A method for forming an antislip material. A flexible thermoplastic carrier is provided. A hot release surface is provided. Provided is a first layer of discrete thermoplastic particles, sitting on the hot release surface. The discrete particles are above their softening temperatures, providing in the first layer a tackiness. The method includes contacting the carrier with the tacky first layer for sticking the first layer to the carrier, and thereafter removing the carrier, and therewith the tacky first layer stuck to the carrier, from the release surface. Thereby the carrier is provided with a hot, preferably discontinuous and/or elastomeric antislip coating. With a heat energy of the hot coating a bond is formed between the carrier and the coating. The removing of the carrier includes pulling the carrier out of the contact with a pulling-out force. The temperature of the hot release surface is above the melting temperature of the carrier. The carrier would be spoiled, if heated completely to the temperature of the release surface and simultaneously pulled with the pulling-out force. Therefore the contacting time is kept shorter than a minimum time required by a heat of the hot release surface for spoiling the carrier. Flat-topped roughening projections can be included in the antislip coating.

A method for forming an antislip material. A flexible thermoplastic carrier is provided. A hot release surface is provided. Provided is a first layer of discrete thermoplastic particles, sifting on the hot release surface. The discrete particles are above their softening temperatures, providing in the first layer a tackiness. The method includes contacting the carrier with the tacky first layer for sticking the first layer to the carrier, and thereafter removing the carrier, and therewith the tacky first layer stuck to the carrier, from the release surface. Thereby the carrier is provided with a hot, preferably discontinuous and/or elastomeric antislip coating. With a heat energy of the hot coating a bond is formed between the carrier and the coating. The removing of the carrier includes pulling the carrier out of the contact with a pulling-out force. The temperature of the hot release surface is above the melting temperature of the carrier. The carrier would be spoiled, if heated completely to the temperature of the release surface and simultaneously pulled with the pulling-out force. Therefore the contacting time is kept shorter than a minimum time required by a heat of the hot release surface for spoiling the carrier. Flat-topped roughening projections can be included in the antislip coating.

A liquid-repellent plastic molded body 1 according to the present invention has a liquid-repellent surface. The liquid-repellent surface has a re-entrant structure surface formed by an array of pillars 20 each having a head portion 20a with an enlarged diameter. At least a part of the re-entrant structure surface has a fluorine-containing surface in which fluorine atoms are distributed.

A method for producing a component includes forming a component body having a surface by an additive build-up operation from a hardenable material which is built up in an additive manner or providing the component body having the surface which is formed by the additive build-up operation from the hardenable material which is built up in the additive manner. The method further includes hardening the surface of the component body and forming a surface texture on the surface of the component body prior to the hardening of the surface of the component body and/or during the hardening of the surface of the component body.

Article (9,19) comprising a substrate (10, 20) comprising a polymer and having first (11,21) and second (12, 22) opposed major surfaces. The first major surface (11, 21) has first surface regions (13, 23) with first nanoparticles (14a, 14b, 14c, 14d, 24a, 24b, 24c, 24d) partially embedded into the first major surface (11, 21), and one of •(a) second surface regions (15) free of nanoparticles; or •(b) second surface regions (25) with at least second nanoparticles (28) on the first major surface (11, 21) or partially embedded into the first major surface (11, 21). The first surface regions (13, 23) have a first average surface roughness, R.sub.a1, of at least 20 nm, wherein the second surface regions (15, 25) have a second average surface roughness, R.sub.a2, of less than 100 nm, wherein the first average surface roughness, R.sub.a1, is greater than the second average surface roughness, R.sub.a2, and wherein there is an absolute difference between the first and second average surface roughness of at least 10 nm.

A stamp for micro-transfer printing includes a support having a support stiffness and a support coefficient of thermal expansion (CTE). A pedestal layer is formed on the support, the pedestal layer having a pedestal layer stiffness that is less than the support stiffness and a pedestal layer coefficient of thermal expansion (CTE) that is different from the support coefficient of thermal expansion (CTE). A stamp layer is formed on the pedestal layer, the stamp layer having a body and one or more protrusions extending from the body in a direction away from the pedestal layer. The stamp layer has a stamp layer stiffness that is less than the support stiffness and a stamp layer coefficient of thermal expansion that is different from the support coefficient of thermal expansion.

A kit including a plurality of interior paving blocks and a plurality of edge paving blocks.

A method for treating a plastic block comprising using heat to embed a UV resistant material into an outer face of the plastic block wherein, once embedded, the UV resistant material provides a coating on the outer face. A method for treating a plastic block comprising using compressive force to embed a UV resistant material into an outer face of the plastic block wherein, once embedded, the UV resistant material provides a coating on the outer face.

A method for producing a helical casting pattern. The method including: providing a pattern body having a longitudinal axis, a cavity extending in the direction of the longitudinal axis, and a pattern body wall that surrounds the cavity; providing a processing tool for creating a recess; arranging the pattern body and the processing tool such that the processing tool extends at least partially through the pattern body wall in the radial direction with respect to the longitudinal axis; and rotatably driving at least one of the processing tool and the pattern body about one of the longitudinal axis of the pattern body and an axis parallel thereto, relative to one another, with a relative movement between the pattern body and the processing tool in a direction parallel to the longitudinal axis being produced one of continuously or at least intermittently during or in alternation with the relative rotational movement.

A stamp for micro-transfer printing includes a support having a support stiffness and a support coefficient of thermal expansion (CTE). A pedestal layer is formed on the support, the pedestal layer having a pedestal layer stiffness that is less than the support stiffness and a pedestal layer coefficient of thermal expansion (CTE) that is different from the support coefficient of thermal expansion (CTE). A stamp layer is formed on the pedestal layer, the stamp layer having a body and one or more protrusions extending from the body in a direction away from the pedestal layer. The stamp layer has a stamp layer stiffness that is less than the support stiffness and a stamp layer coefficient of thermal expansion that is different from the support coefficient of thermal expansion.