Patent classifications
B24B31/116
Additive manufacturing for radio frequency hardware
A method and apparatus is presented. A structure having an interior channel is formed using additive manufacturing equipment. A viscous media containing abrasive particles is sent through the interior channel using abrasive flow machining equipment to form a desired surface roughness for the interior channel.
Systems and methods for polishing airfoils
A sleeve may be configured to secure an airfoil cluster for polishing. The sleeve may include a mock airfoil and a bypass flow path between the mock airfoil and an end wall of the sleeve. The sleeve may be positioned in an annular ring of sleeves in a polishing apparatus. The polishing apparatus may comprise an annular flow path for an abrasive fluid. The abrasive fluid may be flowed through the annular ring of sleeves in order to polish the airfoil cluster.
Systems and methods for polishing airfoils
A sleeve may be configured to secure an airfoil cluster for polishing. The sleeve may include a mock airfoil and a bypass flow path between the mock airfoil and an end wall of the sleeve. The sleeve may be positioned in an annular ring of sleeves in a polishing apparatus. The polishing apparatus may comprise an annular flow path for an abrasive fluid. The abrasive fluid may be flowed through the annular ring of sleeves in order to polish the airfoil cluster.
Chamber components with polished internal apertures
Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.
Chamber components with polished internal apertures
Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.
A METHOD AND APPARATUS FOR FINISHING A SURFACE OF A COMPONENT
A method and apparatus for finishing a surface of a component. The method includes installing the component in an apparatus configured to deliver a flow of abrasives to the surface and to generate cavitation bubbles in a liquid contacting the surface using a cavitation generator that includes an ultrasonic generator configured to generate cavitation bubbles in the liquid contacting the surface by ultrasonic excitation in the liquid or a laser configured to generate cavitation bubbles in the liquid contacting the surface by laser excitation in the liquid; controlling the cavitation generator such that cavitation bubbles are generated to finish the surface by implosion of the cavitation bubbles; and controlling the flow of slurry to the surface so as to finish the surface by abrasion. An apparatus for finishing a surface of a component is also disclosed.
A METHOD AND APPARATUS FOR FINISHING A SURFACE OF A COMPONENT
A method and apparatus for finishing a surface of a component. The method includes installing the component in an apparatus configured to deliver a flow of abrasives to the surface and to generate cavitation bubbles in a liquid contacting the surface using a cavitation generator that includes an ultrasonic generator configured to generate cavitation bubbles in the liquid contacting the surface by ultrasonic excitation in the liquid or a laser configured to generate cavitation bubbles in the liquid contacting the surface by laser excitation in the liquid; controlling the cavitation generator such that cavitation bubbles are generated to finish the surface by implosion of the cavitation bubbles; and controlling the flow of slurry to the surface so as to finish the surface by abrasion. An apparatus for finishing a surface of a component is also disclosed.
Impeller manufacturing method and impeller flow path elongation jig
An impeller manufacturing method includes: integrally forming an impeller by an additive manufacturing method using a metal powder, the impeller including a disk which has a disk shape about an axis, a plurality of blades which are formed on a surface facing a first side in an axial direction of the disk with gaps therebetween in a circumferential direction about the axis, and a cover which covers the plurality of blades from the first side in the axial direction; processing the integrally formed impeller by a hot isostatic pressing; and causing a polishing fluid containing abrasive grains to flow through a flow path formed between the disk, the cover, and the blades in the impeller after the processing with the hot isostatic pressing and while pressurizing the polishing fluid to perform fluid polishing.
Impeller manufacturing method and impeller flow path elongation jig
An impeller manufacturing method includes: integrally forming an impeller by an additive manufacturing method using a metal powder, the impeller including a disk which has a disk shape about an axis, a plurality of blades which are formed on a surface facing a first side in an axial direction of the disk with gaps therebetween in a circumferential direction about the axis, and a cover which covers the plurality of blades from the first side in the axial direction; processing the integrally formed impeller by a hot isostatic pressing; and causing a polishing fluid containing abrasive grains to flow through a flow path formed between the disk, the cover, and the blades in the impeller after the processing with the hot isostatic pressing and while pressurizing the polishing fluid to perform fluid polishing.
Chamber components with polished internal apertures
Disclosed herein is a plasma-resistant chamber component and a method for manufacturing the same. A plasma-resistant chamber component of a semiconductor processing chamber that generates a plasma environment includes a ceramic article having multiple polished apertures. A roughness of the multiple polished apertures is less than 32 μin.