An imprint system transfers a pattern formed on a mold to an imprint material supplied onto a substrate and includes: a formation unit configured to form a desired substrate-side mark including a predetermined material by applying the predetermined material onto the surface of the substrate and then transferring the substrate-side mark on the predetermined material and processing the substrate-side mark, wherein a difference in a predetermined optical property between the predetermined material and the imprint material is larger than a difference in the predetermined optical property between the imprint material and the substrate; and an alignment unit configured to align the substrate-side mark including the predetermined material and a mold-side mark provided on the mold.

An example of a method of micro-transfer printing comprises providing a micro-transfer printable component source wafer, providing a stamp comprising a body and spaced-apart posts, and providing a light source for controllably irradiating each of the posts with light through the body. Each of the posts is contacted to a component to adhere the component thereto. The stamp with the adhered components is removed from the component source wafer. The selected posts are irradiated through the body with the light to detach selected components adhered to selected posts from the selected posts, leaving non-selected components adhered to non-selected posts. In some embodiments, using the stamp, the selected components are adhered to a provided destination substrate. In some embodiments, the selected components are discarded. An example micro-transfer printing system comprises a stamp comprising a body and spaced-apart posts and a light source for selectively irradiating each of the posts with light.

A stamp for micro-transfer printing comprises a rigid support having a support coefficient of thermal expansion (support CTE). Pedestals are disposed on (e.g., directly on and in contact with) the rigid support. Each of the pedestals is spatially separated from any other of the pedestals. The pedestals have a pedestal coefficient of thermal expansion (pedestal CTE) and the pedestal CTE is greater than the support CTE. Posts are disposed on (e.g., directly on and in contact with) each of the pedestals. Each post has a post coefficient of thermal expansion (post CTE) that is greater than the support CTE.

Embodiments of the present disclosure relate to a transparent substrate, a method for preparing the same, and an OLED display device. A transparent substrate includes a first transparent film, and a second transparent film arranged on the first transparent film. An interface between the first transparent film and the second transparent film is provided with a light scattering structure.

The invention relates to a method for applying a material (30) to a fiber composite component within an application region (13) of the fiber composite component, the fiber composite component being produced from a fiber composite material having a fiber material (11) and a matrix material (12), the method comprising the following steps: providing at least one monofilament woven fabric (20), in which a plurality of or all threads each consist of a single filament, arranging the at least one monofilament woven fabric (20) on a fiber preform (10) in the application region (13), which fiber preform is formed from the fiber material (11) of the fiber composite material, curing, in a common process step, the matrix material (12) of the fiber composite material, which matrix material embeds the fibers material (11) of the fiber preform (10), and a matrix material (12) embedding the monofilament woven fabric (20), thereafter the matrix material (12) of the fiber preform (10) and the matrix material (12) of the monofilament woven fabric (20) being at least partially cured, tearing off the monofilament woven fabric (20) integrally bonded to the fiber preform (10), andapplying the material (30) in the application region (13) after the monofilament woven fabric (20) has been torn off.

The invention relates to a method for creating a surface structure on a mold, wherein first structural elements are created using a laser structuring process in a first step, and second structural elements, which are smaller than the first structural elements, are created using an anodic oxidation process in another step following the laser structuring process. The invention further relates to a mold of said type and finally to a plastic film or a plastic component having a surface structure as well as to a method for the production thereof.

A imprint method includes contacting the pattern formed on the mold M with the imprint material R supplied to a shot on the substrate W; and detecting a plurality of alignment marks AMM and AMW in the contacting while changing a position of a detector for detecting the plurality of alignment marks AMM and AMW formed on the shot on the substrate W in accordance with a progress of filling of the imprint material R into the pattern formed on the mold M.

A stamp for micro-transfer printing includes a support having a support stiffness and a support coefficient of thermal expansion (CTE). A pedestal layer is formed on the support, the pedestal layer having a pedestal layer stiffness that is less than the support stiffness and a pedestal layer coefficient of thermal expansion (CTE) that is different from the support coefficient of thermal expansion (CTE). A stamp layer is formed on the pedestal layer, the stamp layer having a body and one or more protrusions extending from the body in a direction away from the pedestal layer. The stamp layer has a stamp layer stiffness that is less than the support stiffness and a stamp layer coefficient of thermal expansion that is different from the support coefficient of thermal expansion.

The present disclosure relates to a replica film of a real material, a method for producing the same, and an automotive part comprising the same. In detail, the replica film of a real material may include: a base material layer; and a resin layer disposed on the base material layer, having a first surface facing the base material layer and a second surface, opposite the first surface, having the same surface pattern as a surface pattern of the real material.

A method and an apparatus for producing a three-dimensional decoration piece that does not damage the tacky bonding or adhesion strength of the lower layer material of the decoration piece. The method includes putting an upper layer material on a first table operating as cathode; lowering an upper mold operating as anode onto the first table, emitting a high frequency wave for dielectric heating; stopping the high frequency dielectric heating; moving a second table carrying a lower layer material having a tacky bonding property to below the upper mold; and lowering said upper mold onto the second table. In the apparatus, the second table or the lower mold is provided on the top surface thereof with recessed sections that are transversally and inwardly separated from a position where an edge of the first machining means contacts, by 0.2 mm to 1 mm; and a cushion member being arranged in the respective recessed sections.