An additive manufacturing direct writing method of producing a magnetic pattern on a substrate by extruding one or more filaments of a magnetic ink compound through a nozzle at an extrusion speed on to the substrate where there is a relative speed between the nozzle and the target substrate, and curing the plurality of filaments of magnetic ink compound using UV light and/or heat. A unipolar magnetic pattern can be produced by applying a magnetic field strength to the cured magnetic pattern. A bipolar magnetic pattern is produced by folding a unipolar magnetic pattern in half about a fold crease on the substrate, creating a sandwich of alternating magnetic elements between the substrate. The magnetic flux density can be lateral or perpendicular to the substrate. A magnetic position sensor system includes the magnetic pattern and a magnetic sensor.

The application relates to a plastic moulding for a moulding arrangement including a housing for another plastic moulding of the moulding arrangement, wherein the housing is formed within a moulding body of the plastic moulding including a weldable material in at least some areas. It is contemplated therein that a contact element is arranged on the moulding body, the contact element at least partly including an electrically conductive material and limiting a recess of the moulding body adjoining the housing in at least some areas. The application further relates to a moulding arrangement and a method for producing a moulding arrangement.

The present invention relates to a method of manufacturing a cellulosic film (cellulose film), particularly a cellulosic food packing film, especially a detectable cellulosic film, which cellulosic film comprises detectable particles incorporated therein, as well as to the cellulosic film thus produced and to its applications and usages (i.e. its use).

A method for making an object (e.g., a projectile) includes preparing a premixture of a first metal powder having a first particle size, a second metal powder having a second particle size, and a polymer binder; compressing the premixture in a mold at a pressure of about 75 psi to about 500 psi and a temperature of about 15 C. to about 40 C. to form a projectile preform; and heating the projectile preform at a temperature of about 80 C. to about 350 C. for about 0.5 minutes to about 30 minutes. The polymer binder may include a dry powder coat. The object may have a density between 1 and 4 g/cm.sup.3.

Provided is a reactivatable tile bonding mat installable without cement-based thinset. The reactivatable tile bonding mat may include a top surface and a bottom surface. The top surface and the bottom surface include a polymer hot-melt material. The polymer hot-melt material can be reactivatable by heating. The polymer hot-melt material can be adhesive with regard to a surface of at least one of concrete, wood, stone, tile and vinyl. The polymer hot-melt material creates bonding to the surface upon being heated to a pre-determined temperature. The polymer hot-melt material can be heated by convection heating. The polymer hot-melt material comprises a polyethylene terephthalate (PET) and a filler. The filler can include at least one of calcium carbonate, aragonite, silica, metal flake, and glass. The PET and the filler are mixed in a pre-determined proportion to obtain a polymer hot-melt material having a pre-determined melting temperature.

Exemplary methods for installing tile using a reactivatable tile bonding mat is disclosed. The reactivatable tile bonding mat is placed upon a substantially flat surface. Stone, porcelain or ceramic tile is placed and arranged on the reactivatable tile bonding mat in an aesthetically pleasing fashion, in some cases aided by the use of spacers in the joints between the sides of the tiles. Induction, or some other method of heat, is applied to the upper surfaces of the tiles, to quickly transfer through the tile, causing a polymer hot-melt material embedded in the reactivatable tile bonding mat to melt and adhere to a lower surface of the tiles, forming a strong bond. Upon the tiles fully bonding to the reactivatable tile bonding mat, spacers may be removed and a suitable grout may be applied in the joints between the sides of the tiles.

A resin composition for forming a magnetic member of the present invention, which is used for compression molding, includes a thermosetting resin, magnetic particles, and non-magnetic particles having a lower specific gravity and a smaller cumulative 50% particle diameter D.sub.50 than the magnetic particles, in which the resin composition for forming a magnetic member is solid at 25? C.

The present invention provides a fast-curing molding process for epoxy resin. The method includes the following steps: S1, mixing epoxy resin A glue and a protein-grafted manganese-zinc-iron oxide nanomaterial well into a colloidal state, and grounding the mixture for 10 to 30 min; S2, adding epoxy resin B glue to the mixed colloid in S1, and performing ultrasonic dispersion at 20 to 30? C. for 10 to 30 min; and S3, placing the mixture obtained after ultrasonic dispersion in S2 in a vacuum environment for 20 to 40 min, then taking the mixture out and injecting the mixture into a mold, placing the mold and the mixed colloid into an electromagnetic induction heater, placing the electromagnetic induction heater in a magnetic field environment with a magnetic field intensity of 1 to 1.5 mT for 2 to 3 h, cooling and then taking them out to obtain the cured epoxy resin.

A slurry composition for forming an article using additive manufacturing is provided. The slurry composition comprises a carrier having a viscosity of at least 0.001 cP at normal temperature and pressure. The carrier is adapted to be flowable through a nozzle. The slurry composition further comprises a material selected from the group of a metal-containing material, a ceramic-containing material, an inorganic carbon-containing material, a silica-containing material, and combinations thereof.

The present invention provides a fast-curing molding process for epoxy resin. The method includes the following steps: S1, mixing epoxy resin A glue and a protein-grafted manganese-zinc-iron oxide nanomaterial well into a colloidal state, and grounding the mixture for 10 to 30 min; S2, adding epoxy resin B glue to the mixed colloid in S1, and performing ultrasonic dispersion at 20 to 30? C. for 10 to 30 min; and S3, placing the mixture obtained after ultrasonic dispersion in S2 in a vacuum environment for 20 to 40 min, then taking the mixture out and injecting the mixture into a mold, placing the mold and the mixed colloid into an electromagnetic induction heater, placing the electromagnetic induction heater in a magnetic field environment with a magnetic field intensity of 1 to 1.5 mT for 2 to 3 h, cooling and then taking them out to obtain the cured epoxy resin.