Provided is a blade dicing device for wafers that cuts (dices) a wafer with the grit on a cutting blade and separates the wafer into individual chips, and that can minimize process defects when dicing compound semiconductor wafers made of high-hardness materials such as SiC. The device includes a body, a cutting blade protruding from the outer periphery of the body, and grit bonded and attached to the outer periphery of the cutting blade and cutting a wafer, wherein the length of the grit is 2 m to 4 m.