The present disclosure relates to a method for manufacturing a body comprising a particle structure fixated in a matrix material, said method comprising the steps of: providing a mixture of a viscous matrix material and particles, subjecting said particles to an acoustic standing wave, so as to arrange at least portion of said particles in a pressure node and/or a pressure antinode of the acoustic standing wave thereby creating a particle structure In said viscous matrix material and fixating said viscous matrix material so as to fixate said particle structure In said matrix material. The disclosure also relates to a body obtained by said method, and to the use of said method in various applications.

A personal electronic device case, and method for making such personal electronic device case, created by a method of bonding a resin-type material to a selected material otherwise unsuitable for protection of a personal electronic device, and carving the resulting composition into a desired shape of personal electronic device case. The resulting phone case is both aesthetically pleasing and offers improved protection for the personal electronic device.

An encapsulated electronic assembly comprises an electronic component and a foamed thermoplastic shell disposed about the electronic component. The foamed thermoplastic shell is formed from a thermoplastic encapsulant comprising a thermoplastic resin and a filler and is foamed with a foaming agent. A method of encapsulating the electronic component to form the encapsulated electronic assembly is also provided. The method includes the steps of melting the thermoplastic encapsulant, foaming the thermoplastic encapsulant, and injection molding the foamed thermoplastic encapsulant about the electronic component to form the foamed thermoplastic shell.

An encapsulated electronic assembly comprises an electronic component and a foamed thermoplastic shell disposed about the electronic component. The foamed thermoplastic shell is formed from a thermoplastic encapsulant comprising a thermoplastic resin and a filler and is foamed with a foaming agent. A method of encapsulating the electronic component to form the encapsulated electronic assembly is also provided. The method includes the steps of melting the thermoplastic encapsulant, foaming the thermoplastic encapsulant, and injection molding the foamed thermoplastic encapsulant about the electronic component to form the foamed thermoplastic shell.

A deposition source evaporating apparatus includes a crucible set for accommodating a deposition source, a spray unit positioned on the crucible set, a heater positioned in the crucible set for heating the crucible set to evaporate the deposition source through the spray unit, and a heat radiation preventing plate surrounding the spray unit for blocking radiation of heat at a side of the spray unit. At least one of the crucible unit and the heat radiation preventing plate includes a carbon fiber composite material.

A deposition source evaporating apparatus includes a crucible set for accommodating a deposition source, a spray unit positioned on the crucible set, a heater positioned in the crucible set for heating the crucible set to evaporate the deposition source through the spray unit, and a heat radiation preventing plate surrounding the spray unit for blocking radiation of heat at a side of the spray unit. At least one of the crucible unit and the heat radiation preventing plate includes a carbon fiber composite material.

The present invention relates to a high heat-resistant carbon nanostructure polymer composite, and further relates to a hybrid composite including carbon fibers (CF) using the high heat-resistant carbon nanostructure polymer composite. More specifically, the present invention relates to the hybrid composite having a stack structure in which a carbon fiber layer and an intermediate material layer are stacked on top of each other, wherein the intermediate material layer has a stack structure of a high heat-resistant carbon nanostructure polymer composite and a polymer. The hybrid composite has secured thermal stability and thus may be used for actual applications.

The present invention relates to a high heat-resistant carbon nanostructure polymer composite, and further relates to a hybrid composite including carbon fibers (CF) using the high heat-resistant carbon nanostructure polymer composite. More specifically, the present invention relates to the hybrid composite having a stack structure in which a carbon fiber layer and an intermediate material layer are stacked on top of each other, wherein the intermediate material layer has a stack structure of a high heat-resistant carbon nanostructure polymer composite and a polymer. The hybrid composite has secured thermal stability and thus may be used for actual applications.

A method for forming a fence panel includes providing a mold including a cavity configured to receive a molten material. The molten material is injected into the cavity of the mold and flows within the cavity of the mold. After injecting the molten material into the cavity of the mold, and with the molten material cooled to harden, a formed fence panel is removed from the cavity of the mold. The formed fence panel includes a first portion having a pattern of apertures extending through the formed fence panel and a second portion having a continuous outer surface at least at a first side of the formed fence panel.

A method for forming a fence panel includes providing a mold including a cavity configured to receive a molten material. The molten material is injected into the cavity of the mold and flows within the cavity of the mold. After injecting the molten material into the cavity of the mold, and with the molten material cooled to harden, a formed fence panel is removed from the cavity of the mold. The formed fence panel includes a first portion having a pattern of apertures extending through the formed fence panel and a second portion having a continuous outer surface at least at a first side of the formed fence panel.