The invention relates to a method for producing strapping. A strapping band (4) is first guided about at least one packaging piece, tightened, and equipped with a closure at band ends (4a, 4b) to be connected in a closure unit (1). Furthermore, at least one sensor (7) connected to a control unit (8) is provided in the closure unit (1). One or more closure parameters are detected by means of the control unit (8) using the sensor (7), and the closure unit (1) is correspondingly actuated. According to the invention, the sensor (7) is designed as a load cell (7) which is let into a compression ram (6a, 6b) of the closure unit (1).

A microwave heating device includes a variable frequency microwave power supply, a waveguide launcher, and a fixture to contain a material to be heated, with the fixture located directly adjacent to the end of the launcher. All heating occurs in the near-field region. This condition may be insured by keeping the thickness of the fixture or workpiece under one wavelength (at all microwave frequencies being used). The launcher is preferably a horn or waveguide configured to apply the microwave power to a small area to perform spot curing or repair operations involving adhesives and composites. The spot curing may secure components in place for further handling, after which a thermal or oven treatment will cure the remaining adhesive to develop adequate strength for service. A related method is also disclosed.

One exemplary aspect relates to a process and apparatus for selectively changing adhesion strength between a flexible substrate and a carrier at specific locations to facilitate shipping and subsequent removal of the flexible substrate from the carrier. The process includes providing a flexible substrate comprising a plurality of integrated circuits thereon providing a carrier for the flexible substrate and adhering the flexible substrate to the carrier by creating an interface between the flexible substrate and the carrier. The process further includes changing the adhesion force between the flexible substrate and the carrier at selected locations by non-uniform treatment of the interface between the flexible substrate and the carrier with an electromagnetic radiation source (e.g. a laser, flashlamp, high powered LED, an infrared radiation source or the like) so as to decrease or increase the adhesion force between a portion of the flexible substrate and the carrier at the selected location.

A preheating arrangement includes a preheating device defining a first plane by a first centerline along a first axis and a second centerline along a second axis perpendicular to the first axis. A first preheating structure is asymmetric with respect to the first and/or the second centerline. A second preheating structure is oriented like the first preheating structure such that, when viewed along a third axis perpendicular to the first plane, the preheating structures are arranged one above the other. A first actuator rotates the preheating device between first and second positions and the preheating structures in the first position have a first orientation and in the second position a second orientation rotated around the axis of asymmetry by 180° or in which they are rotated by an angle α in the range of 0°<α<360°, or 90°≤α≤270° or α=180° around the third axis compared to the first orientation.

The invention relates to a process for the production of at least two-layer thermoplastic sheets via thermal welding of at least one thinner thermoplastic sheet with density (D1) and of at least one second thinner thermoplastic sheet with density (D2), where the density (D1) of the first thinner thermoplastic sheet is smaller than the density (D2) of the second thinner thermoplastic sheet. The process introduces at least one first heating element and at least one second heating element along mutually offset planes between the two thinner thermoplastic sheets, where the surfaces of the thinner thermoplastic sheets do not touch the surfaces of the heating elements. The first heating element transfers a quantity of energy (E1) to the surface of the first thinner thermoplastic sheet, and the second heating element transfers a quantity of energy (E2) to the surface of the second thinner thermoplastic sheet, where the quantity of energy (E1) is smaller than the quantity of energy (E2).

A method for bonding composite substrates includes coupling a first co-cure prepreg layer having a first off-set amine to epoxide molar ratio onto a surface of a first composite substrate and coupling a second co-cure prepreg layer having a second off-set amine to epoxide molar ratio onto a surface of a second composite substrate. The first and second composite substrates are cured to the first and second co-cure prepreg layers, respectively, using a first cure cycle (including B-stage and cure temperatures) to form a first and a second co-cure prepreg layer portion. The method further includes coupling the first co-cure prepreg layer portion to the second co-cure prepreg layer portion and applying a second cure cycle to cure the first co-cure prepreg layer portion of the first composite substrate to the second co-cure prepreg layer portion of the second composite substrate to form a monolithic covalently bonded composite structure.

A glueless dustless composite flooring material system providing PVC-based flooring having layers providing different qualities of hardness, wear-resistance, sound deadening, and decorative patterns, avoiding the use of moisture-susceptible compressed dust filler, with layers fused together, avoiding the manufacturing complexity and delamination risks of using glue or adhesive, with a quickly-cured, UV-cured top coating providing long-lasting high performance and shortening and simplifying the manufacturing, which can be done in a sheet-form, essentially continuous-run manner, with an ability to quickly and simply change the optional design printing and texturing produced, and having an optional underlayment layer.

A method for welding at least two parts including a thermoplastic material and having respective surfaces to be welded, including: inserting an insert between the surfaces to be welded of the two parts; generating heat via the insert; wherein the insert moves in relation to the parts to be welded in a welding direction. Also, an installation adapted for implementation of this method.

An adhesive hook includes a base which has a bottom for fixing, an outer surface, and a hook provided at the outer surface. The bottom of the base is fixed on an external surface by means of an adhesive, and the adhesive is a curable adhesive. The structure of the adhesive hook is simple, and the curing speed of the curable adhesive is fast. After the curing process, the load bearing of the hook is larger than 1 Kg/cm2. Further, the adhesive hook has high cohesion strength after the adhesive is cured, and no remain is pasted on the external surface or the base after the hook is removed. The base can be recoated with new adhesive to reuse, which reduces cost and achieves recycling.

A residential or commercial building, structure, or building component can include an exterior member, interior member, and plurality of cross-members spatially disposed therebetween. Each of the exterior member, interior member, cross-members can be formed from a multi-layered stack of polymeric material made by a layered three-dimensional printing process, and all can be monolithically integrated. An exterior surface region of the exterior member can have an integrally formed surface finish. Overlying finishing or connective layers can be added. The exterior and interior members can be configured in a parallel arrangement to form a rectangular or curve shaped building block. A fill material can be disposed into openings between the exterior and interior members, and an interior surface region at the interior member can include a cavity configured for an electrical box, plumbing, or a sensing device.