Methods, devices, and systems are provided for the encapsulation of electronic devices. The encapsulation includes positioning an electronic device in a cavity of a mold, and screen or stencil printing an encapsulant, in a liquid form, around the flexible electronic device. The mold is of a sufficient thickness to allow the encapsulant to completely cover electronic components mounted on a first surface of the electronic device.

To suppress occurrence of contamination or damage to a lens. In the present technology, for example, a manufacturing apparatus allows a spacer which is thicker than a height of a lens resin portion protruded from a substrate to be adhered to the substrate. In addition, for example, in the present technology, the manufacturing apparatus molds the lens resin portion inside a through-hole formed in the substrate by using a mold frame configured with two layers of molds and, after molding the lens resin portion, in the state that one mold is adhered to the substrate, the manufacturing apparatus demolds the substrate from the other mold. The present technology can be applied to, for example, a lens-attached substrate, a stacked lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic apparatus, a computer, a program, a storage medium, a system, or the like.

Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.

A method of moulding (10; 20) and apparatus (108; 208; 308) therefor, in which a workpiece (100) is preheated and/or post-cooled before and/or after a moulding process, allowing optimal use of the tool for high precision moulding operations.

A method of moulding (10; 20) and apparatus (108; 208; 308) therefor, in which a workpiece (100) is preheated and/or post-cooled before and/or after a moulding process, allowing optimal use of the tool for high precision moulding operations.

A molding apparatus includes a movable molding surface with molding cavities, a pressure shoe with a stationary outer surface that defines in cooperation with the molding surface a pressure zone, and a resin source configured to introduce molten resin into the pressure zone to be forced into the molding cavities by pressure in the pressure zone. The molding surface is movable with respect to the pressure shoe to introduce molding cavities to the pressure zone to be filled with resin while the outer surface of the pressure shoe and the molding surface define in between an entrance gap of decreasing width upstream of the pressure zone. The outer surface of the pressure shoe is spaced from the molding surface in the pressure zone to define a minimum gap at which the outer surface of the pressure shoe has a slope parallel to the molding surface. The pressure shoe is adapted to be held in a flexed condition against resin in the pressure zone while forcing resin into the cavities, with the outer surface of the pressure shoe curved upstream of the pressure zone.

A molding apparatus includes a movable molding surface with molding cavities, a pressure shoe with a stationary outer surface that defines in cooperation with the molding surface a pressure zone, and a resin source configured to introduce molten resin into the pressure zone to be forced into the molding cavities by pressure in the pressure zone. The molding surface is movable with respect to the pressure shoe to introduce molding cavities to the pressure zone to be filled with resin while the outer surface of the pressure shoe and the molding surface define in between an entrance gap of decreasing width upstream of the pressure zone. The outer surface of the pressure shoe is spaced from the molding surface in the pressure zone to define a minimum gap at which the outer surface of the pressure shoe has a slope parallel to the molding surface. The pressure shoe is adapted to be held in a flexed condition against resin in the pressure zone while forcing resin into the cavities, with the outer surface of the pressure shoe curved upstream of the pressure zone.

A process for molding a hollow structure comprising the steps of: a. Forming a mandrel in a shape of a proposed cavity from a water-soluble substance capable of withstanding temperatures and pressures from a predetermined compression molding process; b. Positioning the mandrel in a suitable mold for forming an article which includes the mandrel within the article; and, c. Removing the mandrel by loosening and dissolving the mandrel with a water solution, thereby creating a cavity in the article.

A process for molding a hollow structure comprising the steps of: a. Forming a mandrel in a shape of a proposed cavity from a water-soluble substance capable of withstanding temperatures and pressures from a predetermined compression molding process; b. Positioning the mandrel in a suitable mold for forming an article which includes the mandrel within the article; and, c. Removing the mandrel by loosening and dissolving the mandrel with a water solution, thereby creating a cavity in the article.

Described herein are methods and systems for forming metal interconnect layers (MILs) on engineered templates and transferring these MILs to device substrates. This “off-device” approach of forming MILs reduces the complexity and costs of the overall process, allows using semiconductor processes, and reduces the risk of damaging the device substrates. An engineered template is specially configured to release a MIL when the MIL is transferred to a device substrate. In some examples, the engineered template does not include barrier layers and/or adhesion layers. In some examples, the engineered template comprises a conductive portion to assist with selective electroplating. Furthermore, the same engineered template may be reused to form multiple MILs, having the same design. During the transfer, the engineered template and device substrate are stacked together and then separated while the MIL is transitioned from the engineered template to the device substrate.