A SiC wafer producing method produces an SiC wafer from a single crystal SiC ingot. The method includes a separation layer forming step of setting a focal point of a pulsed laser beam having a transmission wavelength to single crystal SiC inside the ingot at a predetermined depth from an end surface of the ingot, the predetermined depth corresponding to the thickness of the wafer to be produced, and next applying the pulsed laser beam to the ingot, thereby forming a plurality of modified portions on a c-plane present in the ingot at the predetermined depth and also forming cracks isotropically on the c-plane so as to extend from each modified portion, each modified portion being a region where SiC has been decomposed into Si and C, the modified portions and the cracks constituting a separation layer along which the wafer is to be separated from the ingot.

Provided is a cutting method of cutting a workpiece by using a cutting apparatus including a chuck table configured to hold the workpiece and a cutting unit having a cutting blade configured to cut the workpiece held by the chuck table and an ultrasonic vibrator configured to ultrasonically vibrate the cutting blade in a radial direction of the cutting blade. The cutting method includes a holding step of holding the workpiece by the chuck table, and a cutting step of performing ultrasonic cutting that cuts the workpiece by the cutting blade vibrated ultrasonically and normal cutting that cuts the workpiece by the cutting blade not vibrated ultrasonically on the same cutting line of a plurality of cutting lines set on the workpiece.

This application relates to a method and system for cutting a brittle body. In one aspect, the method includes preparing a brittle body having a rotary shaft. The method may also include forming a scribing line by irradiating laser on the brittle body along a preset route by using a laser irradiation unit. The method may further include cutting the brittle body by bringing a vibration unit that vibrates at a preset frequency in contact with a first region of the brittle body, which is spaced apart from the scribing line.

An ultrasonic cutting blade includes a first end, a second end, and a curved body. The curved body extends between the first end and the second end. The curved body includes a first edge that is configured to contact a workpiece for performing a cutting operation on the workpiece. The curved body includes a radius of curvature that varies between a minimum radius of curvature and a maximum radius of curvature.

A system is disclosed for use in additively manufacturing a composite structure. The system may include a head having a nozzle configured to discharge a composite material, including a matrix and a continuous reinforcement. The system may also include a cure enhancer configured to enhance curing of the matrix, and a support configured to move the head during discharging to create a structure having a three-dimensional trajectory. The system may further include a cutting mechanism operatively mounted to at least one of the head and the support, and configured to sever the continuous reinforcement after discharge from the nozzle. The cutting mechanism may include a blade, and an ultrasonic energy source connected to the blade.

In one embodiment, systems and methods include using an ultrasonic cutter in a ground detection system to prevent damage to a substrate. The method of detecting a substrate comprises attaching a workpiece clamp to the substrate. The method further comprises cutting a layer of coating disposed on the substrate with an ultrasonic cutter, wherein the ultrasonic cutter operates at a frequency of about 20 kHz to about 40 kHz, wherein the layer of coating is non-conductive. The method further comprises contacting the substrate with the ultrasonic cutter.

A system is disclosed for use in additively manufacturing a composite structure. The system may include a head having a nozzle configured to discharge a composite material, including a matrix and a continuous reinforcement. The system may also include a cure enhancer configured to enhance curing of the matrix, and a support configured to move the head during discharging to create a structure having a three-dimensional trajectory. The system may further include a cutting mechanism operatively mounted to at least one of the head and the support, and configured to sever the continuous reinforcement after discharge from the nozzle. The cutting mechanism may include a blade, and an ultrasonic energy source connected to the blade.

Methods for measuring a resonance frequency of a tool set in ultrasonic vibration during the machining of a workpiece, involving radiating a working signal with a working frequency into a tool holder comprising a tool by a generator to produce the ultrasonic vibration of the tool; after the start of the machining of the workpiece, radiating a test signal with a test frequency varying by the working frequency and a lower power than the working signal power into the tool holder by the generator; generating a sensor signal from the ultrasonic vibration of the tool by a sensor apparatus arranged in the tool holder; reading out the sensor signal by a read-out apparatus; splitting the sensor signal into a frequency spectrum involving a main frequency and an auxiliary frequency by an analytical apparatus; determining the main frequency from the working frequency and the auxiliary frequency from the resonance frequency.

A device for processing a flexible sheet includes a worktop for placement thereon of a flexible sheet to be processed, a processing means provided above the worktop and positioning means for positioning the processing means on the flexible sheet and moving it along a straight processing line in the plane of the flexible sheet. The device also includes orientation means for setting the orientation of the processing line as desired.

The present disclosure describes an ultrasonic rotary molding system that is used to form edible compositions or food products as they move along a conveyor belt. The food products are formed by an ultrasonic rotary wheel that includes one or more cutting tools that cut, and perhaps three dimensionally mold, food product strips. The system may include a movable backing plate that is located below the point where the ultrasonic rotary wheel cuts the food product strips. The movable backing plate may be spring loaded and it may exert force upwards against the conveyor belt and in turn against the food product.