Patent classifications
B29C67/04
NITROGEN-CONTAINING POROUS CARBON MATERIAL, AND CAPACITOR AND MANUFACTURING METHOD THEREOF
A nitrogen-containing porous carbon material, and a capacitor and a manufacturing method thereof are provided. A carbon material, a macromolecular material and a modified material are mixed into a preform. The modified material includes nitrogen. A formation process is performed on the preform to obtain a formed object. High-temperature sintering is performed on the formed object to decompose and remove a part of the macromolecular material, while the other part of the macromolecular material and the carbon material together form a backbone structure including a plurality of pores. As such, the nitrogen becomes attached to the backbone structure to form a hydrogen-containing functional group to further obtain the nitrogen-containing porous carbon material. The nitrogen-containing porous carbon material may form a first nitrogen-containing porous carbon plate and a second nitrogen-containing porous carbon plate, which are placed in seawater to form a storage capacitor for seawater.
Method for processing PAEK and articles manufactured from the same
A process for manufacturing a three-dimensional object from a powder by selective sintering the powder using electromagnetic radiation. The powder includes recycled PAEK. In one embodiment, the powder includes recycled PEKK. In one embodiment, the powder includes first recycle PEKK and second recycle PEKK. In one embodiment, the powder consists essentially of recycled PEKK. The process may include the step of maintaining a bed of a selective laser sintering machine at approximately 300 degrees Celsius and applying a layer of the powder to the bed. The average in-plane tensile strength of the three-dimensional object is greater than that of a three-dimension object manufactured by selective sintering using a powder including an unused PEKK powder.
Method for processing PAEK and articles manufactured from the same
A process for manufacturing a three-dimensional object from a powder by selective sintering the powder using electromagnetic radiation. The powder includes recycled PAEK. In one embodiment, the powder includes recycled PEKK. In one embodiment, the powder includes first recycle PEKK and second recycle PEKK. In one embodiment, the powder consists essentially of recycled PEKK. The process may include the step of maintaining a bed of a selective laser sintering machine at approximately 300 degrees Celsius and applying a layer of the powder to the bed. The average in-plane tensile strength of the three-dimensional object is greater than that of a three-dimension object manufactured by selective sintering using a powder including an unused PEKK powder.
METHOD FOR MANUFACTURING COMPOSITE PRODUCT FROM CHOPPED FIBER REINFORCED THERMOSETTING RESIN BY 3D PRINTING
A method for manufacturing a composite product, including: 1) preparing a composite powder including 10-50 v. % of a polymer adhesive and 50-90 v. % of a chopped fiber; 2) shaping the composite powder by using a selective laser sintering technology to yield a preform including pores; 3) preparing a liquid thermosetting resin precursor, immersing the preform into the liquid thermosetting resin precursor, allowing a liquid thermosetting resin of the liquid thermosetting resin precursor to infiltrate into the pores of the preform, and exposing the upper end of the preform out of the liquid surface of the liquid thermosetting resin precursor to discharge gas out of the pores of the preform; 4) collecting the preform from the liquid thermosetting resin precursor and curing the preform; and 5) polishing the preform obtained in 4) to yield a composite product.
METHOD FOR MANUFACTURING COMPOSITE PRODUCT FROM CHOPPED FIBER REINFORCED THERMOSETTING RESIN BY 3D PRINTING
A method for manufacturing a composite product, including: 1) preparing a composite powder including 10-50 v. % of a polymer adhesive and 50-90 v. % of a chopped fiber; 2) shaping the composite powder by using a selective laser sintering technology to yield a preform including pores; 3) preparing a liquid thermosetting resin precursor, immersing the preform into the liquid thermosetting resin precursor, allowing a liquid thermosetting resin of the liquid thermosetting resin precursor to infiltrate into the pores of the preform, and exposing the upper end of the preform out of the liquid surface of the liquid thermosetting resin precursor to discharge gas out of the pores of the preform; 4) collecting the preform from the liquid thermosetting resin precursor and curing the preform; and 5) polishing the preform obtained in 4) to yield a composite product.
METHOD FOR PREPARING UNSINTERED POLYTETRAFLUOROETHYLENE FILM AND POROUS FILM THEREOF
A method for preparing an unsintered PTFE film capable of being continuously formed and with uniform density distribution and high density. The method for preparing the unsintered PTFE film includes filling a mixture obtained by adding a forming aid to PTFE fine powder in an extrusion forming die, extruding the filled mixture from the extrusion forming die to produce an extrusion forming body, rolling the extrusion forming body with a roll to produce a forming aid-removed film without the forming aid, and pinching the forming aid-removed film into a pinch roll made of a rubber roll formed by coating rubber on a metal shaft core at room temperature and compressing the forming aid-removed film so that thickness of the forming aid-removed film is reduced and density thereof is above 2.0 g/cm.sup.3.
Method of manufacturing semiconductor device, semiconductor device, and power conversion device
A method of manufacturing a semiconductor device includes providing, in a housing, an insulating substrate having a metal pattern, a semiconductor chip, a sinter material applied on the semiconductor chip, and a terminal, providing multiple granular sealing resins supported by a grid provided in the housing, heating an inside of the housing until a temperature thereof reaches a first temperature higher than a room temperature and thereby discharging a vaporized solvent of the sinter material out of the housing via a gap of the grid and a gap of the sealing resins, and heating the inside of the housing until the temperature thereof reaches a second temperature higher than the first temperature and thereby causing the melted sealing resins to pass the gap of the grid and form a resin layer covering the semiconductor chip.
Resonance Based Light Valve System
An additive manufacturing system includes a high power laser to form a high fluence laser beam at a first wavelength. The systems includes a 2D patternable light valve having a resonance based structure responsive to a write beam.
Method for increasing the difference between the melting temperature and the crystallization temperature of a polyamide powder
A method for reducing the crystallization temperature and the melting temperature of a polyamide powder resulting from the polymerization of at least one predominant monomer, in which the reduction in the crystallization temperature is greater than the reduction in the melting temperature, the method including a step of polymerization of the at least one predominant monomer with at least one different minor comonomer polymerized according to the same polymerization process as the at least one predominant monomer, the at least one minor comonomer being chosen from aminocarboxylic acids, diamine/diacid pairs, lactams and/or lactones, and the at least one minor comonomer representing from 0.1% to 20% by weight of the total blend of the monomers(s) and comonomer(s), preferably from 0.5% to 15% by weight of the total blend, preferably from 1% to 10% by weight of the total blend.
Method for increasing the difference between the melting temperature and the crystallization temperature of a polyamide powder
A method for reducing the crystallization temperature and the melting temperature of a polyamide powder resulting from the polymerization of at least one predominant monomer, in which the reduction in the crystallization temperature is greater than the reduction in the melting temperature, the method including a step of polymerization of the at least one predominant monomer with at least one different minor comonomer polymerized according to the same polymerization process as the at least one predominant monomer, the at least one minor comonomer being chosen from aminocarboxylic acids, diamine/diacid pairs, lactams and/or lactones, and the at least one minor comonomer representing from 0.1% to 20% by weight of the total blend of the monomers(s) and comonomer(s), preferably from 0.5% to 15% by weight of the total blend, preferably from 1% to 10% by weight of the total blend.