A heat resistant release sheet of the present disclosure includes a polyimide substrate, and a first polytetrafluoroethylene (PTFE) layer and a second PTFE layer that sandwich the polyimide substrate therebetween. PTFE composing the first PTFE layer and PTFE composing the second PTFE layer each have a number-average molecular weight of 6 million or more, and a peel force required to peel the first PTFE layer from the polyimide substrate is 0.5 N/20 mm or more, and a peel force required to peel the second PTFE layer from the polyimide substrate is less than 0.5 N/20 mm. The heat resistant release sheet of the present disclosure has a new structure and can also be used for thermocompression bonding at a higher temperature.

A heat resistant release sheet of the present disclosure includes a polyimide substrate, and a first polytetrafluoroethylene (PTFE) layer and a second PTFE layer that sandwich the polyimide substrate therebetween. PTFE composing the first PTFE layer and PTFE composing the second PTFE layer each have a number-average molecular weight of 6 million or more, and a peel force required to peel the first PTFE layer from the polyimide substrate is 0.5 N/20 mm or more, and a peel force required to peel the second PTFE layer from the polyimide substrate is less than 0.5 N/20 mm. The heat resistant release sheet of the present disclosure has a new structure and can also be used for thermocompression bonding at a higher temperature.

The present invention relates to an injection mold, an injection molding machine including the injection mold, and a method of manufacturing an injection-molded product using the injection molding machine. More specifically, the present invention relates to an injection mold including a mold having a mold surface on which one or more deposition layers are formed, wherein the deposition layer includes a fluororesin homopolymer or polyether ether ketone (PEEK); an injection molding machine including the injection mold; and a method of manufacturing an injection-molded product using the injection molding machine.

A method and an apparatus of forming a three-dimensional object, wherein the method includes providing a carrier and an optically transparent member having a build surface, said carrier and said build surface defining a build region therebetween; filling said build region with a polymerizable liquid, continuously or intermittently irradiating said build region with light through said optically transparent member to form a solid polymer from said polymerizable liquid, continuously or intermittently advancing (e.g., sequentially or concurrently with said irradiating step) said carrier away from said build surface to form said three-dimensional object from said solid polymer, said optically transparent member comprising a build plate for a three-dimensional printer comprising: an optically transparent first channel layer; an optically transparent, gas permeable second channel layer on the first channel layer; and a flexible, optically transparent, gas-permeable sheet having an upper and lower surface, the sheet upper surface comprising a build surface for forming a three-dimensional object, the sheet lower surface being positioned on the second channel layer.

A PVB film for HUD, a forming mold and a forming method thereof are presented. The accuracy error of HUD imaging achieved by the PVB film for HUD is ±0.1 mrad. The forming mold includes an upper mold and a lower mold, the two of which can form an enclosed mold cavity when clamped together, wherein protective films are disposed on inner surfaces of the upper mold and the lower mold, respectively, for supporting PVB material and preventing the PVB material from bonding with the upper mold and the lower mold, and wherein shapes of the protective films match shapes of the upper mold and the lower mold.

A PVB film for HUD, a forming mold and a forming method thereof are presented. The accuracy error of HUD imaging achieved by the PVB film for HUD is ±0.1 mrad. The forming mold includes an upper mold and a lower mold, the two of which can form an enclosed mold cavity when clamped together, wherein protective films are disposed on inner surfaces of the upper mold and the lower mold, respectively, for supporting PVB material and preventing the PVB material from bonding with the upper mold and the lower mold, and wherein shapes of the protective films match shapes of the upper mold and the lower mold.

The present disclosure relates to a method for manufacturing a molded product including real wood capable of forming a real wood layer on the surface of an injected molded product by using an IMD film provided with a real wood stacked body. According to the method, it is possible to manufacture the IMD film provided with the real wood stacked body on the release film, and to form the real wood layer on the surface of the injected molded product without breakage by using the IMD film.

The present disclosure relates to a method for manufacturing a molded product including real wood capable of forming a real wood layer on the surface of an injected molded product by using an IMD film provided with a real wood stacked body. According to the method, it is possible to manufacture the IMD film provided with the real wood stacked body on the release film, and to form the real wood layer on the surface of the injected molded product without breakage by using the IMD film.

A mould includes at least two mould parts, one of which includes a mould cavity for enclosing electronic components placed on a carrier and a contact surface for at least partially enclosing the mould cavity, contacting the carrier, and forming a tight connection with the carrier. A feed channel is recessed into the contact surface and the mould part further includes a displaceable barrier element that is displaceable in a direction substantially perpendicular to the contact surface connecting to the feed channel for regulating the size of a passage in the feed channel. A foil handler applies a foil layer between a wall of the feed channel and the displaceable barrier element which is configured for exerting a pressure onto the foil layer when the mould parts are moved apart to release the carrier with electronic components from the mould part.

A mould includes at least two mould parts, one of which includes a mould cavity for enclosing electronic components placed on a carrier and a contact surface for at least partially enclosing the mould cavity, contacting the carrier, and forming a tight connection with the carrier. A feed channel is recessed into the contact surface and the mould part further includes a displaceable barrier element that is displaceable in a direction substantially perpendicular to the contact surface connecting to the feed channel for regulating the size of a passage in the feed channel. A foil handler applies a foil layer between a wall of the feed channel and the displaceable barrier element which is configured for exerting a pressure onto the foil layer when the mould parts are moved apart to release the carrier with electronic components from the mould part.