Embodiments of the present disclosure also relate to methods of fabricating flow cell substrates. Some exemplary workflows exploit orthogonal chemistries of substrate layers such that the process does not include polishing steps. Substrates prepared by the method described herein can include a first primer set and a second primer set compatible with simultaneous paired-end sequencing methods.

A variety of thermoplastic parts are provided with precise micro-scale features and long-range macro-scale reproducibility. By combining the advantages of rigid tool molding and soft tooling into a hybrid tooling, complex and challenging microfeatures can be created in thermoplastic parts with remarkable positional accuracy and reproducibility. The parts described herein can demonstrate orders of magnitude smaller inter-part variations and order of magnitude smaller variations with respect to a master part as compared to conventional hard and soft tooling methods. In some aspects, a plurality of thermoplastic parts having precision micro-scale features and reproducible macro-scale dimensions are provided wherein the precision micro-scale features on each part comprise at least one challenging microfeature; and wherein a mean normalized displacement of the micro-scale features is about or less when measured between the parts in the plurality of thermoplastic parts.

A production method of a mold having a recessed pattern includes: a plate precursor preparation step of preparing a plate precursor having a pedestal on which a protruding pattern is disposed; a resin plate preparation step of preparing a thermoplastic resin plate having a recessed step portion; and a resin plate precursor production step of producing a thermoplastic resin plate precursor. The plate precursor comprises a substrate having a larger area than the pedestal in a plan view on a side opposite to a surface of the pedestal on which the protruding pattern is disposed. An edge portion where a side surface of the pedestal and the substrate are in contact with each other has a through-hole penetrating the substrate along the side surface of the pedestal.

A method includes applying a polymer to a mold, the mold having microstructures with the polymer flowing into the microstructures when applied to the mold. The method includes pressing an inorganic substrate onto the polymer. The method includes curing the polymer to fix the polymer to the inorganic substrate to form an optical element from the polymer and the inorganic substrate, the optical element having microstructures formed by the microstructures in the mold. The method includes releasing the optical element from the mold.

Described herein are methods and systems for forming metal interconnect layers (MILs) on engineered templates and transferring these MILs to device substrates. This “off-device” approach of forming MILs reduces the complexity and costs of the overall process, allows using semiconductor processes, and reduces the risk of damaging the device substrates. An engineered template is specially configured to release a MIL when the MIL is transferred to a device substrate. In some examples, the engineered template does not include barrier layers and/or adhesion layers. In some examples, the engineered template comprises a conductive portion to assist with selective electroplating. Furthermore, the same engineered template may be reused to form multiple MILs, having the same design. During the transfer, the engineered template and device substrate are stacked together and then separated while the MIL is transitioned from the engineered template to the device substrate.

A vehicle interior panel such as an instrument panel includes a substrate having a thickness between 0.5 mm and 2.25 mm, inclusive, a decorative layer, and an intermediate layer located between the substrate and the decorative layer. A post-form warpage of the substrate is less than 15 mm at an edge region of the substrate. A serpentine rib located near the edge region helps impart structural rigidity to the panel during a foaming process to achieve an adequate degree of post-form warpage.

An endoprosthesis has an expanded state and a contracted state, the endoprosthesis includes a stent having an inner surface defining a lumen, having an outer surface, and defining a plurality of apertures through the outer surface, wherein the apertures are arranged in a micropattern; and a coating (e.g., polymeric coating) attached to the outer surface of the stent. The coating includes a base and a tissue engagement portion including a second surface facing outwardly from the stent, the tissue engagement portion including a structure that defines a plurality of holes extending inwardly from the second surface toward the base. The holes are arranged in a micropattern. When the endoprosthesis is expanded to the expanded state in a lumen defined by a vessel wall, the structure applies a force that may reduce stent migration by creating an interlock between the vessel wall and the endoprosthesis.

An imprint apparatus for forming a pattern of an imprint material on a substrate by using a mold including a pattern formation area, the imprint apparatus includes a detection unit configured to detect a contact state of the imprint material on the substrate with the mold, a light modulation element configured to control an intensity distribution of irradiation light irradiating the substrate, and a control unit configured to control a timing of irradiating the substrate with the irradiation light having the intensity distribution controlled by the light modulation element based on a detection result of the detection unit.

Described herein are methods and systems for forming metal interconnect layers (MILs) on engineered templates and transferring these MILs to device substrates. This “off-device” approach of forming MILs reduces the complexity and costs of the overall process, allows using semiconductor processes, and reduces the risk of damaging the device substrates. An engineered template is specially configured to release a MIL when the MIL is transferred to a device substrate. In some examples, the engineered template does not include barrier layers and/or adhesion layers. In some examples, the engineered template comprises a conductive portion to assist with selective electroplating. Furthermore, the same engineered template may be reused to form multiple MILs, having the same design. During the transfer, the engineered template and device substrate are stacked together and then separated while the MIL is transitioned from the engineered template to the device substrate.

Implanted medical devices need a mechanism of immobilization to surrounding tissues, which minimizes tissue damage while providing reliable long-term anchoring. This disclosure relates to techniques for patterning arbitrarily shaped 3D objects and to patterned balloon devices having micro- or nano-patterning on an outer surface of an inflatable balloon. The external pattern can provide enhanced friction and anchoring in an aqueous environment. Examples of these types of patterns are hexagonal arrays inspired by tree frogs, corrugated patterns, and microneedle patterns. The patterned balloon devices can be disposed between an implant and surrounding tissues to facilitate anchoring of the implant.