Patent classifications
B29D11/00807
Method of manufacturing hydrogel ophthalmic devices with electronic elements
The present invention provides methods for forming an ophthalmic lens that can include a media insert and/or electronic components. In particular, the present disclosure provides for adhesion promoting functionalization steps for a biocompatible coating to bind a hydrogel material to a plastic surface or electronic component prior to the polymerization of the hydrogel. In some aspects, the media insert can be used to contain energy sources and/or functional electronic components which may be, for example, in a stacked integrated component configuration to permit a generally arcuate shape that can conform to the anterior surface of an eye.
METHOD FOR MAKING EMBEDDED HYDROGEL CONTACT LENSES
The invention relates to a method for producing embedded hydrogel contact lenses each having a magnetized insert that comprises magnetic particles and is centrally embedded in the bulk hydrogel material of the embedded hydrogel contact lens. During molding, a magnetized insert can be centered and held in position in a lens mold by using a magnet placed below the lens mold. The invention also relates to an embedded hydrogel contact lens produced from a method of the invention.
Multi-piece insert device with locking seal for ophthalmic devices
This invention discloses methods and apparatuses for sealing and encapsulating components on and within a multi-piece insert. In some embodiments, an ophthalmic lens is cast molded from a silicone hydrogel and the component includes a sealed and encapsulated multi-piece insert portion.
Ophthalmic devices with stabilization features
This invention discloses methods and apparatus for forming Ophthalmic Lenses with Stabilizing Features, and more specifically, Ophthalmic Lenses that include an encapsulated Insert Device.
Method of forming a multi-piece insert device with seal for ophthalmic devices
The present invention discloses a method of forming a multi-piece insert for an ophthalmic lens, comprising: forming a insert back curve piece; forming a insert front curve piece; depositing a conductive material onto one or both of the insert front curve piece and the insert back curve piece; attaching an electronic component to one or both of the insert front curve piece and the insert back curve pieces, wherein the attachment is made to the conductive material; placing a material to form a first upon a surface of either or both of the insert front curve piece and the insert back curve piece; and combining the insert back curve piece with the insert front curve piece to form a ophthalmic insert piece, wherein the combining causes the material to seal a cavity interior to the combination of the back curve piece and the front curve piece.
EYE MOUNTABLE DEVICE AND FLEXIBLE ASSEMBLY FOR FABRICATION THEREOF
Techniques and mechanisms for fabrication of an eye mountable device. In an embodiment, an apparatus includes two curved lens portions and a flexible arm structure that extends between, and is anchored to, each of the two curved lens portions. The eye mountable device is formed at least in part by manipulation of the curved lens portions using the arm structure. Flexibility of the arm structure accommodates positioning of one curved lens portion to overlap the other curved lens portion. A lens of the eye mountable device is formed by the curved lens portions. In another embodiment, an enclosure formed by the lens has disposed therein an accommodation actuator.
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
CAMERA MODULE, MOLDED PHOTOSENSITIVE ASSEMBLY AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
Provided are a camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device. The molded photosensitive assembly is assembled with at least one optical lenses to form a camera module. The molded photosensitive assembly includes an imaging assembly, a molded base, and a filter member. The molded base includes a first molded portion and a second molded portion. The first molded portion embeds a part of the imaging assembly. The second molded portion is integrally formed on a first upper surface of the first molded portion, and the second molded portion has a second upper surface and a second outer side surface. A filter member is attached to the second upper surface of the second molded portion, and corresponds to a photosensitive path of the imaging assembly. The second upper surface of the second molded portion is higher than the first upper surface of the first molded portion, so as to define and form an outer space by a second outer side surface of the second molded portion and the first upper surface of the first molded portion.
Method for forming non-flat devices
In a first aspect, the present disclosure relates to a method for designing a pattern of a stress relief layer for a flat device to be transformed into a shape-retaining non-flat device by deformation of the flat device. The flat device (and thus also the non-flat device) may comprise at least two components and at least one electrical interconnection between two components. In a second aspect, the present disclosure is related to a method of manufacturing a shape-retaining non-flat device by deformation of a flat device, wherein the flat device is attached to a patterned stress relief layer designed in accordance with the first aspect of the present disclosure. In preferred embodiments, the stress relief layer is a thermoplastic layer or a layer comprising a thermoplastic material and deformation of the flat device comprises deformation by a thermoforming process, after attachment of the flat device to the stress relief layer.
Method of embedding opto-electronic components in a layer
A method of embedding opto-electronic components in a layer, wherein the components are disposed beside one another to be spaced apart on a carrier, including providing a molding tool having a bearing plate, wherein the bearing plate on a lower side includes resilient bearing regions, bringing the bearing plate by way of the resilient bearing regions to bear on upper sides of the components, filling an intermediate space between the components, the carrier, and the bearing plate with a molding material, curing the molding material to form the layer, and removing the molding tool from the layer and the embedded components.