Reactivatable Tile Bonding Mat

Abstract

Provided is a reactivatable tile bonding mat installable without cement-based thinset. The reactivatable tile bonding mat may include a top surface and a bottom surface. The top surface and the bottom surface include a polymer hot-melt material. The polymer hot-melt material can be reactivatable by heating. The polymer hot-melt material can be adhesive with regard to a surface of at least one of concrete, wood, stone, tile and vinyl. The polymer hot-melt material creates bonding to the surface upon being heated to a pre-determined temperature. The polymer hot-melt material can be heated by convection heating. The polymer hot-melt material comprises a polyethylene terephthalate (PET) and a filler. The filler can include at least one of calcium carbonate, aragonite, silica, metal flake, and glass. The PET and the filler are mixed in a pre-determined proportion to obtain a polymer hot-melt material having a pre-determined melting temperature.

Claims

1. A reactivatable tile bonding mat installable without cement-based thinset, the reactivatable tile bonding mat comprising: a top surface; and a bottom surface, wherein the top surface and the bottom surface include a polymer hot-melt material, the polymer hot-melt material having adhesive properties and being reactivatable by heating.

2. The reactivatable tile bonding mat of claim 1, wherein the polymer hot-melt material is adhesive with regard to a surface of at least one of concrete, wood, stone, tile and vinyl.

3. The reactivatable tile bonding mat of claim 2, wherein the polymer hot-melt material creates bonding to the surface upon being heated to a pre-determined temperature.

4. The reactivatable tile bonding mat of claim 3, wherein a strength of the bonding satisfies one or more construction requirements for tile installation.

5. The reactivatable tile bonding mat of claim 1, wherein the top surface and the bottom surface include a heat receptor and the heating includes induction heating.

6. The reactivatable tile bonding mat of claim 5, wherein the heat receptor is embedded into the polymer hot-melt material and includes at least one of metal flake, metallic fiber, powdered steel, and a steel screen mesh.

7. The reactivatable tile boding mat of claim 1, wherein the heating includes convection heating.

8. The reactivatable tile bonding mat of claim 1, wherein the heating is produced by one of a microwave heater and a heat gun.

9. The reactivatable tile bonding mat of claim 1, wherein the polymer hot-melt material comprises a polyethylene terephthalate (PET) and a filler, the filler being at least one of calcium carbonate, aragonite, silica, metal flake, and glass.

10. The reactivatable tile bonding mat of claim 9, wherein the filler is melted into the PET in a pre-determined proportion to obtain the polymer hot-melt material with a pre-determined melting temperature.

11. The reactivatable tile bonding mat of claim 9, wherein the polymer hot-melt material comprises 20-50% by volume of the PET and 50-80% by volume of glass material.

12. The reactivatable tile bonding mat of claim 11, wherein the glass material is made of a ground glass or a recycled windshield glass.

13. The reactivatable tile bonding mat of claim 1, wherein a melting temperature of the polymer hot-melt material is higher than a temperature produced by a floor heating system.

14. The reactivatable tile bonding mat of claim 1, wherein the top surface and the bottom surface include a hydrophobic material, the hydrophobic material causing the reactivatable tile bonding mat to be moisture resistant.

15. The reactivatable tile bonding mat of claim 1, wherein the top surface and the bottom surface further comprise a crack suppressant membrane.

16. The reactivatable tile bonding mat of claim 1, wherein at least one of the top surface and bottom surface comprises a notch pattern.

17. The reactivatable tile bonding mat of claim 16, wherein the notch pattern includes notches inches wide and inches deep and a distance between two neighboring notches is inches.

18. The reactivatable tile bonding mat of claim 1, wherein the height between the top surface and the bottom surface is between inch and inch.

19. A method for manufacturing a reactivatable tile bonding mat installable without cement-based thinset, the method comprising: providing a polymer polyethylene terephthalate (PET) polyester; providing a filler; melting the filler into the polymer PET polyester in a pre-determined proportion to obtain a polymer hot-melt material having a pre-determined melting temperature; and forming, from the polymer hot-melt material, a mat having a first surface and a second surface, wherein heating of the polymer hot-melt material causes the first surface to adhere to a tile and the second surface to adhere to a surface to be covered by the tile.

20. A reactivatable tile bonding mat installable without cement-based thinset, the reactivatable tile bonding mat comprising: a top surface; and a bottom surface, wherein the top surface and the bottom surface comprises a polymer polyethylene terephthalate (PET) hot-melt material, the polymer hot-melt material including a polyester and a filler mixed in pre-determined proportions, the polymer PET hot-melt material having a pre-determined melting temperature, and wherein heating of the polymer hot-melt material to at least the pre-determined melting temperature causes the first surface to adhere to a tile and the second surface to adhere to a surface to be covered by the tile.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0013] The accompanying drawings, where like reference numerals refer to identical or functionally similar elements throughout the separate views, together with the detailed description below, are incorporated in and form part of the specification, and serve to further illustrate embodiments of concepts that include the claimed disclosure and explain various principles and advantages of those embodiments.

[0014] FIG. 1 illustrates a system for applying a reactivatable tile bonding mat, according to embodiments of the present technology.

[0015] FIG. 2 illustrates a reactivatable tile bonding mat according to embodiments of the present technology.

[0016] FIG. 3 illustrates another system for applying a reactivatable tile bonding mat, according to embodiments of the present technology.

[0017] FIG. 4A illustrates a top view of a reactivatable tile bonding mat 115 according to some embodiments of the present technology.

[0018] FIG. 4B illustrates a side view of the reactivatable tile bonding mat of FIG. 4A.

[0019] FIG. 5 illustrates a close up view of the top surface of a reactivatable tile bonding mat according to some embodiments of the present technology.

[0020] FIG. 6 is a flow chart showing steps of a method for manufacturing of a reactivatable tile bonding mat according to some embodiments of the present technology.

DETAILED DESCRIPTION

[0021] In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosure. It will be apparent, however, to one skilled in the art, that the disclosure may be practiced without these specific details. In other instances, structures and devices are shown at block diagram form only in order to avoid obscuring the disclosure.

[0022] The technology disclosed herein is concerned with tile installation. Specifically, a reactivatable tile bonding mat that requires no cement-based thinset for installation is disclosed. In some embodiments, the reactivatable tile bonding mat includes material with adhesive properties on the top surface and the bottom surface. The top surface and the bottom surface can include a polymer hot-melt material that is reactivatable after heating, the polymer hot-melt material having adhesive properties for adhering to concrete and other substrates activated upon heating.

[0023] Technical effects of certain embodiments of the disclosure may provide a method for installation of tiles without use of a cement-based thinset by using a reactivatable tile bonding mat. Eliminating the need for cement-based thinset may result in reduction of the use and production of cement-based products, and thereby reducing carbon dioxide emission.

[0024] Referring now to the drawings, various embodiments are described in which like reference numerals represent like parts and assemblies throughout the several views. It should be noted that the reference to various embodiments does not limit the scope of the claims attached hereto. Additionally, any examples outlined in this specification are not intended to be limiting and merely set forth some of the many possible embodiments for the appended claims.

[0025] FIG. 1 illustrates a system 100 for applying a reactivatable tile bonding mat, according to some example embodiments of the present technology. The system 100 may include a floor 105, a tile 110, and a reactivatable tile bonding mat 115. The reactivatable tile bonding mat 115 can be placed between the floor 105 and the tile 110. Heating 120 can be applied to the reactivatable tile bonding mat 115 to cause the reactivatable tile bonding mat to adhere by a first surface to the tile and by a second surface to the floor.

[0026] FIG. 2 illustrates a system 200 for applying a reactivatable tile bonding mat, according to other example embodiments of the present technology. The system 100 may include a floor 105, a tile 110, a floor heating system 150, and a reactivatable tile bonding mat 115. The floor heating system 150 can be built into the floor. The floor heating system 150 may include electrically heated cables. The reactivatable tile bonding mat 115 can be positioned between the floor heating system 150 and the tile 110. A heating 120 can be applied to the reactivatable tile bonding mat 115 to cause the reactivatable tile bonding mat to adhere by a first surface to the tile and by a second surface to the floor heating system 150 and, lastly, to the floor 105.

[0027] FIG. 3 illustrates a reactivatable tile bonding mat 115 according to embodiments of the present technology. The reactivatable tile bonding mat 115 may include a first surface 125 adhering to a tile and a second surface 115 adhering to a surface on which the tile is to be installed. In some embodiments, the reactivatable tile bonding mat 115 represents a sheet made of a polymer hot-melt material having adhesive properties. The polymer hot-melt material can be adhering to the tile and the floor. The polymer hot-melt material can be adhesive with regards to one or more materials that the tile or the floor is made of, for example, concrete, wood, stone, tile and vinyl. The width and length of the reactivatable tile bonding mat 110 can be substantially the same as the width and length of the tile 110. The length and width of the reactivatable tile bonding mat 110 may be, for example, 3 by 5 feet, 4 by 8 feet, or of any other size. The thickness of the reactivatable tile bonding mat 110 can be, for example, from to inches.

[0028] In an example embodiment, the polymer hot-melt material can be made of a mixture of a polyethylene terephthalate (PET) and a filler. The filler may include one or more of calcium carbonate, aragonite, silica, metal flake, and glass. In some embodiments, the filler can be made of recycled windshield glass.

[0029] The filler in the polymer hot-melt material can be added for the following reasons. First, the filler may stabilize temperature at which the polymer hot-melt material can melt. A pre-determined proportion of the filler to the PET can be selected to obtain the polymer material with a desired melting temperature for the polymer hot-melt material. The descried melting temperature of the polymer hot-melt material can be higher than a temperature produced by the floor heating system to allow the reactivatable tile bonding mat to be used with floor heating systems without being melted. At the same time, the desired melting temperature can be low enough to allow heating 120 to be applied to the reactivatable tile bonding mat to cause melting of the polymer hot-melt material. In some embodiments, the polymer hot-melt material may include 20-50% by volume of the PET and 50-80% by volume of glass material.

[0030] Another reason for adding the filler is that the filler may provide extra support structure for the tile 110 when the tile 110 is positioned on top of the reactivatable tile bonding mat 115. Yet another reason for adding the filler is that the filler may replace, at least partially, the PET and thus reduce costs of manufacturing the polymer hot-melt material and the reactivatable tile bonding mat 115 because the filler (for example, recycled windshield glass) can be less expensive than the PET.

[0031] Heating 120 may include inductive heating or conductive heating. The heating may be used to adhere the tile 110 to the surface of floor 105 by melting the polymer hot-melt material. The heating can be also used to remove the tile or adjust position of the tile already attached to the floor by re-melting the polymer hot-melt material of the reactivatable tile bonding mat 115.

[0032] In some embodiment, the reactivatable tile bonding mat 115 may include a heat receptor. In some embodiments, when heating is induction heating, the heat receptor may include on or more of metal flake, metallic fiber, powdered steel or a steel screen mesh, embedded in the polymer hot-melt material. Heating may cause molecules of the hot receptor to stir up, which, in turn, causes the polymer hot-melt material to melt and create bonding to surfaces of the tile 110, the floor 105 and/or floor heating system (if installed on the floor), and other surfaces on which the tile can be installed.

[0033] In some embodiments, when relying on other heating methods (for example using a microwave device, heat gun, and so forth) the reactivatable tile bonding mat 115 may include a porous, melt-bonded polyester that is non-woven and has proven dimensional stability when, for example, subjected to changes in temperature and humidity.

[0034] In some embodiments, the reactivatable tile bonding mat 115 may further include a hydrophobic material. The hydrophobic material can make the reactivatable tile bonding mat 115 moisture resistant. In some embodiments, the reactivatable tile bonding mat 115 can also act as a crack suppressant membrane.

[0035] In various embodiments, the reactivatable tile bonding mat may include a low-melting point polymer or synthetic material impregnated with metal flake, metallic fibers, or a steel mesh. For example, the tile can be placed on the reactivatable tile bonding mat 115 as described above and bonded to the tile by heating the polymer hot-melt material.

[0036] In various embodiments, the tile and mat can be properly positioned and an induction heater can be passed over the top of the tile to melt the mat and form a bond between the floor and the tile. The induction heater can include a floor buffing machine generating a high frequency alternating current. The current can inductively couple with the PET mix, thus setting up an alternating current flow through the metal impregnated mat. In various embodiment, the mat would resistively heat and form a permanent bond with the tile and the floor. The induction heater can be also be used to re-melt the mat and loosen the tile.

[0037] In some embodiments, parameters of bonding of a tile to a surface using the reactivatable tile bonding mat 115 can satisfy one or more construction requirements. The requirements may include certain bond strength, tensile strength, crack isolation, and water proofing.

[0038] FIG. 4A illustrates a top view of a reactivatable tile bonding mat 115 according to some embodiments of the present technology. FIG. 4B illustrates a side view of the reactivatable tile bonding mat 115. In FIG. 4A and FIG. 4B the reactivatable tile bonding mat 115 includes a plate 405 made of a polymer hot-melt material and a metal screen 410 embedded in the plate 405. The metal screen 410 can function as a heat receptor. When the mat 115 is placed between a tile and a floor, the metal screen 410 can be heated to cause the polymer hot-melt material of the plate 405 to melt. After being melted and cooled down, the plate 405 may adhere to the tile and the floor.

[0039] FIG. 5 illustrates a close up view of a top surface of a reactivatable tile bonding mat according to some embodiments of the present technology. In FIG. 4, the top surface comprises a notch pattern for enhanced bonding. The notches can be, for example, inches wide and inches deep. A distance between two neighboring notches can be, for example, inches.

[0040] FIG. 6 is a flow chart showing steps of a method for manufacturing of a reactivatable tile bonding mat according to some example embodiments of the present technology. The method 600 may commence with providing a polymer PET polyester in block 605. In block 610, the method 600 may proceed with providing a filler. The filler may include calcium carbonate, aragonite, silica, metal flake, and glass.

[0041] In block 615, the method 600 may melt the filler in the polymer PET polyester in a pre-determined proportion to obtain a polymer hot-melt material having a pre-determined melting temperature. In block 620, the method may proceed with forming, from the polymer hot-melt material, a mat of a predetermined length, width, and thickness. The mat can include a first surface and a second surface such that when the mat is positioned between a tile and a surface to be covered by the tile, heating of the polymer hot-melt material causes the first surface to adhere to the tile and the second surface to adhere to the surface to be covered by the tile.

[0042] The present technology is described above with reference to example embodiments. Therefore, other variations upon the example embodiments are intended to be covered by the present disclosure.