There is provided a resin-sealing apparatus that supplies an appropriate amount of sheet-shaped resin for each workpiece, thereby improving the molding quality of a molded product without production of resin dust, such that no redundant resin is produced on a molded product. The resin-sealing apparatus includes a resin supply part that supplies a sheet-shaped resin by cutting out an amount of sheet-shaped resin appropriate for one-time compression molding from a long resin sheet formed to have a predetermined width and a predetermined thickness depending on an amount of resin required for each workpiece, and a transport part that transports the appropriate amount of sheet-shaped resin supplied by the resin supply part to a sealing mold.

A resin supply apparatus, a resin sealing apparatus, and a method for manufacturing a resin-sealed product are provided. A resin supply apparatus supplies a resin onto a workpiece on which elements are arranged in a first direction and a second direction intersecting the first direction, respectively. The resin supply apparatus includes: an acquisition unit for acquiring arrangement information of the elements on the workpiece; a supply unit for supplying the resin onto the workpiece; a calculation unit for calculating a resin supply pattern based on the arrangement information; and a drive unit for moving at least one of the workpiece and the supply unit relative to the other along the resin supply pattern. The resin supply pattern has linear paths extending along the first direction, and a region between the mutually adjacent linear paths in the plurality of linear paths is opened to the outside of the workpiece.

A resin supply apparatus, a resin sealing apparatus, and a method for manufacturing a resin-sealed product are provided. A resin supply apparatus supplies a resin onto a workpiece on which elements are arranged in a first direction and a second direction intersecting the first direction, respectively. The resin supply apparatus includes: an acquisition unit for acquiring arrangement information of the elements on the workpiece; a supply unit for supplying the resin onto the workpiece; a calculation unit for calculating a resin supply pattern based on the arrangement information; and a drive unit for moving at least one of the workpiece and the supply unit relative to the other along the resin supply pattern. The resin supply pattern has linear paths extending along the first direction, and a region between the mutually adjacent linear paths in the plurality of linear paths is opened to the outside of the workpiece.

A resin supply apparatus includes a calculation unit for calculating a resin supply pattern based on the shape of a cavity of a resin sealing mold, and a supply unit for supplying a resin to an object to be coated along the resin supply pattern. The resin supply pattern has a plurality of linear paths, and one of mutually adjacent linear paths is inclined with respect to an axis of symmetry that divides a cavity in line symmetry, the other one of the mutually adjacent linear paths is inclined with respect to the one linear path, and a region between the mutually adjacent linear paths is opened to the outside of the object to be coated, at least on a side on which the other linear path is separated from the one linear path.

A resin supply apparatus includes a calculation unit for calculating a resin supply pattern based on the shape of a cavity of a resin sealing mold, and a supply unit for supplying a resin to an object to be coated along the resin supply pattern. The resin supply pattern has a plurality of linear paths, and one of mutually adjacent linear paths is inclined with respect to an axis of symmetry that divides a cavity in line symmetry, the other one of the mutually adjacent linear paths is inclined with respect to the one linear path, and a region between the mutually adjacent linear paths is opened to the outside of the object to be coated, at least on a side on which the other linear path is separated from the one linear path.

The invention relates to an apparatus (1) for laminating a substrate (12) with a thermoplastic film (11), the apparatus (1) comprising the following: —a laminating unit (2) for laminating the substrate (12) with the thermoplastic film (11), —a feed device (4) for the thermoplastic film (11) to the laminating unit (2), wherein the feed device (4) for the thermoplastic film (11) has devices (14) for heating a first side (16) of the film (11) and devices (15) for cooling a second side (17) of the film (11), as well as a number of controllably driven rollers (10) via which the film (11) is guided past the devices (14) for heating and the devices (15) for cooling, wherein a tension of the film (11) can be regulated via the speed of the driven rollers (10).

The invention relates to an apparatus (1) for laminating a substrate (12) with a thermoplastic film (11), the apparatus (1) comprising the following: —a laminating unit (2) for laminating the substrate (12) with the thermoplastic film (11), —a feed device (4) for the thermoplastic film (11) to the laminating unit (2), wherein the feed device (4) for the thermoplastic film (11) has devices (14) for heating a first side (16) of the film (11) and devices (15) for cooling a second side (17) of the film (11), as well as a number of controllably driven rollers (10) via which the film (11) is guided past the devices (14) for heating and the devices (15) for cooling, wherein a tension of the film (11) can be regulated via the speed of the driven rollers (10).

A method for rapid manufacturing of three dimensional discontinuous fiber preforms is provided. The method includes the deposition of a polymeric material containing fibers on a surface to form a tailored charge for compression molding. The reinforced polymeric material may be a thermoplastic or a reactive polymer with viscosity low enough to allow flow through an orifice during deposition, yet high enough zero shear viscosity to retain the approximate shape of the deposited charge. The material can be deposited in a predetermined pattern to induce the desired mechanical properties through alignment of the fibers. This deposition can be performed in a single layer or in multiple layers. The alignment is achieved passively by shear alignment of the fibers or actively through fiber orientation control or mixing. The fibers can be of the desired material, length, and morphology, including short and long filaments.

A method for rapid manufacturing of three dimensional discontinuous fiber preforms is provided. The method includes the deposition of a polymeric material containing fibers on a surface to form a tailored charge for compression molding. The reinforced polymeric material may be a thermoplastic or a reactive polymer with viscosity low enough to allow flow through an orifice during deposition, yet high enough zero shear viscosity to retain the approximate shape of the deposited charge. The material can be deposited in a predetermined pattern to induce the desired mechanical properties through alignment of the fibers. This deposition can be performed in a single layer or in multiple layers. The alignment is achieved passively by shear alignment of the fibers or actively through fiber orientation control or mixing. The fibers can be of the desired material, length, and morphology, including short and long filaments.

A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) measuring an amount of a molding powder; (b) controlling the amount of a molding powder; and (c) dispensing the molding powder on an assembly structure including a carrier and at least one semiconductor device disposed on the carrier.