A buffing pad having a front surface portion, a moisture barrier upon which the front surface is disposed, a compressible foam portion disposed below the moisture barrier, and a rear surface. The front surface portion has a plurality of indentations formed by RF welding and the rear surface has an attachment portion capable of attaching the buffing pad to a power tool. Methods of manufacturing and using a buffing pad.

A brush assembly is provided for increasing an effective area and uniformity of performance in an abrasive floor polishing application at a given size of brush mount. The brush assembly includes a pad with slots for receiving abrasive blades. The pad includes variable protrusions to provide varied support to the abrasive blades. The blades have a trapezoidal body shape. The blades include abrading components including an abrasive material such as diamonds. In some embodiments, the abrading components include a metallic material, such as copper material. In some embodiments, the abrading components include a phenolic material.

Abrasive articles are disclosed comprising at least one primary elongate abrasive element extending along an element axis. The primary elongate abrasive element comprises a plurality of formed abrasive particles, wherein at least 50% of the formed abrasive particles are orientationally aligned along the element axis.

A polishing pad conditioning apparatus includes a base, a fiber, and a polymer protruding from a surface of the base and encompassing the fiber.

A polishing pad conditioning apparatus includes a base, a fiber, and a polymer protruding from a surface of the base and encompassing the fiber.

A modified honing brush is provided comprising one or more bristles and one or a plurality of reusable stackable plates having one or more holes or voids located in the plates, or one or more support guides, and wherein each of the bristles is independently fitted through one or more of the holes or voids of the plates or surrounded by one or more support guides.

A substrate processing brush according to some embodiments of the present disclosure is provided. The substrate processing brush includes a holder; a substrate processing pad detachably disposed in the holder, processing the substrate; and a substrate processing sweeper connected to the holder, processing the substrate together with the substrate processing pad, wherein a first portion of the substrate processing pad is disposed inside the holder, and a second portion of the substrate processing pad is protruded to the outside of the holder by passing through one surface of the holder, and the substrate processing sweeper is connected to one surface of the holder so that it is to be adjacent to the second portion of the substrate processing pad protruded to the outside of the holder, and is extended from one surface of the holder.

A wire-shaped grinding element (10A, 10B) is used as a grinding element for a polishing brush. The wire-shaped grinding element (10A, 10B) includes inorganic filaments and a resin that impregnates the inorganic filaments and is cured. The inorganic filaments contain 80 to 90% by weight of an alumina component and 20 to 10% by weight of a silica component. The crystal structure of the inorganic filaments includes intermediate alumina. The silica component is in an amorphous state. The BET specific surface area of the inorganic filaments is 30 m.sup.2/g or smaller.