A cutting apparatus is provided. The cutting apparatus includes a processing chamber, a chuck table, a transferring mechanism, and a cleaning member. The chuck table is disposed in the processing chamber and configured to hold a workpiece on a chuck surface of the chuck table during a cutting process. The transferring mechanism is configured to transfer the workpiece to the chuck surface before the cutting process or transfer the workpiece away from the chuck surface after the cutting process. The cleaning member is disposed in the processing chamber, and is configured to move across and clean the chuck surface, driven by the transferring mechanism.

Examples of automated gemstone feeding are described. According to an example, a gemstone feeding machine includes a conveyor belt assembly to feed holders carrying gemstones. The conveyor belt assembly can include a plurality of conveyor belts in two sets positioned parallel to each other and the two sets can move in opposite directions. Each belt in one set can be positioned alternately with respect to each belt in the other set. The assembly can include a fixed guiding plate at a first end of the conveyor belts and a detachable guiding plate adjacent to the loading assembly at a second end of the conveyor belts. The fixed guiding plate and the detachable guiding plate each comprises a plurality of transition profiles in alignment with immediately adjacent conveyor belts.

A transfer jig for use in transferring a new cutting blade as a replacement component to the processing unit, in a cutting apparatus including a chuck table holding a workpiece, a processing unit having a spindle and a cutting blade detachably mounted on the spindle, a cutting blade changing unit changing the cutting blade, and a transfer mechanism supplying the workpiece to the processing unit. The transfer jig has a plurality of receiving portions each adapted to receive the new cutting blade and the cutting blade changed by the cutting blade changing unit. The transfer jig is adapted to be transferred by the transfer mechanism transferring the workpiece.

A synthetic quartz glass substrate is machined by bringing a surface of the synthetic quartz glass substrate as the workpiece into contact with and superposing it on a surface of a protective member made of synthetic quartz glass to effect optical contact bonding of the workpiece and the protective member, and passing a cutting tool through the optical contact bonding surfaces. This machining process is able to effectively prevent the generation of microdefects at the cutting tool entry site and extraction site during a cutting operation. Moreover, a fixing agent is not used to join the workpiece and the protective member, and so productivity is high because there is no need for the application and later removal of a fixing agent.

In a method, substrate elements are provided wherein each substrate element has a first side and a second side meeting at a corner point. The substrate elements are picked and then placed on a support device in alignment. A cutting operation is then performed where each of the substrates elements are cut along a cut line having a common first direction which intersects the first and second sides of each of the substrate elements in order to create a third side on each substrate element. The third side of each of the substrate elements meets the first and the second sides at corresponding corner points.

A crystal ingot cutting device and a crystal ingot cutting method are provided. The crystal ingot cutting device includes a driving unit, at least one cutting wire and a plurality of abrasive particles. The cutting wire is connected to the driving unit, wherein the driving unit drives a crystal ingot to move to the cutting wire and drives the cutting wire to reciprocate. A moving speed of the crystal ingot is 10˜700 μm/min, and a reciprocating speed of the cutting wire is 1800˜5000 m/min. The plurality of abrasive particles are arranged on the cutting wire, and a particle size of each abrasive particle is 5˜50 μm.

A method for slicing a workpiece includes feeding and slicing a workpiece held by a workpiece holder with a bonding member therebetween, while reciprocatively traveling a fixed abrasive grain wire wound around multiple grooved rollers to form a wire row, so that the workpiece is sliced at multiple positions simultaneously. The bonding member has a grindstone part. The method includes, after the workpiece is sliced and before it is drawn out from the wire row, a fixed-abrasive-grain removal step of pressing the wire against the grindstone to remove fixed abrasive grains from the wire while reciprocatively traveling. In the fixed-abrasive-grain removal step, the wire rate is 100 m/min. or less, and the load on each line of the wire is 30 g or more. The method prevents a sliced workpiece from catching a wire and from causing saw mark and wire break in drawing out the wire after slicing.

A multi-line cutting method, a multi-line cutting apparatus and use thereof, a semiconductor material and a power device. The multi-line cutting method includes following steps: configuring a line spool for winding cutting lines to vibrate under the excitation action of ultrasonic waves; and vibrating the cutting lines to cut an object to be cut under the conveying action of the line spool. The vibration of the cutting line under the excitation action of the ultrasonic waves can increase the energy of the cutting lines, enhance the cutting capability of the cutting lines, reduce the abrasion of the cutting lines, and force abrasive materials to impact and grind said object at high frequency and speed, and the chip removal speed is high, so that the surface curvature, the surface warpage, and the total thickness deviation of a product obtained after cutting are all small, and the cutting quality is high.

A processing method for a workpiece includes a cutting step of cutting the workpiece along streets by a cutting blade having a V-shaped tip end, to form V grooves of which shallower parts are wider than deeper parts, and a cleaning step of cleaning a back surface of the workpiece with cleaning water, after the cutting step is carried out.

Provided is a method for preventing metal contamination during cutting of a polycrystalline silicon rod. A method for cutting a polycrystalline silicon rod (S) includes the step of cutting the polycrystalline silicon rod (S) by using a cutting tool (133). The step of cutting includes: delivering a liquid (L1) to a cutting position of the polycrystalline silicon rod (S) through a first nozzle (14); and delivering a liquid (L2) to a surface of the polycrystalline silicon rod (S) through a second nozzle (15).