A system for pressing one or more stacks of one or more laminae (22), the system comprising: a tool including top (14b) and bottom plates (14a) configured to be disposed on opposing sides of each of one or more stacks (22) of one or more laminae, each of the plates (14a, 14b) having: a center region that overlies or underlies the stack(s) (22) when the stack(s) are disposed between the plates (14a, 14b); and tabs (174) that extend outwardly from edges of the center region and are configured to be coupled to a conveyor or one or more grippers for moving the plate; and a resilient layer (90) configured to be disposed between the top plate and the stack(s) (22) or the bottom plate (14a) and the stack(s) (22); wherein the resilient layer (90) is sized to be disposable between the plates such that, for each of the plates (14a, 14b): the resilient layer (90) overlies or underlies at least 90% of the center region; one or more portions of the resilient layer (90) neither overlie nor underlie the plate; and at least a portion of each of the tabs neither overlies nor underlies the resilient layer ((14a, 14b)). Also claimed is a method for producing laminates by pressing.

The present application pertains to components such as tank covers with increased slip resistance and processes for making such components. Generally, a patterned release fabric is employed in a manner such that a formed fiber reinforced plastic component has a textured pattern on at least one surface to increase slip resistance.

A release film satisfies formulas (I) and (II) when S1 (%) represents the maximum dimensional change rate between 30° C. and 150° C. when the temperature is raised from 30° C. to 200° C. at a rate of 10° C./min, T1 (° C.) represents the temperature at which S1 is obtained, and S0 (%) represents the dimensional change rate at 40° C. The surfaces may have a surface free energy Sa (mN/mm) at 25° C., surface free energy Sb (mN/mm) after having been subjected to a heat treatment at 180° C. for 3 minutes, and surface free energy Sc (mN/mm) after having been stretched by 50% at 180° C. that satisfy formulas (III) and (IV).
0≤S1≤1.5  Formula (I):
0≤|S1−S0|/(T1−40)≤0.050  Formula (II):
0≤|Sa−Sb|≤15  Formula (III):
0≤|Sa−Sc|≤15  Formula (IV):

A release film satisfies formulas (I) and (II) when S1 (%) represents the maximum dimensional change rate between 30° C. and 150° C. when the temperature is raised from 30° C. to 200° C. at a rate of 10° C./min, T1 (° C.) represents the temperature at which S1 is obtained, and S0 (%) represents the dimensional change rate at 40° C. The surfaces may have a surface free energy Sa (mN/mm) at 25° C., surface free energy Sb (mN/mm) after having been subjected to a heat treatment at 180° C. for 3 minutes, and surface free energy Sc (mN/mm) after having been stretched by 50% at 180° C. that satisfy formulas (III) and (IV).
0≤S1≤1.5  Formula (I):
0≤|S1−S0|/(T1−40)≤0.050  Formula (II):
0≤|Sa−Sb|≤15  Formula (III):
0≤|Sa−Sc|≤15  Formula (IV):

Provided is a resin molding apparatus that can suppress a molding problem caused by a variation in a thickness of an object to be molded or suppress a variation in a thickness of a resin molded part, and can perform a mold releasing operation. A resin molding apparatus includes: a molding mold having one mold and the other mold; one mold wedge mechanism; and one mold cavity block driving mechanism. In a state that a height position of one mold cavity block is set using the one mold cavity block driving mechanism and a position in a direction away from the other mold in the one mold cavity block having been moved to the height position is fixed to be limited using the one mold wedge mechanism, a mold releasing operation can be performed using the one mold wedge mechanism and the one mold cavity block driving mechanism.

Provided is a resin molding apparatus that can reduce a variation in a thickness of a resin to be molded. A resin molding apparatus includes: a molding mold having one mold and the other mold; one mold wedge mechanism; and one mold cavity block driving mechanism. In a state that one mold cavity block is moved to a preset height position using the one mold cavity block driving mechanism and a position in a direction away from the other mold in the one mold cavity block having been moved to the height position is fixed to be limited using the one mold wedge mechanism, a resin is injected into one mold cavity, and thereafter resin molding can be performed by changing a depth of the one mold cavity using the one mold wedge mechanism and the one mold cavity block driving mechanism.

An object of the invention is to provide a method for conditioning a surface of a molded article. The present invention relates to a combination of a mold used for curing a thermosetting resin and a release film placed between the thermosetting resin and the mold during the curing. The release film comprises a base layer formed of a thermoplastic resin and a surface layer formed of a particle-containing fluororesin and laminated to the face which is placed during the curing on the side of the thermosetting resin among the two faces of the base layer. The mold has an irregularity formed on the face brought into contact with the release film during the curing.

An object of the invention is to provide a method for conditioning a surface of a molded article. The present invention relates to a combination of a mold used for curing a thermosetting resin and a release film placed between the thermosetting resin and the mold during the curing. The release film comprises a base layer formed of a thermoplastic resin and a surface layer formed of a particle-containing fluororesin and laminated to the face which is placed during the curing on the side of the thermosetting resin among the two faces of the base layer. The mold has an irregularity formed on the face brought into contact with the release film during the curing.

A resin supply apparatus includes a calculation unit for calculating a resin supply pattern based on the shape of a cavity of a resin sealing mold, and a supply unit for supplying a resin to an object to be coated along the resin supply pattern. The resin supply pattern has a plurality of linear paths, and one of mutually adjacent linear paths is inclined with respect to an axis of symmetry that divides a cavity in line symmetry, the other one of the mutually adjacent linear paths is inclined with respect to the one linear path, and a region between the mutually adjacent linear paths is opened to the outside of the object to be coated, at least on a side on which the other linear path is separated from the one linear path.

A molded article of a carbon fiber composite material includes at least carbon fibers and a resin composition. The molded article of a carbon fiber composite material is characterized in that the surface roughness Ra thereof is 0.01-2 μm and in that the tensile shear adhesive strength (F0) thereof when a metal has been adhered to the surface thereof via an adhesive layer that contains an epoxy compound and is 0.1-3 mm thick is 10-40 MPa.