The present disclosure includes a part hold-down assembly for retaining an oversized part. The part hold-down assembly is aligned along a central force axis and applies a downward force onto the part. The part-hold down assembly includes a top plate, a bottom plate, and a compression assembly extending between the top and bottom plates. The compression assembly includes two, parallel biasing assemblies that extend along compression axes that are parallel to but offset from the central force axis. Each biasing assembly including an upper collar, a lower collar and a resilient biasing member, in one embodiment in the form of a coil spring, retained between the upper and lower collar. The parallel biasing assemblies are positioned on opposite sides from each other about the central force axis, and may be spaced away from the central force axis an equal distance.

A thermal spraying device includes an electric arc spraying device, a rotatable worktable, spraying tools, wire placing racks and a master controller. The electric arc spraying device is arranged at a periphery of a rotatable worktable, the spraying tools are arranged on the rotatable worktable in a circumference direction, and each of the spraying tools is driven to rotate by a motor. The wire placing racks are arranged at an outside of the rotatable worktable, and each of the wire placing racks corresponds to one electric arc spraying device. The master controller is connected to the rotatable worktable to control the rotatable worktable. Compared with a handheld electric arc spraying gun, the spraying efficiency and the stability of the spraying quality are improved. A thermal spraying device having the electric arc spraying device is further provided. A thermal spraying system and a thermal spraying technology are further provided

A polishing method includes: a step of preparing a polishing device including a processing member and a suction mechanism configured to generate suction force; a step of setting a workpiece in the processing member; and a step of accelerating abrasive grains fed toward the workpiece to a predetermined speed with an air flow generated by operation of the suction mechanism, and polishing the workpiece by causing the abrasive grains to contact with or collide with the workpiece.

A polishing method includes: a step of preparing a polishing device including a processing member and a suction mechanism configured to generate suction force; a step of setting a workpiece in the processing member; and a step of accelerating abrasive grains fed toward the workpiece to a predetermined speed with an air flow generated by operation of the suction mechanism, and polishing the workpiece by causing the abrasive grains to contact with or collide with the workpiece.

The present invention relates to an apparatus and a method for shot peening a coil spring, and to a continuous shot peening apparatus and method for a coil spring, in which a coil spring revolves and rotates at the same time during shot peening processing to enable more uniform processing of the coil spring, and a shot peening process and a preparing process thereof are simultaneously performed through simultaneous rotation of a housing in a processing position and a housing in a preparation position, so that the inventive apparatus and method require a simpler configuration and a smaller work space for a shot peening process than those of the prior arts and can perform shot peening of many coil springs in a short period of time.

The present invention relates to an apparatus and a method for shot peening a coil spring, and to a continuous shot peening apparatus and method for a coil spring, in which a coil spring revolves and rotates at the same time during shot peening processing to enable more uniform processing of the coil spring, and a shot peening process and a preparing process thereof are simultaneously performed through simultaneous rotation of a housing in a processing position and a housing in a preparation position, so that the inventive apparatus and method require a simpler configuration and a smaller work space for a shot peening process than those of the prior arts and can perform shot peening of many coil springs in a short period of time.

Provided is a shot-blasting apparatus which is capable of efficiently perform dust collection and ventilation of an inside of a projection chamber, even using a dust collector having a small-size and low-cost suction device. The shot-blasting apparatus comprises: a cabinet (10); a plurality of process chambers (13a, 13b) provided inside the cabinet in such a manner that each of the process chambers is capable of housing a workpiece therein and selectively movable between a carry-in-and-out position and a projection position; an air inlet port (19) for introducing external air into each of the process chambers therethrough; and an air outlet port provided at a position opposed to the air inlet port across the process chamber set at the projection position, and linearly communicated with an internal space of the process chamber set at the projection position, wherein, according to suction from the air outlet port, air is caused to flow from the air inlet port into the process chamber set at the projection position, and led to the air outlet port while passing through the process chamber set at the projection position.

Provided is a shot-blasting apparatus which is capable of efficiently perform dust collection and ventilation of an inside of a projection chamber, even using a dust collector having a small-size and low-cost suction device. The shot-blasting apparatus comprises: a cabinet (10); a plurality of process chambers (13a, 13b) provided inside the cabinet in such a manner that each of the process chambers is capable of housing a workpiece therein and selectively movable between a carry-in-and-out position and a projection position; an air inlet port (19) for introducing external air into each of the process chambers therethrough; and an air outlet port provided at a position opposed to the air inlet port across the process chamber set at the projection position, and linearly communicated with an internal space of the process chamber set at the projection position, wherein, according to suction from the air outlet port, air is caused to flow from the air inlet port into the process chamber set at the projection position, and led to the air outlet port while passing through the process chamber set at the projection position.

A shot processing apparatus according to an aspect includes: a projector; a set table configured to support the workpiece from below and be rotatable about an axis; a retaining mechanism including a retainer opposed to the set table with the workpiece interposed, the retainer being configured to be rotatable about the axis and movable in a direction of the axis; a rotational force driver configured to apply rotational force to the retainer through a transmission mechanism; and a lifting mechanism including a pressing holder capable of being lifted and lowered above the retaining mechanism, the lifting mechanism being at a distance from the retaining mechanism when the pressing holder is located above a reference height, the lifting mechanism applying pressing force to the workpiece through the retainer when the pressing holder is located below the reference height.

A shot processing apparatus according to an aspect includes: a projector; a set table configured to support the workpiece from below and be rotatable about an axis; a retaining mechanism including a retainer opposed to the set table with the workpiece interposed, the retainer being configured to be rotatable about the axis and movable in a direction of the axis; a rotational force driver configured to apply rotational force to the retainer through a transmission mechanism; and a lifting mechanism including a pressing holder capable of being lifted and lowered above the retaining mechanism, the lifting mechanism being at a distance from the retaining mechanism when the pressing holder is located above a reference height, the lifting mechanism applying pressing force to the workpiece through the retainer when the pressing holder is located below the reference height.