An injection molding apparatus (5) comprising an injection molding machine (IMM), a heated manifold (60) that receives injection fluid (9) and distributes the injection fluid through a fluid distribution channel (120), a mold (70) having a cavity (80) and one or more valves (50) having a valve pin (100) the one or more valves (50) being comprised of: an electrically driven actuator (200), a controller including an algorithm that controllably limits rotation of a shaft (12) or output rotation device (16, 430, 500) during the course of an entire injection cycle to selectable angular positions that create a moment arm that extends between selected a selected minimum moment arm and a selected maximum moment arm, the selectable angular positions being between 70 degrees above and 70 degrees below an angular position that corresponds to the selected maximum moment arm.

Systems and methods for curing complex fiber-reinforced composite structures utilize two distinct heat sources. A first heat source is utilized for heating a complex fiber-reinforced composite structure from within an internal portion of the complex fiber-reinforced composite structure. A second heat source is utilized for heating the complex fiber-reinforced composite structure from an external surface of the complex fiber-reinforced composite structure.

The method for producing a thermally conductive sheet according to the present invention comprises: a step (1) of obtaining a liquid composition comprising a curable silicone composition including an alkenyl group-containing organopolysiloxane and a hydrogen organopolysiloxane, a thermally conductive filler, and a volatile compound; a step (2) of sandwiching the liquid composition between two resin sheets at least one of which is a gas-permeable film and pressurizing these to obtain a sheet-shaped formed product; and a step (3) of heating the sheet-shaped formed product to volatilize at least a part of the volatile compound. According to the present invention, it is possible to provide a method for producing a thermally conductive sheet having a good sheet condition and a low thermal resistance value.

In a method for printing a three dimensional structure, a continuous length of fiber that includes, interior to a surface of the fiber, a plurality of different materials arranged as an in-fiber functional domain, with at least two electrical conductors disposed in the functional domain in electrical contact with at least one functional domain material, is dispensed through a single heated nozzle. After sections of the length of fiber are dispensed from the heated nozzle, the sections are fused together in an arrangement of a three dimensional structure. The structure can thereby include a continuous length of fiber of least three different materials arranged as an in-fiber functional device, with the continuous length of fiber disposed as a plurality of fiber sections that are each in a state of material fusion with another fiber section in a spatial arrangement of the structure.

In a polypropylene-based foamed molded body of the present invention, a density which is measured on the basis of ISO1183 is greater than or equal to 0.15 g/cm.sup.3 and less than or equal to 0.54 g/cm.sup.3, thermal resistance (R) at 30° C. in a thickness direction which is measured on the basis of ASTM E1530 is greater than or equal to 0.020 m.sup.2.Math.K/W and less than or equal to 0.125 m.sup.2.Math.K/W, thermal capacity per unit area (Q) at 30° C. is greater than or equal to 1.0 kJ/m.sup.2.Math.K and less than or equal to 2.5 kJ/m.sup.2.Math.K, and Expression 1 described below is satisfied.

Q>1/(4×R.sup.1/2)  (Expression 1)

Provided are a thermally conductive ceramic-polymer composite in which thermoplastic polymers form a matrix, and planar fragments of thermally conductive ceramic or thermally conductive ceramic powder is uniformly dispersed on a grain boundary between thermoplastic polymer particles, thereby forming a thermal pathway, wherein the thermoplastic polymer particles are formed in a faceted shape, and the average size of the planar fragments of thermally conductive ceramic or thermally conductive ceramic powder is smaller than 1/10 of that of the thermoplastic polymer particles, and a method of preparing the same. Accordingly, since dispersion and interfacial affinity of a thermally conductive ceramic filler are maximized, excellent electrical insulation and excellent thermal conductivity can be exhibited even with a small content of the thermally conductive ceramic filler.

Thermal curing of a potting material within a hole in a surface of a composite material is described utilizing a flexible vacuum compression device that includes a chemical-based heating pack. The vacuum compression device includes an internal compartment within a cavity that retains the chemical-based heating pack, and a vacuum port having a passage into the cavity. An end of the vacuum compression device includes an interface that forms an air-tight seal between the cavity and the surface when applied to a surface of the composite material. Drawing a vacuum via the vacuum port collapses the vacuum compression device and positions the chemical-based heating pack proximate to the surface, enabling heat from the chemical-based heating pack to thermally cure the potting material.

A thermal conducting sheet having a high adhesion between layers even if the thermal conducting sheet has a multilayer structure is provided. The thermal conducting sheet including a low-hardness layer and a reinforcing layer laminated on one side or both sides of the low-hardness layer. The reinforcing layer having a hardness greater than a hardness of the low-hardness layer. The low-hardness layer comprises: acrylic polymer, silicon carbide, aluminum hydroxide, magnesium hydroxide, and plasticizer.

A method of manufacturing a hexagonal boron nitride laminate contains steps of: a) Dissolve dielectric polymers in solvent. b) Mixing h-BN powder to form a well-mixed h-BN coating slurry. c) Coating slurry on substrates and dried at 100-150° C. The substrates can directly be etched or processed to form electric circuits. Substrates can also be completely etched or detached to attain a free standing laminate. Thereby, a hexagonal boron nitride laminate exhibit thermal conductivity of 10 to 40 W/m.Math.K, which is significantly larger than that currently used in thermal management. In addition, thermal conductivity of hexagonal boron nitride laminates increases with the increasing mass density, which opens a way of fine tuning of its thermal properties. For heat dissipation application, hexagonal boron nitride laminate coating can significantly enhance the performance of LED light bulb.

A prism (1090) is configured from a dielectric medium and is used in analysis using surface plasmons. The prism (1090) is provided with an incidence surface (1170) on which excitation light from outside is incident, a reflection surface (1172) on which excitation light having entered the incidence surface (1170) is reflected, an emission surface (1174) from which excitation light reflected by the reflection surface (1172) is emitted, and an opposing surface (1175) opposing the reflection surface (1172). A gold film (1092) is formed on the reflection surface (1172). The opposing surface (1175) has a sink-mark surface (1200), and the sink-mark surface (1200) is a transparent surface.