A grinding apparatus includes a holding unit including a holding table having a holder for holding a workpiece and a grinding water suction part for drawing in grinding water outside of the holder, a rotational shaft having an end fixed centrally to a bottom surface of the holding table, a tubular rotary joint surrounding the rotational shaft, and a motor rotating the rotational shaft about its own axis. The rotational shaft has a first suction channel held in fluid communication with the holder of the holding table and a second suction channel held in fluid communication with the grinding water suction part. The rotary joint has a communication channel by which the first suction channel and the second suction channel are held in fluid communication with at least a suction source.

A grinding apparatus includes a holding unit including a holding table having a holder for holding a workpiece and a grinding water suction part for drawing in grinding water outside of the holder, a rotational shaft having an end fixed centrally to a bottom surface of the holding table, a tubular rotary joint surrounding the rotational shaft, and a motor rotating the rotational shaft about its own axis. The rotational shaft has a first suction channel held in fluid communication with the holder of the holding table and a second suction channel held in fluid communication with the grinding water suction part. The rotary joint has a communication channel by which the first suction channel and the second suction channel are held in fluid communication with at least a suction source.

A chemical mechanical polishing system includes a chuck assembly that has a chuck to hold a substrate, a motor to rotate the chuck about a first axis, and a pad carrier assembly. The pad carrier assembly includes a support that is movably along a radial direction relative to the first axis, a lateral actuator coupled the support to cause the support to move along the radial direction, a support arm extending from the support over the chuck, a pad carrier suspended from the support arm, the pad carrier configured to receive and hold a polishing pad, and a flexible membrane secured to the support arm to form a plurality of individually pressurizable chambers between the pad carrier and the support arm such that variation of a pressure difference between the chambers adjusts a radial distribution of pressure on the pad carrier.

A chemical mechanical polishing system includes a chuck assembly that has a chuck to hold a substrate, a motor to rotate the chuck about a first axis, and a pad carrier assembly. The pad carrier assembly includes a support that is movably along a radial direction relative to the first axis, a lateral actuator coupled the support to cause the support to move along the radial direction, a support arm extending from the support over the chuck, a pad carrier suspended from the support arm, the pad carrier configured to receive and hold a polishing pad, and a flexible membrane secured to the support arm to form a plurality of individually pressurizable chambers between the pad carrier and the support arm such that variation of a pressure difference between the chambers adjusts a radial distribution of pressure on the pad carrier.

A polishing apparatus includes a spindle having a grinder wheel in a lower portion of the spindle, a housing surrounding the spindle, and a movable damper, wherein the movable damper includes a lower bracket provided between a perimeter of the spindle and an inner perimeter of the housing, wherein the spindle passes through the lower bracket, an upper bracket apart from the lower bracket in a vertical direction and provided above the lower bracket, and a first damper provided between the upper bracket and the lower bracket and between the spindle and the housing and configured to move along the lower bracket, wherein the first damper includes a damper plate including an inner plate and an outer plate, an elastic member, and an expander.

A polishing apparatus includes a spindle having a grinder wheel in a lower portion of the spindle, a housing surrounding the spindle, and a movable damper, wherein the movable damper includes a lower bracket provided between a perimeter of the spindle and an inner perimeter of the housing, wherein the spindle passes through the lower bracket, an upper bracket apart from the lower bracket in a vertical direction and provided above the lower bracket, and a first damper provided between the upper bracket and the lower bracket and between the spindle and the housing and configured to move along the lower bracket, wherein the first damper includes a damper plate including an inner plate and an outer plate, an elastic member, and an expander.