The method for producing a textured plated steel sheet includes: a plating layer forming process of forming a plating layer on a surface of a steel sheet a grinding process of grinding a surface of the plating layer to form a texture on the surface of the plating layer; a plating thickness determining process of determining first plating thickness information relating to a thickness of the plating layer at a time that is after the plating layer forming process and is before the grinding process, and second plating thickness information relating to a thickness of the plating layer after the grinding process; and an adjusting process of adjusting the plating amount of the plating layer formed in the plating layer forming process, and the grinding amount of the surface of the plating layer that is ground in the grinding process, based on the first and second plating thickness information.

The method for producing a textured plated steel sheet includes: a plating layer forming process of forming a plating layer on a surface of a steel sheet a grinding process of grinding a surface of the plating layer to form a texture on the surface of the plating layer; a plating thickness determining process of determining first plating thickness information relating to a thickness of the plating layer at a time that is after the plating layer forming process and is before the grinding process, and second plating thickness information relating to a thickness of the plating layer after the grinding process; and an adjusting process of adjusting the plating amount of the plating layer formed in the plating layer forming process, and the grinding amount of the surface of the plating layer that is ground in the grinding process, based on the first and second plating thickness information.

A method for producing bearing components includes providing a first bearing component, a second bearing component, a first production line, and a second production line. The first production line has a first grinding machine, a first honing machine, a first measuring unit, and a first conveyor unit. The second production line has a second grinding machine, a second honing machine, and a second conveyor unit. The method also includes grinding and honing the first bearing component, measuring a first dimension of the first bearing component, grinding and honing the second bearing component, and combining the first bearing component and the second bearing component to form a roller bearing or a slide bearing. The first production line and the second production line are operated in a synchronized manner such that the second grinding machine or the second honing machine is operated under closed-loop control using the first dimension.

A method for producing bearing components includes providing a first bearing component, a second bearing component, a first production line, and a second production line. The first production line has a first grinding machine, a first honing machine, a first measuring unit, and a first conveyor unit. The second production line has a second grinding machine, a second honing machine, and a second conveyor unit. The method also includes grinding and honing the first bearing component, measuring a first dimension of the first bearing component, grinding and honing the second bearing component, and combining the first bearing component and the second bearing component to form a roller bearing or a slide bearing. The first production line and the second production line are operated in a synchronized manner such that the second grinding machine or the second honing machine is operated under closed-loop control using the first dimension.

A local polishing system comprises: a particle estimation unit (30) for estimating the film thickness distribution of a wafer; a local polishing region setting unit (11) for setting a local polishing region on the wafer based on the film thickness distribution; a polishing head selection unit (12) for selecting a polishing head based on the size of the local polishing region; a model storage (20) holding a recipe generating model that defines the relation between an input node and an output node, the input node being an attribute of the local polishing region, the output node comprising a recipe for a polishing process; a polishing recipe generator (13) that puts an attribute of the local polishing region set by the local polishing region setting unit (11) into the input node of the recipe generating model and determines a polishing recipe for polishing the local polishing region; and a polishing recipe transmitter (15) for transmitting data of the polishing recipe to a local polishing module (200) that performs local polishing.

A local polishing system comprises: a particle estimation unit (30) for estimating the film thickness distribution of a wafer; a local polishing region setting unit (11) for setting a local polishing region on the wafer based on the film thickness distribution; a polishing head selection unit (12) for selecting a polishing head based on the size of the local polishing region; a model storage (20) holding a recipe generating model that defines the relation between an input node and an output node, the input node being an attribute of the local polishing region, the output node comprising a recipe for a polishing process; a polishing recipe generator (13) that puts an attribute of the local polishing region set by the local polishing region setting unit (11) into the input node of the recipe generating model and determines a polishing recipe for polishing the local polishing region; and a polishing recipe transmitter (15) for transmitting data of the polishing recipe to a local polishing module (200) that performs local polishing.

A workpiece processing method includes a resin coating step of coating a resin on a front surface of a workpiece, a resin curing step of applying an ultraviolet ray to the coated resin to be cured, a resin grinding step of grinding the cured resin with grinding stones to be flattened, and a workpiece grinding step of holding the flattened resin side of the workpiece on a chuck table and grinding the back surface of the workpiece with grinding stones. In the resin grinding step, grinding is performed while cleaning the resin stuck to the grinding stones. Accordingly, it is possible to grind the resin coated on the front surface of the workpiece and the back surface of the workpiece in the same apparatus.

A workpiece processing method includes a resin coating step of coating a resin on a front surface of a workpiece, a resin curing step of applying an ultraviolet ray to the coated resin to be cured, a resin grinding step of grinding the cured resin with grinding stones to be flattened, and a workpiece grinding step of holding the flattened resin side of the workpiece on a chuck table and grinding the back surface of the workpiece with grinding stones. In the resin grinding step, grinding is performed while cleaning the resin stuck to the grinding stones. Accordingly, it is possible to grind the resin coated on the front surface of the workpiece and the back surface of the workpiece in the same apparatus.

A workpiece processing apparatus which coats a front surface of a workpiece with a resin, the workpiece having devices formed in regions demarcated by a plurality of planned dividing lines formed in a lattice manner. The workpiece processing apparatus includes a cassette mounting base mounted with a cassette housing a plurality of workpieces, a resin coating unit that coats the front surface of the workpiece with the resin, a resin curing unit that cures the resin by applying an external stimulus to the coated resin, a resin grinding unit that flattens the cured resin by grinding the cured resin by a rotating grinding stone, and a conveying mechanism that conveys the workpiece between the units.

A substrate polishing device includes a height detection unit configured to measure a surface height of a polishing member, and a cutting rate calculation unit configured to calculate a cutting rate of the polishing member based on the surface height. The cutting rate calculation unit corrects the current cutting rate based on the cutting rate calculated in the past when the calculated current cutting rate falls outside a search range.