back cavity groove processing equipment not only may be used for removing burrs from wheel back cavity grooves, but also may be used for removing burrs from bolt holes, a center hole, spoke edges and transverse corners, and simultaneously has the characteristics of high automation degree, high removal efficiency, advanced process, strong generality, and high safety and stability.

A substrate processing apparatus includes: a first polishing head configured to polish a first surface of a substrate by sliding a polishing tool on the first surface; a second polishing head configured to polish the first surface of the substrate by sliding a polishing tool on the first surface, the second polishing head having a smaller diameter than a diameter of the first polishing head; and a substrate support mechanism configured to support the substrate by a fluid pressure at positions corresponding to the first polishing head and the second polishing head, the substrate support mechanism being configured to support the substrate from a second surface of the substrate opposite to the first surface.

An apparatus and a method which can perform different processes, such as polishing and cleaning, on a surface of a substrate, such as a wafer, with a single processing head, and can process the surface of the substrate efficiently are disclosed. The apparatus includes: a substrate holder configured to hold a substrate and rotate the substrate; and a processing head configured to bring scrubbing tapes into contact with a first surface of the substrate to process the first surface. The processing head includes: pressing members arranged to press the scrubbing tapes against the first surface of the substrate; position switching devices configured to be able to switch positions of the pressing members between processing positions and retreat positions; tape feeding reels configured to feed the scrubbing tapes, respectively; and tape take-up reels configured to take up the scrubbing tapes, respectively.

A polisher includes a wafer carrier, a polishing head, a movement mechanism, and a rotation mechanism. The wafer carrier has a supporting surface. The supporting surface is configured to carry a wafer thereon. The polishing head is present above the wafer carrier. The polishing head has a polishing surface. The polishing surface of the polishing head is smaller than the supporting surface of the wafer carrier. The movement mechanism is configured to move the polishing head relative to the wafer carrier. The rotation mechanism is configured to rotate the polishing head relative to the wafer carrier.

A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.

A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.

Disclosed herein are an apparatus of manufacturing a panel for home appliance by performing uniform surface processing on the panel and a method of manufacturing a home appliance by performing uniform surface processing on a panel. The apparatus of manufacturing a panel for home appliance includes a contacting roller configured to perform surface-processing on a panel that is to be processed; a pressing roller configured to press the panel toward the contacting roller; and a supporting roller configured to support a center middle portion of the contacting roller.