Manufacturing optoelectronic modules includes supporting a printed circuit board substrate (27) on a first vacuum injection tool (24). The printed circuit board substrate (27) has at least one optoelectronic component mounted thereon and has a solder mask (40) on a surface (46) facing away from the first vacuum injection tool (24). The method includes causing the first vacuum injection tool (24) and a second vacuum injection tool (22) to be brought closer to one another such that a surface (46) of the second vacuum injection tool (22) is in contact with the solder mask (40). Subsequently, a first epoxy (100, 20) is provided, using a vacuum injection technique, in spaces (104) between the upper tool (22) and the solder mask (40).

Lenses and methods for adjusting the focus of a lens include dividing multiple light sensors in a lens into four quadrants. A position of the lens relative to occlusion along a top and bottom edge of the lens is determined based on numbers of bits in respective bit sequences from light sensors in respective regions of the lens. An optimal focal length for the lens is determined based on the position of the lens. The focal length of the lens is adjusted to match the optimal focal length.

A method for mounting functional elements in a lens includes mounting the functional elements on a foil, applying a closed contour alignment surface of an alignment tool having a central opening surrounded by the closed contour on the foil portion opposite to the mounted function elements, applying underpressure on the central opening to maintain the foil portion with the mounted functional elements on the alignment tool, cutting a flap including the foil portion and supporting the functional elements out of the foil, positioning and aligning the flap through actuator, fixing the position of the flap against the adjacent foil surface, embedding the foil with the mounted functional elements in a predetermined distance to the front surface of a mould, and casting and curing the lens with the embedded foil.

A method for mounting functional elements in a lens includes mounting the functional elements on a foil, applying a closed contour alignment surface of an alignment tool having a central opening surrounded by the closed contour on the foil portion opposite to the mounted function elements, applying underpressure on the central opening to maintain the foil portion with the mounted functional elements on the alignment tool, cutting a flap including the foil portion and supporting the functional elements out of the foil, positioning and aligning the flap through actuator, fixing the position of the flap against the adjacent foil surface, embedding the foil with the mounted functional elements in a predetermined distance to the front surface of a mould, and casting and curing the lens with the embedded foil.

The present invention refers to a printed three-dimensional optical component built up from layers of printing ink characterized in that the three-dimensional optical component comprises at least one foil between two consecutive layers. The present invention further relates to a corresponding manufacturing method.

A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.

Electrowetting optical devices can comprise a first electrode at least partially circumscribing a first optical window and a second electrode at least partially circumscribing a second optical window. The second optical window may be aligned with the first optical window in a direction of the optical axis. A central region may be defined by a projection of a footprint of the second optical window. An interface between a first liquid and a second liquid that may be disposed within a containment region may form a lens. In some embodiments, a thickness of a second dielectric portion at least partially circumscribing the central region may be greater than a thickness of a thirst dielectric portion within the central region. In some embodiments, a capacitance per area of the device upon application of a maximum operating voltage may be in a range from about 0.1 pF/mm.sup.2 to about 3.5 pF/mm.sup.2.

A method of manufacturing a chip scale light-emitting diode package is provided. The method of manufacturing chip scale light-emitting diode package includes: manufacturing a lens molding sheet including intaglios on one surface thereof; forming a lens layer having lens portions on one surface thereof and a flat surface on a surface opposite thereto by applying a light-transmitting resin to the intaglios; forming an adhesive layer on the flat surface of the lens layer; arranging light-emitting diode chips, each having a first surface and a second surface opposite to the first surface, on the adhesive layer in such a way that the light-emitting diode chips correspond to the lens portions and the second surface is attached to the adhesive layer, wherein a first electrode pad and a second electrode pad are formed on the first surface; and manufacturing a chip array sheet by forming a molding part on the adhesive layer to cover outer surfaces of the light-emitting diode chips.

A method of integrating a lidar system in a vehicle involves disposing one or more receive portions of the lidar system in one or more first locations of the vehicle and fabricating an integrated transmit portion of the lidar system to be disposed in a second location of the vehicle. The fabricating includes injection molding optical components to light emitting devices affixed to a printed circuit board to form a transmit portion and overmolding one or more additional elements to the transmit portion. The overmolding includes performing one or more additional injection molding processes.

An ophthalmic apparatus includes a support structure; a substrate included with the support structure; at least one conductor disposed on the substrate; and a hermetic barrier structure disposed over the at least one conductor. The hermetic barrier structure further includes a stack of alternating flexible insulating material and superelastic metal alloy layers.