A sizing device in a polishing apparatus for measuring a thickness of a wafer in course of polishing by laser beam interference, includes: a light-source for irradiating the wafer in course of polishing with a laser beam, a light-receiving portion for receiving reflected light from the wafer in course of polishing irradiated with the laser beam from the light-source, a calculating part for calculating a measured value of the thickness of the wafer in course of polishing irradiated with the laser beam based on the reflected light received through the light-receiving portion. The calculating part can calculate the wafer thickness in course of polishing by calculating a measuring error value of the wafer thickness in course of polishing from resistivity of the wafer in course of polishing based on a previously determined correlation between wafer resistivity and measuring error value of wafer thickness, and by compensating the measuring error value.

A method for decontaminating support surfaces of a wafer chuck entails lightly passing a treatment tool having a nominally flat contacting surface over the regions of the chuck where contaminants are to be removed. The treatment tool and the chuck surface may have about the same hardness. The treatment tool may be constrained so that it may conform to the surface being processed. When the treatment tool is contacted to a flat surface, the area of contact may be in the form of a circle, ring or annulus. At application pressures, the treatment tool will abrade the chuck, which here is to be avoided, or at least minimized. Thus, the instant inventors have discovered that the same treatment tool that is used to engineer the elevation profile of the resurface, and its roughness, at lower application pressures can be used to remove grinding debris and other contaminants from the surface.

A method is provided for manufacturing a magneto-resistive device, comprising the steps of: extracting at least one subset of bars from at least one bar section of a wafer; obtaining a magnetic performance of the at least one subset of the bars; determining an angle based on the magnetic performance; and processing remaining bars from the at least one bar section of the wafer based on the determined angle.

A method is provided for manufacturing a magneto-resistive device, comprising the steps of: extracting at least one subset of bars from at least one bar section of a wafer; obtaining a magnetic performance of the at least one subset of the bars; determining an angle based on the magnetic performance; and processing remaining bars from the at least one bar section of the wafer based on the determined angle.

A grinder for grinding an end face of a fiber includes a housing, a fiber fixing module, a base, a transmission shaft, and a grinding pad. The housing includes an annular rack wheel with an internal engaging teeth. The fiber fixing module is positioned on a top of the housing. The base is positioned at a bottom of the housing and includes an eccentric connection portion. An end of the transmission shaft is connected to the connection portion. The transmission shaft is sleeved with an annular pinion having external engaging teeth engaging with the internal engaging teeth. The grinding pad is connected to another end of the transmission shaft and revolves around the rotation axis of the base and rotates around its own rotation axis together with the transmission shaft and matches an end face of a to-be-ground fiber penetrating the fiber fixing module.

A grinder for grinding an end face of a fiber includes a housing, a fiber fixing module, a base, a transmission shaft, and a grinding pad. The housing includes an annular rack wheel with an internal engaging teeth. The fiber fixing module is positioned on a top of the housing. The base is positioned at a bottom of the housing and includes an eccentric connection portion. An end of the transmission shaft is connected to the connection portion. The transmission shaft is sleeved with an annular pinion having external engaging teeth engaging with the internal engaging teeth. The grinding pad is connected to another end of the transmission shaft and revolves around the rotation axis of the base and rotates around its own rotation axis together with the transmission shaft and matches an end face of a to-be-ground fiber penetrating the fiber fixing module.

A grinder for grinding an end face of a fiber includes a housing, a fiber fixing module, a base, a transmission shaft, and a grinding pad. The housing includes an annular rack wheel with an internal engaging teeth. The fiber fixing module is positioned on a top of the housing. The base is positioned at a bottom of the housing and includes an eccentric connection portion. An end of the transmission shaft is connected to the connection portion. The transmission shaft is sleeved with an annular pinion having external engaging teeth engaging with the internal engaging teeth. The grinding pad is connected to another end of the transmission shaft and revolves around the rotation axis of the base and rotates around its own rotation axis together with the transmission shaft and matches an end face of a to-be-ground fiber penetrating the fiber fixing module.

A grinder for grinding an end face of a fiber includes a housing, a fiber fixing module, a base, a transmission shaft, and a grinding pad. The housing includes an annular rack wheel with an internal engaging teeth. The fiber fixing module is positioned on a top of the housing. The base is positioned at a bottom of the housing and includes an eccentric connection portion. An end of the transmission shaft is connected to the connection portion. The transmission shaft is sleeved with an annular pinion having external engaging teeth engaging with the internal engaging teeth. The grinding pad is connected to another end of the transmission shaft and revolves around the rotation axis of the base and rotates around its own rotation axis together with the transmission shaft and matches an end face of a to-be-ground fiber penetrating the fiber fixing module.

Ultrasonic polishing systems and methods of polishing brittle components for electronic devices using ultrasonic polishing systems are disclosed. The ultrasonic polishing system may include an ultrasonic driver and a polishing head operatively coupled to the ultrasonic driver. The ultrasonic drive may have a surface shape that corresponds to a non-planar feature formed in the brittle component. The ultrasonic polishing system may also include an abrasive slurry configured to be disposed between the non-planar feature of the brittle component and the polishing head. The ultrasonic driver may be configured to displace the polishing head toward and away from the non-planar feature formed in the brittle component.

Ultrasonic polishing systems and methods of polishing brittle components for electronic devices using ultrasonic polishing systems are disclosed. The ultrasonic polishing system may include an ultrasonic driver and a polishing head operatively coupled to the ultrasonic driver. The ultrasonic drive may have a surface shape that corresponds to a non-planar feature formed in the brittle component. The ultrasonic polishing system may also include an abrasive slurry configured to be disposed between the non-planar feature of the brittle component and the polishing head. The ultrasonic driver may be configured to displace the polishing head toward and away from the non-planar feature formed in the brittle component.