A method for forming a roll core for use in an electrophotographic image forming device according to one example embodiment includes shaping the roll core from a mixture of an uncured elastomer and hollow microparticles. The elastomer of the shaped roll core is cured without permanently expanding hollow microparticles positioned near the outer surface of the shaped roll core. After curing, the hollow microparticles positioned near the outer surface of the shaped roll core are permanently expanded to form the roll core having compressible and resiliently recoverable hollow microparticles extending beyond an outer circumference of the roll core and providing a surface texture to the roll core.

A method of fabricating a formed structure with expandable polymeric shell microspheres. A first plurality of polymeric shell microspheres are heated from an unexpanded state to an expanded state to form a plurality of expanded microspheres. The plurality of expanded microspheres are mixed with an epoxy resin and a second plurality of unexpanded polymeric shell microspheres. The mixture is formed in a shape to create a preform. The preform is wrapped with fiber tape to create a wrapped preform. The wrapped preform is placed in a mold. The mold is heated and the second plurality of unexpanded microspheres expand from an unexpanded state to an expanded state. The mold is cooled and the formed structure is removed from the mold.

A method of fabricating a formed structure with expandable polymeric shell microspheres. A first plurality of polymeric shell microspheres are heated from an unexpanded state to an expanded state to form a plurality of expanded microspheres. The plurality of expanded microspheres are mixed with an epoxy resin and a second plurality of unexpanded polymeric shell microspheres. The mixture is formed in a shape to create a preform. The preform is wrapped with fiber tape to create a wrapped preform. The wrapped preform is placed in a mold. The mold is heated and the second plurality of unexpanded microspheres expand from an unexpanded state to an expanded state. The mold is cooled and the formed structure is removed from the mold.

An insulating structure for an appliance includes an outer layer and an inner layer, wherein an insulating cavity is defined therebetween. A plurality of hollow nano-spheres are disposed within the insulating cavity, wherein each of the hollow nano-spheres includes a diameter in the range of from approximately 50 nanometers to approximately 1000 nanometers and has a wall that defines the internal space, and wherein the wall of each hollow nano-sphere has a thickness that is in a range of from approximately 0.5 nanometers to approximately 100 nanometers. A fill material is disposed in the insulating cavity and wherein the fill material is disposed in the space defined between the plurality of hollow nano-spheres, and wherein the fill material includes at least one of powdered silica, granulated silica, other silica material, aerogel and insulating gas.

A carrier plate for a decorative panel comprising a partly foamed plastic plate on the basis of a filler-admixed polyolefin as a carrier plate for the production of a decorative panel, a method for producing such a plate and its use as a support plate in a decorative panel.

A carrier plate for a decorative panel comprising a partly foamed plastic plate on the basis of a filler-admixed polyolefin as a carrier plate for the production of a decorative panel, a method for producing such a plate and its use as a support plate in a decorative panel.

Lightweight composite structural articles having a shell and core comprising a specially-formulated resin, and methods of manufacturing the same. In particular embodiments, the present invention relates to a composite railroad tie comprising an outer fiber-reinforced polymer shell and a unique core formed from a thermoexpandable resin mixture with microcapsules, which railroad tie is manufactured by extruding or pultruding the shell and core through a specially adapted die having a graded cavity, allowing for controlled expansion of the core as the shell and core are passed through the die.

A chemical mechanical polishing pad is provided containing: a polishing layer having a polishing surface; wherein the polishing layer comprises a first continuous non-fugitive polymeric phase and a second non-fugitive polymeric phase; wherein the first continuous non-fugitive polymeric phase has a plurality of periodic recesses; wherein the plurality of periodic recesses are occupied with the second non-fugitive polymeric phase; wherein the first continuous non-fugitive polymeric phase has an open cell porosity of 6 vol %; wherein the second non-fugitive polymeric phase contains an open cell porosity of 10 vol %; and, wherein the polishing surface is adapted for polishing a substrate.

A chemical mechanical polishing pad is provided containing: a polishing layer having a polishing surface; wherein the polishing layer comprises a first continuous non-fugitive polymeric phase and a second non-fugitive polymeric phase; wherein the first continuous non-fugitive polymeric phase has a plurality of periodic recesses; wherein the plurality of periodic recesses are occupied with the second non-fugitive polymeric phase; wherein the first continuous non-fugitive polymeric phase has an open cell porosity of 6 vol %; wherein the second non-fugitive polymeric phase contains an open cell porosity of 10 vol %; and, wherein the polishing surface is adapted for polishing a substrate.

A method of fabricating a formed structure with expandable polymeric shell microspheres. A first plurality of polymeric shell microspheres are heated from an unexpanded state to an expanded state to form a plurality of expanded microspheres. The plurality of expanded microspheres are mixed with an epoxy resin and a second plurality of unexpanded polymeric shell microspheres. The mixture is formed in a shape to create a preform. The preform is wrapped with fiber tape to create a wrapped preform. The wrapped preform is placed in a mold. The mold is heated and the second plurality of unexpanded microspheres expand from an unexpanded state to an expanded state. The mold is cooled and the formed structure is removed from the mold.