A composition comprising; a) at least one homopolymer or copolymer of vinyl acetate; and b) at least one softener.

A composition comprising; a) at least one homopolymer or copolymer of vinyl acetate; and b) at least one softener.

A method for the manufacture of a component comprises the following steps, in sequence using an additive layer manufacturing process to build a three-dimensional net shape of the component; performing a first abrasive blasting operation on a region of a surface of the component; and performing a second abrasive blasting operation on the region. The angle of incidence of the abrasive on the surface in the first abrasive blasting operation is less than the angle of incidence of the abrasive on the surface in the second abrasive blasting operation.

A method for the manufacture of a component comprises the following steps, in sequence using an additive layer manufacturing process to build a three-dimensional net shape of the component; performing a first abrasive blasting operation on a region of a surface of the component; and performing a second abrasive blasting operation on the region. The angle of incidence of the abrasive on the surface in the first abrasive blasting operation is less than the angle of incidence of the abrasive on the surface in the second abrasive blasting operation.

A method of forming a porous three-dimensional (3D) is disclosed. The method comprises (I) printing a first composition on a substrate (16) with the nozzle (12) of the apparatus (10) to form at least one first filament (14) comprising the first composition, (II) selectively controlling the distance and/or the speed such that the at least one first filament coils on the substrate to give a first layer on the substrate, the first layer comprising a coiled filament, optionally repeating steps I) and II) with independently selected composition(s) for any additional layer(s), and (III) exposing the layer(s) to a solidification condition. A porous three-dimensional (3D) article formed in accordance with the method is also disclosed.

The present disclosure relates to a method of fabricating a liquid leak sensor and, more particularly, to a method of fabricating a liquid leak sensor, which is cheap and can be easily fabricated by consecutively disposing a nonconductive layer and a conductive layer and compressing the layers. The method may include shaping a nonconductive mold article having a flat top surface and bottom surface using nonconductive powder, shaping a conductive mold article having a flat top surface and bottom surface using a conductive raw material, alternately stacking the nonconductive mold article and the conductive mold article on a die up and down, shaping a single compressed article by applying pressure to the stacked nonconductive mold article and conductive mold article up and down using presses, sintering the molded compressed article, and performing skiving processing on a side of the sintered compressed article to a given thickness.

The present disclosure relates to a method of fabricating a liquid leak sensor and, more particularly, to a method of fabricating a liquid leak sensor, which is cheap and can be easily fabricated by consecutively disposing a nonconductive layer and a conductive layer and compressing the layers. The method may include shaping a nonconductive mold article having a flat top surface and bottom surface using nonconductive powder, shaping a conductive mold article having a flat top surface and bottom surface using a conductive raw material, alternately stacking the nonconductive mold article and the conductive mold article on a die up and down, shaping a single compressed article by applying pressure to the stacked nonconductive mold article and conductive mold article up and down using presses, sintering the molded compressed article, and performing skiving processing on a side of the sintered compressed article to a given thickness.

Methods, systems, and apparatus for multi-scale stereolithography. The apparatus includes a light source for providing a laser beam having a first shape and a first size. The apparatus includes a dynamic aperture having multiple apertures that are of the same or different sizes or shapes. The dynamic aperture is configured to receive the laser beam and modify at least one of the shape or the size of the laser beam. The apparatus includes a platform for holding an object to be printed. The apparatus includes a processor connected to at least one of the light source, the dynamic aperture or the platform. The processor is configured to move the platform to direct the laser beam or direct the laser beam to cure resin onto the object to be printed using a first aperture of the multiple apertures to form the object.

Methods, systems, and apparatus for multi-scale stereolithography. The apparatus includes a light source for providing a laser beam having a first shape and a first size. The apparatus includes a dynamic aperture having multiple apertures that are of the same or different sizes or shapes. The dynamic aperture is configured to receive the laser beam and modify at least one of the shape or the size of the laser beam. The apparatus includes a platform for holding an object to be printed. The apparatus includes a processor connected to at least one of the light source, the dynamic aperture or the platform. The processor is configured to move the platform to direct the laser beam or direct the laser beam to cure resin onto the object to be printed using a first aperture of the multiple apertures to form the object.

A method of manufacturing a semiconductor device includes providing, in a housing, an insulating substrate having a metal pattern, a semiconductor chip, a sinter material applied on the semiconductor chip, and a terminal, providing multiple granular sealing resins supported by a grid provided in the housing, heating an inside of the housing until a temperature thereof reaches a first temperature higher than a room temperature and thereby discharging a vaporized solvent of the sinter material out of the housing via a gap of the grid and a gap of the sealing resins, and heating the inside of the housing until the temperature thereof reaches a second temperature higher than the first temperature and thereby causing the melted sealing resins to pass the gap of the grid and form a resin layer covering the semiconductor chip.