A head is disclosed for use with an additive manufacturing system. The head may include a nozzle configured to discharge multiple fiber strands oriented transversely adjacent each other relative to a travel direction of the head. The head may also include a matrix supply separately associated with each of the multiple fiber strands.

A metallic shell, a method for manufacturing the metallic shell and a mobile terminal including the metallic shell are provided. The metallic shell includes a body and an insulator. The body has a slot. The insulator is formed in the slot and includes an insulating material. The insulating material includes a plastic material, a first coating and a second coating. The first coating is configured to colour the plastic material to make the insulator exhibit a same colour as that of the body. The second coating is configured to improve luster of the plastic material to make the insulator exhibit a same metallic luster as that of the body.

A housing assembly includes a housing, a printed circuit board (PCB) contained in a housing, and a cup-shaped cap having an interior and a flange portion. A tall component extending from the PCB is covered by the cap such that the tall component is disposed in the interior of the cap and the flange portion of the cap engages the PCB. A vacuum is applied and while maintaining the vacuum, an encapsulant is introduced into the housing to a level so as to cover the PCB and certain other components not the relatively taller component(s). When the vacuum is released, a pressure differential between the environmental pressure and the vacuum remaining in the cap interior forces encapsulant into the cap interior to a level higher than that outside of the cap. A multi-level height potting process is achieved.

The invention discloses a probe and a method of manufacturing the same. The probe has a long cylindrical shape and includes a probe head (1), a probe body (2) at the rear of the probe head (1), and a probe tail (3) at a rear end of the probe body (2). The probe has a three-layer composite structure. The probe tail is a three-layer composite structure. The probe of the invention is used to detect a body tissue, and according to different electrical signals fed back by different body tissues, a type of the body tissue being detected by the probe can be known, thereby avoiding a medical accident in which a spinal cord or nerve is injured by a screw intruded into a vertebral foramen. The probe of the invention is simple in structure, convenient for use, easy in operation, of high reliability, high surgical safety and high success rate of surgery.

A composite heater may include a base additively manufactured from a first matrix material, and a heating element additively manufactured adjacent the base from a second matrix material and an electrically and thermally conductive fiber that is at least partially encased in the second matrix material. The composite heater may also include a control mechanism configured to selectively complete a circuit between a power supply and the electrically and thermally conductive fiber.

The disclosure relates to methods and compositions for direct printing of circuit boards having an electromagnetically-shielded tracks and/or components. Specifically, the disclosure relates to the direct, uninterrupted and continuous 3D printing of insulation-jacketed tracks and/or components with metallic shielding sleeves or capsule.

A process for manufacturing finished wire and cable having reduced coefficient of friction and pulling force during installation, includes providing a payoff reel containing at least one internal conductor wire; supplying the at least one internal conductor wire from the reel to at least one extruder; providing the least one extruder, wherein the at least one extruder applies an insulating material and a polymerized jacket composition over the at least one internal conductor wire, wherein the polymerized jacket composition comprises a predetermined amount by weight of nylon; and at least 3% by weight of a silica providing a cooling device for lowering the temperature of the extruded insulating material and the polymerized jacket composition and cooling the insulating material and the polymerized jacket composition in the cooling device; and, reeling onto a storage reel the finished, cooled, wire and cable for storage and distribution.

This disclosure describes co-extruded multilayer articles including at least one continuous layer and one discontinuous layer, as well as systems and techniques for the manufacture of co-extruded multilayer articles. For example, a co-extruded multilayer article is described that includes a body having a plurality of layers, where a first layer of the plurality of layers is formed from a first material and is continuous along a longitudinal axis of the body, and a second layer of the plurality of layers is formed from a second material and is discontinuously co-extruded along the longitudinal axis.

A gate-all around fin double diffused metal oxide semiconductor (DMOS) devices and methods of manufacture are disclosed. The method includes forming a plurality of fin structures from a substrate. The method further includes forming a well of a first conductivity type and a second conductivity type within the substrate and corresponding fin structures of the plurality of fin structures. The method further includes forming a source contact on an exposed portion of a first fin structure. The method further comprises forming drain contacts on exposed portions of adjacent fin structures to the first fin structure. The method further includes forming a gate structure in a dielectric fill material about the first fin structure and extending over the well of the first conductivity type.

A semiconductor package including a circuit substrate, an interposer structure, a plurality of dies, and an insulating encapsulant is provided. The interposer structure is disposed on the circuit substrate. The plurality of dies is disposed on the interposer structure, wherein the plurality of dies is electrically connected to the circuit substrate through the interposer structure. The insulating encapsulant is disposed on the circuit substrate, wherein the insulating encapsulant surrounds the plurality of dies and the interposer structure and encapsulates at least the interposer structure, the insulating encapsulant has a groove that surrounds the interposer structure and the plurality of dies, and the interposer structure and the plurality of dies are confined to be located within the groove.