A thermally conductive dielectric film includes a thermoplastic layer including polyester segments and 5 to 30% by wt polyether amide segments. The thermally conductive dielectric film has a thickness of less than 100 micrometers.

A composite film having a high dielectric permittivity engineered particles dispersed in a high breakdown strength polymer material to achieve high energy density.

Methods and systems suitable for fabricating multi-layer elastic electronic devices, and elastic electronic devices formed thereby. A method of fabricating an elastomer-based electronic device includes printing a first liquid material and then a second liquid material on a fabric substrate that comprises fibers. The first and second liquid materials are sequentially printed with a three-dimensional printer that directly prints the first liquid material onto the fabric substrate so that the first liquid material wicks through some of the fibers of the fabric substrate and forms a solid matrix of an elastomer-based composite that comprises the matrix and the fabric substrate, after which the three-dimensional printer directly prints the second liquid material on the elastomer-based composite to form a film thereon. The elastomer-based composite and film are electrical components of the elastomer-based electronic device.

A bonding method for bonding an adherend with a high-frequency dielectric heating adhesive sheet is provided. The adherend includes a fluorine-containing surface at least containing fluorine on a surface thereof. The high-frequency dielectric heating adhesive sheet includes a high-frequency dielectric adhesive layer including a thermoplastic resin and a dielectric filler. A surface free energy of the high-frequency dielectric adhesive layer is in a range from 15 mJ/m.sup.2 to 30 mJ/m.sup.2. A melting point of the high-frequency dielectric adhesive layer is in a range from 110 degrees C. to 300 degrees C. The bonding method includes bringing the fluorine-containing surface of the adherend into contact with the high-frequency dielectric adhesive layer and applying a high-frequency wave to the high-frequency dielectric adhesive layer to bond the high-frequency dielectric heating adhesive sheet to the fluorine-containing surface.

A wiring harness assembly includes a plurality of electrical conductors having wires enclosed within insulative sheaths that are integrally formed of an electrically insulative material. The assembly also includes a lattice support structure that is attached to the insulative sheaths at multiple locations. The lattice support structure is configured to maintain a desired shape of the assembly. The lattice support structure is formed of filaments that may be formed using an additive manufacturing process The filaments may be arranged such that lattice support structure defines a plurality of hexagonally shaped apertures. A process for manufacturing the wiring harness assembly and an apparatus configured to manufacture the wiring harness assembly is also presented.

A method of forming a polyolefin-perovskite nanomaterial composite which contains oriented electrically and thermally conductive pathways. The method involves milling a polyolefin with particles of a perovskite nanomaterial, molding to forma composite plate, and subjecting the composite plate to an AC voltage. The AC voltage forms oriented electrically and thermally conductive pathways by partial dielectric breakdown of the composite. The presence of the oriented electrically and thermally conductive pathways gives the polyolefin-perovskite nanomaterial electrical and thermal conductivity and dielectric permittivity higher than the polyolefin alone.

This disclosure describes co-extruded multilayer articles including at least one continuous layer and one discontinuous layer, as well as systems and techniques for the manufacture of co-extruded multilayer articles. For example, a co-extruded multilayer article is described that includes a body having a plurality of layers, where a first layer of the plurality of layers is formed from a first material and is continuous along a longitudinal axis of the body, and a second layer of the plurality of layers is formed from a second material and is discontinuously co-extruded along the longitudinal axis.

A system for producing three-dimensional objects forms fluid paths within the support structure to facilitate the removal of the support structure following manufacture of the object. The system includes a first ejector configured to eject a first material towards a platen to form an object, a second ejector configured to eject a second material towards the platen to form support for portions of the object, at least one portion of the support having a body with at least one fluid path that connects at least one opening in the body to at least one other opening in the body, and a fluid source that connects to the at least one fluid path of the support to enable fluid to flow through the at least one fluid path to remove at least an inner portion of the support from the object.

The invention relates to a heat exchanger tube (1) which is a component of a heat exchanger of an oxygenator. The heat exchanger tube (1) comprises a tube body (2) consisting of thermoplastic polyurethane (PTU). The tube body (2) has a Shore hardness of greater than 60 D. This results in a heat exchanger tube optimised for use in a heat exchanger of an oxygenator.

Polymer-based selective radiative cooling structures are provided which include a selectively emissive layer of a polymer or a polymer matrix composite material. Exemplary selective radiative cooling structures are in the form of a sheet, film or coating. Also provided are methods for removing heat from a body by selective thermal radiation using polymer-based selective radiative cooling structures, and a cold collection system comprising a plurality of the polymer-based selective radiative cooling structures.