Provided is a double-sided polishing method of a wafer in which the wafer, which has been set in a wafer loading hole of the carrier, is compressed and held along with the carrier with an upper platen and a lower platen and the upper platen and the lower platen are rotated while supplying slurry to the wafer. The method includes: previously measuring an inclination value of a main surface of each of a plurality of carriers in the vicinity of the edge of the wafer loading hole; selecting, from among the plurality of carriers, those for which the inclination value is equal to or smaller than a threshold based on the measurement results of the inclination value; and applying the double-sided polishing to a wafer using the selected carrier.

Provided is a double-sided polishing method of a wafer in which the wafer, which has been set in a wafer loading hole of the carrier, is compressed and held along with the carrier with an upper platen and a lower platen and the upper platen and the lower platen are rotated while supplying slurry to the wafer. The method includes: previously measuring an inclination value of a main surface of each of a plurality of carriers in the vicinity of the edge of the wafer loading hole; selecting, from among the plurality of carriers, those for which the inclination value is equal to or smaller than a threshold based on the measurement results of the inclination value; and applying the double-sided polishing to a wafer using the selected carrier.

An inner-periphery-side cutoff part where a polishing surface of an upper plate inclines upward toward an inner periphery part of the upper plate and an inner-periphery-side cutoff part where a polishing surface of a lower plate inclines downward toward an inner periphery part of the lower plate are respectively formed on the respective inner periphery parts of the upper plate and the lower plate, or an outer-periphery-side cutoff part where the polishing surface of the upper plate inclines upward toward an outer periphery part of the upper plate and an outer-periphery-side cutoff part where the polishing surface of the lower plate inclines downward toward an outer periphery part of the lower plate are respectively formed on the respective outer periphery parts of the upper plate and the lower plate, or all of them are formed thereon.

An inner-periphery-side cutoff part where a polishing surface of an upper plate inclines upward toward an inner periphery part of the upper plate and an inner-periphery-side cutoff part where a polishing surface of a lower plate inclines downward toward an inner periphery part of the lower plate are respectively formed on the respective inner periphery parts of the upper plate and the lower plate, or an outer-periphery-side cutoff part where the polishing surface of the upper plate inclines upward toward an outer periphery part of the upper plate and an outer-periphery-side cutoff part where the polishing surface of the lower plate inclines downward toward an outer periphery part of the lower plate are respectively formed on the respective outer periphery parts of the upper plate and the lower plate, or all of them are formed thereon.

The invention relates to an assembly for loading parts to be treated into a single-side or double-side treatment machine, comprising—a part holder in the form of a plate for holding at least one part to be treated, comprising a second side and first side, said first side being flat, and said part holder delimiting at least one through-hole forming a cell for housing at least one part to be treated, and a film mounted on the first side of the part holder opposite said through-hole, allowing said part to be treated to be held at least during the loading step.

The invention relates to an assembly for loading parts to be treated into a single-side or double-side treatment machine, comprising—a part holder in the form of a plate for holding at least one part to be treated, comprising a second side and first side, said first side being flat, and said part holder delimiting at least one through-hole forming a cell for housing at least one part to be treated, and a film mounted on the first side of the part holder opposite said through-hole, allowing said part to be treated to be held at least during the loading step.

A machine tool includes a first support disk and a first working disk. The first working disk defines a clamping surface and is fastened to the first support disk. A counter bearing element is positioned relative to the first working disk such that a working gap is formed between the first working disk and the counter bearing element and is dimensioned to accept a flat workpiece. A first clamping arrangement clamps the clamping surface of the first working disk to the first support disk such that the clamping surface faces away from the working gap. At least one decoupling element is positioned to at least one decoupling element configured to reduce friction between the first support disk and the first working disk.

A machine tool includes a first support disk and a first working disk. The first working disk defines a clamping surface and is fastened to the first support disk. A counter bearing element is positioned relative to the first working disk such that a working gap is formed between the first working disk and the counter bearing element and is dimensioned to accept a flat workpiece. A first clamping arrangement clamps the clamping surface of the first working disk to the first support disk such that the clamping surface faces away from the working gap. At least one decoupling element is positioned to at least one decoupling element configured to reduce friction between the first support disk and the first working disk.

A method for double-side polishing a wafer uses a double-side polishing machine wherein a carrier which is yet to be arranged in the double-side polishing machine is previously subjected to two-stage double-side polishing which uses a double-side polishing machine different from the double-side polishing machine adopted for double-side polishing the wafer and includes primary polishing using slurry containing abrasive grains and secondary polishing using an inorganic alkali solution containing no abrasive grain, the carrier subjected to the two-stage double-side polishing is arranged in the double-side polishing machine adopted for double-side polishing the wafer, and the double-side polishing of the wafer is performed. Consequently, the method for double-side polishing a wafer enables suppressing damages to wafers to be polished immediately after arranging the carrier between the upper and lower turntables.

A method for double-side polishing a wafer uses a double-side polishing machine wherein a carrier which is yet to be arranged in the double-side polishing machine is previously subjected to two-stage double-side polishing which uses a double-side polishing machine different from the double-side polishing machine adopted for double-side polishing the wafer and includes primary polishing using slurry containing abrasive grains and secondary polishing using an inorganic alkali solution containing no abrasive grain, the carrier subjected to the two-stage double-side polishing is arranged in the double-side polishing machine adopted for double-side polishing the wafer, and the double-side polishing of the wafer is performed. Consequently, the method for double-side polishing a wafer enables suppressing damages to wafers to be polished immediately after arranging the carrier between the upper and lower turntables.