A method of manufacturing a hexagonal boron nitride laminate contains steps of: a) Dissolve dielectric polymers in solvent. b) Mixing h-BN powder to form a well-mixed h-BN coating slurry. c) Coating slurry on substrates and dried at 100-150° C. The substrates can directly be etched or processed to form electric circuits. Substrates can also be completely etched or detached to attain a free standing laminate. Thereby, a hexagonal boron nitride laminate exhibit thermal conductivity of 10 to 40 W/m.Math.K, which is significantly larger than that currently used in thermal management. In addition, thermal conductivity of hexagonal boron nitride laminates increases with the increasing mass density, which opens a way of fine tuning of its thermal properties. For heat dissipation application, hexagonal boron nitride laminate coating can significantly enhance the performance of LED light bulb.

A method for molding amorphous polyether ether ketone including steps of preparing a molten mass including polyether ether ketone, cooling a mold assembly to a temperature of at most about 200° F., and injecting the molten mass into the cooled mold assembly.

A method of manufacturing hexagonal boron nitride laminates contains steps of: a) Dissolving dielectric polymers in solvent. b) Mixing h-BN powder to form a well-mixed h-BN coating slurry. c) Coating slurry on substrates and dried at 100 to 150° C. d-1) For free standing h-BN film, peel off h-BN dielectric polymer layer from substrate in water batch by roll to roll process. d-2) For h-BN film on substrates, heat compression of the substrates and hBN laminates at 100 to 250° C. for multi-layer structures. Thereby, hexagonal boron nitride laminates exhibit thermal conductivity of 10 to 40 W/m.Math.K, which is significantly larger than that currently used in thermal management. In addition, thermal conductivity of hexagonal boron nitride laminates increases with the increasing mass density, which opens a way of fine tuning of its thermal properties.

A level sensor assembly (552) for estimating a level of a dielectric powder (412) in a container assembly (544) includes a first electrode member (554) that is coupled to the container assembly (544); a second electrode member (556) that is coupled to the container assembly (544): and a control system (424). The second electrode member (556) is spaced apart from the first electrode member (554) and configured so that powder (512) in the container assembly (544) is positioned at least partly between the electrode members (554) (556). The control system (424) utilizes a capacitance between the electrode members (554) (556) to estimate the level of the powder (512) in the container assembly (544).

A method for manufacturing a dielectric sheet, includes the steps of extrusion molding a mixture including powder polytetrafluoroethylene and spherical silica at a temperature lower than or equal to a melting point of the polytetrafluoroethylene, and calendering a sheet body obtained by the extrusion molding. A mass ratio of the silica with respect to the polytetrafluoroethylene is 1.3 or greater. An average particle diameter of the silica is 0.1 μm or greater but 3.0 μm or less. A reduction ratio of the extrusion molding is 8 or less.

In accordance with one or more embodiments, a method includes injection molding of a dielectric material in a pre-distorted antenna mold; and curing the dielectric material. The pre-distorted dielectric mold has a shape that compensates for shape distortion of the dielectric material during the curing.

The present invention relates to a mold for molding a component, in particular a piece of sports apparel, a method for manufacturing the component using such a mold and a shoe with such a component. In one embodiment, a mold for molding a component, in particular a piece of sports apparel, comprises (a.) a mixture of a polymer material and a filler material, (b.) wherein the filler material is adapted to allow a heating of the component inside the mold by means of an electromagnetic field.

A three-dimensional printing kit includes a build material composition and a dielectric agent. The build material composition includes a fluorinated polymeric material having an effective relative permittivity (εr) value ranging from >3 to ≤10,000. The dielectric agent includes a dielectric material having an effective relative permittivity (εr) value ranging from ≥1.1 to about ≤10,000.

The present invention relates to a carbon composite, which comprises a polymer resin and a carbon material having specific conditions, thereby controlling a dielectric constant. According to the present invention, the carbon composite and a method for controlling a dielectric constant by using the same can be variously applied to a circuit, an electronic material and the like by establishing a correlation between the specific surface area of the carbon material and the dielectric property of the carbon composite.

In an embodiment, a thermoplastic composite comprises a thermoplastic polymer; and a dielectric filler having a multimodal particle size distribution; wherein a peak of a first mode of the multimodal particle size distribution is at least seven times that of a peak of a second mode of the multimodal particle size distribution; and a flow modifier.