Disclosed herein is a grinding tool, which includes a plate, a plurality of holders formed on the plate and having sliding grooves, a shoe coupled to the sliding groove of each of the holders, and grinding tips arranged on the shoe. The shoe includes a fastening part fastened to the sliding groove, and an upper plate part formed on the fastening part and located on an upper surface of the holder outside the sliding groove. The shoe can be fastened to the holder in two or more directions, and the grinding tips can be arranged in two or more forms when viewed from the plane.

A tool (U) for polishing and/or lapping stone material surfaces, comprising a member (1) made of abrasive material, a support member (2) for handling said tool (U), a cushioning layer (3) arranged between said abrasive member (1) and said support member (2); also provided are attachment and fixing means (F) to firmly and removably secure said abrasive member (1), support member (2) and cushioning layer (3) to each other.

An apparatus for abrading a surface is provided. The apparatus includes: a framework with a motor housed therein; a chassis housing a drivetrain, the drivetrain including a drive pulley operative connected to the motor, a plurality of tool assembly pulleys, a belt operatively connecting the drive pulley and the plurality of tool assembly pulleys; a plurality of tool assemblies operatively connected to the drive pulley and the plurality of tool assembly pulleys, each tool assembly including: a tool holder, a tool plate comprising a tool segment with an abrading surface, wherein the tool holder and tool plate are detachably connected by a plurality of equidistantly spaced pins, wherein the number of pins is a multiple of three.

A recycle grinding device is provided. A grinding device for cleaning probes includes a placement platform and a grinding block. The grinding block is located in the placement space. The grinding block includes a base layer and a grinding layer. The grinding layer covers the base layer and is integrally formed with the base layer, wherein the thickness of the grinding layer is greater than or equal to 1 millimeter. Therefore, the invention provides users with convenient cleaning, reduced replacement frequency, and improved performance and quality.

A grinding head assembly for a floor processing machine includes a plate that has a first side that has a tool attachment surface and a second side opposite the first side. A plurality of lippage adapters are attached to the second side of the plate. The plurality of lippage adapters each include a base portion that have a tool contact surface partially surrounded at a perimeter wall and are removably attached to the second side of the plate with at least one fastener. Each of the plurality of lippage adapters includes at least one magnet fixed to the base portion.

A floor polishing or grinding pad assembly is provided. In one aspects a polishing or grinding pad assembly employs a flexible pad, a reinforcement layer or ring, and multiple floor-contacting tools such as disks. In yet another aspect, at least one of the floor-contacting tools has a workpiece-contacting bottom plane having angle offset from that of a base surface of the tool, a flexible pad and/or a flexible reinforcement layer. A further aspect employs a smaller set of disks alternating between and/or offset from a larger set of the disks.

An abrasive segment can include an inner segment portion, an outer segment portion, and a central segment portion connected thereto. The inner segment portion can include an inner circumferential wall and an outer circumferential wall. Leading and trailing radial sidewalls can extend between the inner circumferential wall and the outer circumferential wall opposite each other. The outer segment portion can include an inner circumferential wall and an outer circumferential wall. Leading and trailing radial sidewalls can extend between the inner circumferential wall and the outer circumferential wall opposite each other. The central segment portion can include a leading radial sidewall and a trailing radial sidewall. The leading radial sidewall of the central segment portion can establish an acute angle, , with respect to the outer circumferential wall of the inner segment portion and an obtuse angle, , with respect the inner circumferential wall of the outer segment portion.

An abrasive segment can include an inner segment portion, an outer segment portion, and a central segment portion connected thereto. The inner segment portion can include an inner circumferential wall and an outer circumferential wall. Leading and trailing radial sidewalls can extend between the inner circumferential wall and the outer circumferential wall opposite each other. The outer segment portion can include an inner circumferential wall and an outer circumferential wall. Leading and trailing radial sidewalls can extend between the inner circumferential wall and the outer circumferential wall opposite each other. The central segment portion can include a leading radial sidewall and a trailing radial sidewall. The leading radial sidewall of the central segment portion can establish an acute angle, , with respect to the outer circumferential wall of the inner segment portion and an obtuse angle, , with respect the inner circumferential wall of the outer segment portion.

A conditioning disk with microfeatures is described. More specifically, a conditioning disk with at least one discrete abrasive element and at least one microfeature. The asymmetry of the at least one microstructure may enable, based on orientation, a wide range of pad polishing parameters, such as surface roughness and pad wear rate.