A thermal conducting sheet, including: a binder resin; insulating-coated carbon fibers; and a thermal conducting filler other than the insulating-coated carbon fibers, wherein a mass ratio (insulating-coated carbon fibers/binder resin) of the insulating-coated carbon fibers to the binder resin is less than 1.30, and wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material.

A thermal conducting sheet, including: a binder resin; insulating-coated carbon fibers; and a thermal conducting filler other than the insulating-coated carbon fibers, wherein a mass ratio (insulating-coated carbon fibers/binder resin) of the insulating-coated carbon fibers to the binder resin is less than 1.30, and wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material.

A semi-finished product for the production of connection systems for electronic components comprises two groups (A, B) of alternately applied conductive layers and insulating layers, wherein outer layers (2, 2) of the two groups (A, B) are facing each other to form a separation area for the groups (A, B) to be separated from each other to yield connection systems for electronic components and the separation area is overlapped and sealed on all sides thereof at least by the two insulating layers (4, 4) following the separation area. The method for the production of connection systems for electronic components is characterized by the following steps: a) orienting two groups (A, B) of alternately applied conductive layers and insulating layers (4, 4) to face each other with outer layers to form a separation area for the groups (A, B) to be separated from each other and safeguarding that the separation area is overlapped and sealed on all sides thereof at least by the two insulating layers (4, 4) following the separation area, b) processing the groups (A, B) of alternately applied conductive layers and insulating layer, c) cutting through the separation area along the edges thereof.

A submersible electrical enclosure is for a switchgear assembly. The switchgear assembly includes a number of electrical switching apparatus. The submersible electrical enclosure includes: a plurality of sides defining an interior, the interior receiving each of the electrical switching apparatus, each side including: a conductive polymeric layer facing away from the interior, and an insulative polymeric layer molded to the conductive polymeric layer. The insulative polymeric layer faces the interior and substantially overlays the conductive polymeric layer.

The invention describes an igniter support (22) for an igniter unit (20) of a gas generator (10), comprising a first holder element (30) made from a first material and a second holder element (32) made from a second material different from the first material. Both holder elements (30, 32) can be positively coupled to each other. Further, a subassembly (16), a gas generator (10) and a method for manufacturing a gas generator (10) are described.

The invention describes an igniter support (22) for an igniter unit (20) of a gas generator (10), comprising a first holder element (30) made from a first material and a second holder element (32) made from a second material different from the first material. The two holder elements (30, 32) can be positively coupled to each other, especially can be at least partially positively nested. Further, a subassembly (16), a gas generator (10) as well as a method for manufacturing a gas generator (10) are described.

The present invention relates to an electrical transformer comprising an electrical insulator and a winding of an electrical conductor around a core, said insulator being formed of an essentially non-porous composite material comprising a resin matrix and up to 85% by weight of insulating fibres surrounded by the resin matrix, the composite material having a maximum moisture content of less than 0.5% by weight at 23 C. and 50% relative humidity.

A method for producing a component includes incorporating a molding compound into a tool for producing the component, where the molding compound includes an artificial resin as a matrix and a filler material embedded in the matrix. The method includes compressing the molding compound by the tool and by the compressing forming the molding compound to a green product. The method further includes providing the green product while disposed in the tool with a layer in a sub-region by incorporating a liquid material for producing the layer into the tool and applying the liquid material to the sub-region. The liquid material is a metallic material and the layer is an electromagnetic shielding on the green product.

The present disclosure provides a metamaterial manufacturing method. The manufacturing method includes the following steps: (a) separately adding insulating substrate powder and at least one of wave-absorbing agent powder and metal electrode powder to thermoplastic resin, and mixing them evenly to obtain a raw material; (b) applying a coextrusion process to the raw material according to a metamaterial microstructure design, to form a microstructure unit rodlike material; and (c) configuring the microstructure unit rodlike material in a cyclic microstructure configuration manner, placing the material in an extruder, and obtaining a cyclically configured metamaterial microstructure through coextrusion by using the extruder. The present disclosure further provides a metamaterial manufactured by using the foregoing method. The present disclosure provides a method for manufacturing a ceramic-substrate metamaterial that features high efficiency, low iteration costs, and a relatively high yield rate. A thinner and more efficient wave-absorbing metamaterial is obtained.

A gate-all around fin double diffused metal oxide semiconductor (DMOS) devices and methods of manufacture are disclosed. The method includes forming a plurality of fin structures from a substrate. The method further includes forming a well of a first conductivity type and a second conductivity type within the substrate and corresponding fin structures of the plurality of fin structures. The method further includes forming a source contact on an exposed portion of a first fin structure. The method further comprises forming drain contacts on exposed portions of adjacent fin structures to the first fin structure. The method further includes forming a gate structure in a dielectric fill material about the first fin structure and extending over the well of the first conductivity type.