Provided is a vinyl chloride resin composition for powder molding that can provide a molded product having superior flexibility at low temperatures. The vinyl chloride resin composition for powder molding includes (a) vinyl chloride resin particles, (b) a plasticizer, and (c) vinyl chloride resin fine particles having an average degree of polymerization of at least 1,000 and no greater than 5,000.

Provided is a vinyl chloride resin composition for powder molding that can provide a molded product having superior flexibility at low temperatures. The vinyl chloride resin composition for powder molding includes (a) vinyl chloride resin particles, (b) a plasticizer, and (c) vinyl chloride resin fine particles having an average degree of polymerization of at least 1,000 and no greater than 5,000.

A composite part manufactured via a dual cast slush molding technique includes a skin layer having a first side and an opposite second side and a foam layer formed in situ on the second side of the skin layer. The first side of the skin layer defines a Class A surface. The skin layer and the foam layer each comprise a polymer of the same type and are respectively formed from a first resin-based composition and a second resin-based composition. The first resin-based composition and the second resin-based composition each may comprise a polyvinyl chloride (PVC)-based composition or a thermoplastic polyolefin (TPO)-based composition.

A composite part manufactured via a dual cast slush molding technique includes a skin layer having a first side and an opposite second side and a foam layer formed in situ on the second side of the skin layer. The first side of the skin layer defines a Class A surface. The skin layer and the foam layer each comprise a polymer of the same type and are respectively formed from a first resin-based composition and a second resin-based composition. The first resin-based composition and the second resin-based composition each may comprise a polyvinyl chloride (PVC)-based composition or a thermoplastic polyolefin (TPO)-based composition.

A molding compound dispensing system identifies a semiconductor device strip having a substrate with a plurality of segments allocated for die stacks. The system obtains topological data of the identified semiconductor device strip for each of the segments, including data indicative of any semiconductor components in each respective segment. The system determines an amount of molding compound to be applied to each of the segments based on the topological data for each respective segment, and causes a molding compound dispenser to dispense the determined amounts of molding compound at each of the segments.

A thermofusible composition comprising from about 40 to about 70 weight percent of a selectively hydrogenated styrenic block copolymer (HSBC), and from about 1 to about 30 weight percent of a butylene homopolymer, a butylenes copolymer, or a combination thereof, wherein the HSBC is: (i) prior to hydrogenation each A block is a mono alkenyl arene polymer block and each B block is a controlled distribution copolymer block of at least one conjugated diene and at least one mono alkenyl arene; (ii) the weight percent of mono alkenyl arene in each B block is from about 10 to about 40 weight percent; (iii) each B block has a styrene blockiness index of less than 10 percent; and (iv) the weight percent of vinyl in each B block is at least about 40 weight percent.

A thermofusible composition comprising from about 40 to about 70 weight percent of a selectively hydrogenated styrenic block copolymer (HSBC), and from about 1 to about 30 weight percent of a butylene homopolymer, a butylenes copolymer, or a combination thereof, wherein the HSBC is: (i) prior to hydrogenation each A block is a mono alkenyl arene polymer block and each B block is a controlled distribution copolymer block of at least one conjugated diene and at least one mono alkenyl arene; (ii) the weight percent of mono alkenyl arene in each B block is from about 10 to about 40 weight percent; (iii) each B block has a styrene blockiness index of less than 10 percent; and (iv) the weight percent of vinyl in each B block is at least about 40 weight percent.

Provided is a method for producing a laminate, the method comprising: sewing a sheet using thread; impregnating at least part of the thread with liquid before, after, or during said sewing; and laminating a polyurethane foam layer to at least one surface of a sheet-type molded body that is obtained by said sewing and said impregnating, the method for producing a laminate being able to easily prevent leakage of polyurethane from sewed portions at low cost, in the step of laminating the sewed sheet-type molded body and the polyurethane foam layer.

Provided is a method for producing a laminate, the method comprising: sewing a sheet using thread; impregnating at least part of the thread with liquid before, after, or during said sewing; and laminating a polyurethane foam layer to at least one surface of a sheet-type molded body that is obtained by said sewing and said impregnating, the method for producing a laminate being able to easily prevent leakage of polyurethane from sewed portions at low cost, in the step of laminating the sewed sheet-type molded body and the polyurethane foam layer.

Provided is a sheet-type molded body that is formed by sewing a sheet, wherein thread is used for at least part of said sewing, the thread being composed of a resin composition for thread containing resin for thread, the thread having a melting point of no more than 200? C., and a laminate comprising: the sheet-type molded body; and a polyurethane foam formed body, the sheet-type molded body, and the laminate comprising: the sheet-type molded body; and a polyurethane foam layer being able to be produced by a simple method at low cost without damaging design qualities over time, and making it possible to prevent leakage of raw material etc. from sewed portions when backed with the polyurethane foam layer.