The present invention relates to a mould for encapsulating a carrier with electronic components, comprising: at least two mould parts, one of which with at least one mould cavity recessed into a contact side for enclosing electronic components placed on a carrier, and a feed channel for moulding material recessed into the contact surface of the mould part provided with the mould cavity. The invention also relates to a moulding apparatus, a method for at least partially encapsulating a carrier with electronic components and a carrier with electronic components encapsulated with moulding material.

A battery case shaping apparatus includes a punch, a die, a holder, and an elastic separator. The punch is configured to press a laminate sheet into a shape of an electrode assembly receiving portion. The die has formed therein an accommodation portion having a size corresponding to the electrode assembly receiving portion. The holder is configured to fix the an outer periphery of the laminate sheet. The elastic separator is located under the punch in order to prevent direct contact between the punch and the laminate sheet. A battery case manufacturing process uses the battery case shaping apparatus to manufacture a battery case.

A method of making a composite part comprises covering a mold tool for a composite part with a parting film, the parting film comprising a polymer sheet and a pressure sensitive adhesive. The parting film is positioned so that the polymer sheet is between the mold tool and the pressure sensitive adhesive. At least one layer of pre-preg is layed up on the parting film covering the mold tool to form a layed-up composite part. The pre-preg comprises an adhesive. The layed-up composite part is removed from the parting film.

Provided is a mold release film capable of transferring a concave-convex structure to the surface of an adhesive film.

Provided is a mold release film capable of transferring a concave-convex structure to the surface of an adhesive film.

The invention relates to a method for moulding and surface processing electronic components wherein a grid of electronic components is attached on a carrier; subsequently foil is placed against the side of the electronic components opposite to the carrier and are the electronic components partially encapsulated. After moulding the foil is removed from the electronic components and a free side of the components is surface processed. The invention also relates to a partial encapsulated electronic component as produced with such a method.

A resin molding apparatus capable of suppressing an occurrence of defects related to resin filling. The resin molding apparatus includes: a molding mold which forms a cavity; a pot which is arranged in the molding mold and is capable of accommodating a resin material, and in which an opening portion opening directly to the cavity is formed; and a plunger which is arranged to be slidable in the pot, and transfers the resin material accommodated in the pot toward the cavity via the opening portion by extruding the resin material. An inner diameter of the opening portion is formed to be the same as an outer diameter of the plunger or larger than the outer diameter of the plunger.

Thermal curing of a potting material within a hole in a surface of a composite material is described utilizing a flexible vacuum compression device that includes a chemical-based heating pack. The vacuum compression device includes an internal compartment within a cavity that retains the chemical-based heating pack, and a vacuum port having a passage into the cavity. An end of the vacuum compression device includes an interface that forms an air-tight seal between the cavity and the surface when applied to a surface of the composite material. Drawing a vacuum via the vacuum port collapses the vacuum compression device and positions the chemical-based heating pack proximate to the surface, enabling heat from the chemical-based heating pack to thermally cure the potting material.

Thermal curing of a potting material within a hole in a surface of a composite material is described utilizing a flexible vacuum compression device that includes a chemical-based heating pack. The vacuum compression device includes an internal compartment within a cavity that retains the chemical-based heating pack, and a vacuum port having a passage into the cavity. An end of the vacuum compression device includes an interface that forms an air-tight seal between the cavity and the surface when applied to a surface of the composite material. Drawing a vacuum via the vacuum port collapses the vacuum compression device and positions the chemical-based heating pack proximate to the surface, enabling heat from the chemical-based heating pack to thermally cure the potting material.

A method of forming a barrel portion including obtaining a mandrel shaped to define at least an inner surface of a barrel portion of the bat, wrapping a first plurality of layers of fiber composite material about the mandrel, placing a removable material over a first portion of the first plurality of layers, and wrapping a second plurality of layers of fiber composite material over the removable material and the portion of the first plurality of layers not covered by the removable material for form an assembly. The method further includes separating the mandrel from the assembly, inserting an expandable member within the assembly, inserting the assembly into a barrel-forming mold, and molding the assembly in a single molding cycle, curing the first and second layers with the removable material to form the barrel portion of the bat, and removing the removable material and the member from the barrel portion.