Methods, systems, and apparatus for multi-scale stereolithography. The apparatus includes a light source for providing a laser beam having a first shape and a first size. The apparatus includes a dynamic aperture having multiple apertures that are of the same or different sizes or shapes. The dynamic aperture is configured to receive the laser beam and modify at least one of the shape or the size of the laser beam. The apparatus includes a platform for holding an object to be printed. The apparatus includes a processor connected to at least one of the light source, the dynamic aperture or the platform. The processor is configured to move the platform to direct the laser beam or direct the laser beam to cure resin onto the object to be printed using a first aperture of the multiple apertures to form the object.

Methods, systems, and apparatus for multi-scale stereolithography. The apparatus includes a light source for providing a laser beam having a first shape and a first size. The apparatus includes a dynamic aperture having multiple apertures that are of the same or different sizes or shapes. The dynamic aperture is configured to receive the laser beam and modify at least one of the shape or the size of the laser beam. The apparatus includes a platform for holding an object to be printed. The apparatus includes a processor connected to at least one of the light source, the dynamic aperture or the platform. The processor is configured to move the platform to direct the laser beam or direct the laser beam to cure resin onto the object to be printed using a first aperture of the multiple apertures to form the object.

A method for providing control data for a generative layer construction device has a first step of accessing a data record which, at least for a partial region of an object cross section, specifies in which temporal sequence an energy beam bundle is to be moved in scanning lines over the places of this partial region to scan the buildup material. In a second step, the data record is changed such that in at least one of the layers for the respective partial region of an object cross-section, a check is carried out to determine whether the scan time required to scan the buildup material along a scanning line falls below a predefined minimum duration tmin and either a lower energy density of the energy beam bundle during scanning of the buildup material along this scanning line is specified and/or a wait time is specified before the energy beam bundle is moved along a further scanning line.

An apparatus for producing reinforcing elements for shoes, bags or orthopedic applications comprises a first powder application apparatus, at least one downstream first compounding device, another second powder application apparatus as well as a second compounding device. Such a modular structure allows for producing different types of reinforcing elements in a simple manner.

Improved soles and insoles for shoes, in particular sports shoes, are described. In an aspect, a sole for a shoe, in particular a sports shoe, with at least a first and a second surface region is provided. The first surface region comprises expanded thermoplastic polyurethane (“TPU”). The second surface region is free from expanded TPU.

Improved soles and insoles for shoes, in particular sports shoes, are described. In an aspect, a sole for a shoe, in particular a sports shoe, with at least a first and a second surface region is provided. The first surface region comprises expanded thermoplastic polyurethane (“TPU”). The second surface region is free from expanded TPU.

The present disclosure relates to a method of fabricating a liquid leak sensor and, more particularly, to a method of fabricating a liquid leak sensor, which is cheap and can be easily fabricated by consecutively disposing a nonconductive layer and a conductive layer and compressing the layers. The method may include shaping a nonconductive mold article having a flat top surface and bottom surface using nonconductive powder, shaping a conductive mold article having a flat top surface and bottom surface using a conductive raw material, alternately stacking the nonconductive mold article and the conductive mold article on a die up and down, shaping a single compressed article by applying pressure to the stacked nonconductive mold article and conductive mold article up and down using presses, sintering the molded compressed article, and performing skiving processing on a side of the sintered compressed article to a given thickness.

The present disclosure relates to a method of fabricating a liquid leak sensor and, more particularly, to a method of fabricating a liquid leak sensor, which is cheap and can be easily fabricated by consecutively disposing a nonconductive layer and a conductive layer and compressing the layers. The method may include shaping a nonconductive mold article having a flat top surface and bottom surface using nonconductive powder, shaping a conductive mold article having a flat top surface and bottom surface using a conductive raw material, alternately stacking the nonconductive mold article and the conductive mold article on a die up and down, shaping a single compressed article by applying pressure to the stacked nonconductive mold article and conductive mold article up and down using presses, sintering the molded compressed article, and performing skiving processing on a side of the sintered compressed article to a given thickness.

A thermal radiation heat dissipation device for an electronic component includes a heat dissipation substrate including a heat dissipation surface having a heat dissipation surface emissivity; and an emissivity modulation layer disposed on the heat dissipation surface including an emissivity modulation layer surface having an emissivity modulation layer surface emissivity. The emissivity modulation layer surface emissivity is greater the heat dissipation surface emissivity.

A thermal radiation heat dissipation device for an electronic component includes a heat dissipation substrate including a heat dissipation surface having a heat dissipation surface emissivity; and an emissivity modulation layer disposed on the heat dissipation surface including an emissivity modulation layer surface having an emissivity modulation layer surface emissivity. The emissivity modulation layer surface emissivity is greater the heat dissipation surface emissivity.