B28D1/225

CUTTING SYSTEM FOR SLABS
20180361621 · 2018-12-20 ·

A cutting system (10; 10; 10) for slabs (50) which comprises: a longitudinal guide (20; 20; 20) comprising a pair of surfaces (23,24; 23,24; 23,24) opposite to each other, of which a lower surface (24; 24; 24) and an opposite upper surface (23; 23; 23); a suction cup (41; 41; 41) coupled to the lower surface (24; 24; 24) of the longitudinal guide (20; 20; 20) suitable to selectively adhere to a slab (50) and defining a contact surface of the longitudinal guide (20; 20; 20) on the slab (50); the longitudinal guide further comprising a pair of rails (231; 231; 231) parallel to each other coupled to the upper surface (23; 23; 23) of the longitudinal guide (20; 20; 20) and suitable for slidably coupling to a scoring slider (30; 30; 30). The rails (231; 231; 231) are arranged on opposite sides with respect to a median plane (A-A) of the suction cup (41; 41; 41) perpendicular to the contact surface thereof.

METHODS OF SEPARATING A GLASS WEB
20180346369 · 2018-12-06 ·

Methods of separating a glass web that is moving at a glass web velocity. The method includes exposing a separation path on the glass web to at least one laser beam spot that moves with a laser beam spot velocity vector that is equal to a glass web velocity vector in a conveyance direction. The method also includes creating a defect on the separation path while the separation path is under thermal stress from the laser beam spot, whereupon the glass web spontaneously separates along the separation path in response to the defect. In further examples, a glass web separation apparatus includes a first reflector that rotates such that a laser beam spot repeatedly passes along a separation path and a second reflector that rotates such that the laser beam spot moves in a conveyance direction of the glass web.

Simultaneous Break and Expansion System for Integrated Circuit Wafers
20180323105 · 2018-11-08 ·

Improved methods and apparatuses for singulating integrated circuit (IC) dies that reduce or eliminate die collisions and work well with very small dies. Embodiments simultaneously separate dies in two dimensions by utilizing a break and expansion system that avoids die collisions by maintaining IC die separation after singulation. Singulation is achieved by placing the joined dies of the wafer substrate on a dicing tape, scoring the wafer substrate between the joined dies, and imposing a bending action by pressing a curved surface against the scored wafer substrate, which also expands the wafer substrate by stretching the dicing tape. After breaking, an inner expansion grip ring is pressed into an outer expansion grip ring in a nested configuration so as to maintain the stretched state of the dicing tape after the curved surface is fully removed, thereby maintaining the dicing tape in tension and the singulated die in spaced apart relation.

Scoring and Slicing Apparatus

An apparatus for cutting a workpiece, the apparatus having a pair of spaced apart rails fixed to a handle, the rails extending away from the handle in a first direction, a guide carriage slidingly engaged with the rails, a blade carriage slidingly engaged with the rails between the handle and the guide carriage, a pair of runners for supporting the workpiece, one of the runners joined with the handle and a second one of the runners joined with the guide carriage, the runners extensive in a second direction non-parallel to the first direction, and a cutting blade engaged with the blade carriage in a position for cutting into the workpiece during relative movement between the apparatus and the workpiece. With the guide carriage adjusted for receiving the workpiece on the runners between the guide carriage and the handle, the blade carriage is adjusted to a location for severing the workpiece.

A CUTTING TOOL FOR A CERAMIC CUTTING DEVICE, A CUTTING-WHEEL HANDLE HOLDER, A CUTTING ASSEMBLY AND A CERAMIC CUTTING DEVICE
20180297237 · 2018-10-18 · ·

A cutting tool includes a cutting-wheel handle with an uniform cross-section with an outer contour including points arranged following two opposed straight rows and points arranged following one or more curved line segment of the edge of a circle enclosing an area into which the opposed straight rows lie and a cutting wheel mounted on the cutting-wheel handle to rotate along a rotation plane parallel or substantially parallel to the two opposed straight rows. A cutting-wheel handle holder has a body including a through hole for the insertion therethrough of the cutting-wheel handle, to a cutting assembly including the cutting tool and the cutting-wheel handle holder, and to a ceramic cutting device including the cutting assembly pivotably mounted to a support movably mounted on longitudinal guides mounted to a base.

CUTTING AND SEPARATING DEVICE APPLICABLE TO MANUAL CERAMIC CUTTERS
20180290335 · 2018-10-11 ·

The invention relates to a cutting and separating device applicable to manual ceramic cutters, comprising: a carriage; a collapsible handle with a cutting tool; a toothed part comprising a separator for separating ceramic parts; springs for holding the toothed part in an inoperative position as well as a toothed actuator in an engaged position with the toothed part; and a manual trigger element for disengaging the toothed actuator. The rotation of the handle past a pre-determined angle causes the engagement of the toothed actuator in the toothed part; the descending rotation causes the toothed actuator to rotate the toothed part until an operative position of the separator is reached; and the actuation of the trigger element causes the release of the toothed part and the return thereof to the inoperative position.

Device and method for cleaving
10065340 · 2018-09-04 · ·

A device and method for cleaving a sample includes: creating an indentation on a top surface of the sample by applying a downward force along a vertical axis, the axis arranging perpendicularly to the top surface of the sample; providing a breaking pin and arranging the breaking pin under the sample to touch the bottom surface of the sample at a position that is directly opposite from the indentation; and, applying a downward force on the sample by providing a left side and right side breaker pin wherein the downward force comprises a left-side downward force extended through the left-side breaker pin and right-side downward force through the right side breaker pin, further the pins that provide the left-side and right-side downward force are disposed on a breaker bar and arranged to be on opposite sides of a vertical axis that extends through the indentation on the top surface.

Dual angle guide for ceramic cutting machines
10059023 · 2018-08-28 · ·

A dual angle guide (3) for ceramic cutting machines (1) includes a base (16); first and second positioning elements (4, 5) disposed on the base; a sector (9) calibrated with fixed angles for each positioning element; a first fixed stop (11) and a second fixed stop (12) for locating the positioning elements at a chosen angle on the respective calibrated sector (9); and rotation elements (13) for rotating the positioning elements in such a way that the positioning elements make it possible to make cuts in the ceramic piece (10) at different angles. The cuts are made by a cutting tool mounted to a sliding carriage (6). Each of the first and second positioning elements is rotatable in both a clockwise direction and an anti-clockwise direction in order to facilitate the scoring and cutting of the ceramic piece at various angles.

Method for manufacturing glass plate and apparatus for manufacturing same

After a glass sheet (G) having a scribe line (S) formed thereon is placed on a placement table (10) and positioned so that the scribe line (S) is positioned in a bending stress applying portion (15) of the placement table (10), when the glass sheet (G) is split along the scribe line (S) by applying a bending stress to a formation region of the scribe line (S) by the bending stress applying portion (15), the glass sheet (G) is positioned by laying a resin sheet (9) under the glass sheet (G) on the placement table (10) and aligning one side (G1) of the glass sheet (G) extending in a direction along the scribe line (S) with marks (Ma to Nd) projected onto a protruding portion (9a) of the resin sheet (9) by laser markers (16a to 16d).

CUTTING AND SEPARATION HEAD FOR MANUAL CERAMICS CUTTERS
20180093393 · 2018-04-05 · ·

A cutting and separation head for manual ceramic cutters, including a body that carries a grip handle and a cutting tool, mounted on movable supports on longitudinal guides of the cutter, and able to rotate with respect to a first transverse rotary shaft; a separator provided with a foot, a class 1 lever, and a first coupling element in the separator that is couplable to a second coupling element in the body of the head; and a cam for releasing the first and second coupling elements, the cam being mounted on the body and relatively rotatable between a first position and a second position.