A method of forming a monolithic electron optics component includes providing a dual-nozzle printing head having first and second printing nozzles, heating the dual-nozzle printing head to a desired temperature so that both the first nozzle and the second nozzle are heated to substantially the same, desired temperature, extruding a non-conductive filament material through the first nozzle, and withdrawing a conductive filament material through the second nozzle to form a device component. The desired temperature is typically above a melting temperature of the conductive filament material, above the melting temperature of the non-conducting filament material and lower than the temperature at which the printed device component or object sags under its own weight after printing and bleeding of the non-conducting filament material over the conducting filament material occurs.

A method of forming a monolithic electron optics component includes providing a dual-nozzle printing head having first and second printing nozzles, heating the dual-nozzle printing head to a desired temperature so that both the first nozzle and the second nozzle are heated to substantially the same, desired temperature, extruding a non-conductive filament material through the first nozzle, and withdrawing a conductive filament material through the second nozzle to form a device component. The desired temperature is typically above a melting temperature of the conductive filament material, above the melting temperature of the non-conducting filament material and lower than the temperature at which the printed device component or object sags under its own weight after printing and bleeding of the non-conducting filament material over the conducting filament material occurs.