The present invention is a method for manufacturing inflatable bladders for use in articles of manufacture. The method includes the steps of providing a first polymer film, applying a curable release coating to the polymer film in a pattern that corresponds to the configuration of the inflatable bladder, curing the release coating to the first polymer film, providing a second polymer film with the first polymer film to form a layered element such that the release coating is disposed between the polymer films, positioning the layered element between two plies of material, applying heat and pressure to adhere the polymer films together except in the area where the release coating has been applied to form an inflatable compartment surrounded by a sealed perimeter, and removing the plies of material from the adhered first and second polymer films.

Systems and methods are provided for enhancement of vacuum bagging processes for a composite part. One system includes dispensers configured to dispense materials onto a forming tool for a composite part, and a controller. The controller is able to identify a location for placing the composite part on the tool, and to direct the dispensers to lay up a laminate of constituent material for the composite part at the location. The controller is also able to direct the dispensers to spray vacuum bag material atop the laminate to form a vacuum bag that covers the laminate.

A deposition assembly generally comprises a first deposition apparatus that is configured to receive a substrate, such as a glass mandrel. The first deposition apparatus is further configured to deposit a plurality of first monolayer molecules onto at least a surface of the substrate to generate a first coating structure on the substrate. A second deposition apparatus is coupled to the first deposition apparatus, and wherein the second deposition apparatus is configured to deposit a plurality of second monolayer molecules onto at least the surface of the substrate such that the second monolayer molecules are diffused through the first coating structure and at least one aperture is filled by at least one of the second monolayer molecules to generate at least one mold release layer on at least the surface of the substrate.

A deposition assembly generally comprises a first deposition apparatus that is configured to receive a substrate, such as a glass mandrel. The first deposition apparatus is further configured to deposit a plurality of first monolayer molecules onto at least a surface of the substrate to generate a first coating structure on the substrate. A second deposition apparatus is coupled to the first deposition apparatus, and wherein the second deposition apparatus is configured to deposit a plurality of second monolayer molecules onto at least the surface of the substrate such that the second monolayer molecules are diffused through the first coating structure and at least one aperture is filled by at least one of the second monolayer molecules to generate at least one mold release layer on at least the surface of the substrate.

The improved mold assembly for cultured marble molding is provided. The mold assembly can comprise a male mold portion and a female mold portion. The assembly can further comprise a molding tool. The molding tool can have a side wall having an upper curved portion and a lower curved portion. The molding tool can have a bowl portion and an apron portion spaced from the bowl portion by a gap. The molding tool can be constructed from a flexible and/or soft material. The molding tool can facilitate molding of a countertop having at least one seamless curved edge and/or an at least partially seamless sink portion.

[Object] To provide a device for the production of a thin plate-like laminate having a film-like resin layer in which a concave/convex shape can stably be formed with high accuracy on the film-like resin layer laminated on a thin plate-like substrate.

[Achieving Means] There are provided a setting device 31 for creating a mold retention structure 100 in which molds 110 are arranged on both surface sides of a workpiece 85, a heating device 41 which heats the molds to a thermal deformation temperature of a film-like resin composition 84, a compression roller device 51 in which the mold retention structure, after heating of the molds, is introduced between two compression rollers 52, 54 and outer surfaces of the molds are compressed by, rotating the compression rollers to integrally thennocompression-bond the film-like resin composition and a substrate 81 to form a thin plate-like laminate 80 having a film-like resin layer 82, and an extraction device 61 which extracts the molds from the mold retention structure after compression.

A method for potting electrical components into complex finishing forms is presented. A releasing agent is added into a mold cavity. Next, an initial layer of potting compound is added into the mold cavity. A label layer is added into the initial layer of the potting compound. A set of electronic components is added over the label layer. An interstitial layer of potting compound is added over the set of electronic components. A reinforcement layer is added along the interstitial layer. A finishing layer of the potting compound is added over the reinforcement layer forming an uncured potted electronic product. The uncured potted electronic product is cured within the mold cavity in order to produce a cured potted electronic product. The cured potted electronic product is released from the negative mold using a releasing device.

A method for potting electrical components into complex finishing forms is presented. A releasing agent is added into a mold cavity. Next, an initial layer of potting compound is added into the mold cavity. A label layer is added into the initial layer of the potting compound. A set of electronic components is added over the label layer. An interstitial layer of potting compound is added over the set of electronic components. A reinforcement layer is added along the interstitial layer. A finishing layer of the potting compound is added over the reinforcement layer forming an uncured potted electronic product. The uncured potted electronic product is cured within the mold cavity in order to produce a cured potted electronic product. The cured potted electronic product is released from the negative mold using a releasing device.

A resin supply apparatus includes a calculation unit for calculating a resin supply pattern based on the shape of a cavity of a resin sealing mold, and a supply unit for supplying a resin to an object to be coated along the resin supply pattern. The resin supply pattern has a plurality of linear paths, and one of mutually adjacent linear paths is inclined with respect to an axis of symmetry that divides a cavity in line symmetry, the other one of the mutually adjacent linear paths is inclined with respect to the one linear path, and a region between the mutually adjacent linear paths is opened to the outside of the object to be coated, at least on a side on which the other linear path is separated from the one linear path.

A method for potting electrical components into complex finishing forms is presented. A releasing agent is added into a mold cavity. Next, an initial layer of potting compound is added into the mold cavity. A label layer is added into the initial layer of the potting compound. A set of electronic components is added over the label layer. An interstitial layer of potting compound is added over the set of electronic components. A reinforcement layer is added along the interstitial layer. A finishing layer of the potting compound is added over the reinforcement layer forming an uncured potted electronic product. The uncured potted electronic product is cured within the mold cavity in order to produce a cured potted electronic product. The cured potted electronic product is released from the negative mold using a releasing device.