Patent classifications
B29C65/58
System, method, and apparatus for attaching structures
Apparatuses, methods, and systems are disclosed for attaching structures. One system includes: a device having a first structure attached to a second structure; a first polymer coupled to the first structure, wherein the first polymer has a first temperature profile and a first shape; and a second polymer coupled to the second structure. The second polymer has a second temperature profile and a second shape. The second shape interlocks the first shape. The first polymer and the second polymer secure the first structure to the second structure in response to the first polymer and the second polymer being in a first temperature range. The first polymer and the second polymer release the first structure from the second structure in response to the first polymer and the second polymer being in a second temperature range different from the first temperature range.
TECHNIQUE FOR HANDLING DICED WAFERS OF INTEGRATED CIRCUITS
A technique for handling an integrated circuit/tape assembly having a plurality of integrated circuits supported by underlying dicing tape involves placing the integrated circuit/tape assembly on a bottom file frame carrier (FFC) frame having structure (e.g., an inner rim or flexible pegs), placing a top FFC frame having a central opening over the integrated circuit/tape assembly, and mating the top and bottom FFC frames such that the dicing tape is pulled over the structure thereby laterally stretching the dicing tape, which breaks wafer saw bows holding the integrated circuits together. The lateral stretching of the dicing tape increases distance between adjacent integrated circuits in at least two mutually orthogonal lateral directions, thereby inhibiting the adjacent integrated circuits from colliding during shipment or storage for subsequent processing. The resulting assembly can be thinner than conventional FFC configurations, which results in more efficient shipment and storage.
TECHNIQUE FOR HANDLING DICED WAFERS OF INTEGRATED CIRCUITS
A technique for handling an integrated circuit tape assembly having a plurality of integrated circuits supported by underlying dicing tape involves placing the integrated circuit tape assembly on a film frame carrier (FFC) frame, stretching the dicing tape while on the FFC frame, and securing the stretched dicing tape by engaging a spring ring with the dicing tape and FFC frame. Adjacent integrated circuits are thereby inhibited from colliding during shipment or storage for subsequent processing.
DEFLECTING MEMBER FOR MAKING FIBROUS STRUCTURES
A deflection member that includes a reinforcing member that includes a resin coating, and at least one tile fastened to the resin coating.
Pipe coupler and coupling methods
A pipe coupler has: an axis; and a body portion surrounding the axis. A circumferentially segmented collar extends from a first axial end of the body portion and has an inner diameter surface and an outer diameter surface. A plurality of fingers project from a second axial end of the body portion, axially opposite the first end and have inward radial projections.
Pipe coupler and coupling methods
A pipe coupler has: an axis; and a body portion surrounding the axis. A circumferentially segmented collar extends from a first axial end of the body portion and has an inner diameter surface and an outer diameter surface. A plurality of fingers project from a second axial end of the body portion, axially opposite the first end and have inward radial projections.
LOCK FASTENER
[Object] To provide lock fasteners that can be easily manufactured to have great fastening ability.
[Solution] A lock fastener includes a touch fastener and a base member 4 insert-molded to the touch fastener. The base member 4 is formed with a space 32 adapted to be filled with a resin material at a time of insert-molding, and the space 32 includes an opening 38-41 formed in a surface 25 of the base member 4. The opening 38-41 is surrounded by a peripheral wall part 45 of the surface 25. The peripheral wall part 45 is adapted to abut a base of the touch fastener at the time of insert molding and to serve as a bank for preventing the resin material filled into the space 32 from leaking.
Assembly and Method of Coupling Pipes
A jig assembly and method of use are provided for positioning and re-rounding pipes for welding. The jig assembly comprises a first jaw assembly and a second jaw assembly which position and move a coupling onto one pipe then the second pipe for subsequent welding.
Assembly and Method of Coupling Pipes
A jig assembly and method of use are provided for positioning and re-rounding pipes for welding. The jig assembly comprises a first jaw assembly and a second jaw assembly which position and move a coupling onto one pipe then the second pipe for subsequent welding.
Assembly and Method of Coupling Pipes
A jig assembly and method of use are provided for positioning and re-rounding pipes for welding. The jig assembly comprises a first jaw assembly and a second jaw assembly which position and move a coupling onto one pipe then the second pipe for subsequent welding.