The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPS, the SMP designer can program in to the SMP mechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.

A sensor casing is disclosed that has an open receiving space which has a peripheral edge as a creep barrier at the open end. The receiving space is filled with a potting compound. The cured potting compound forms a concave surface with respect to the peripheral edge. A method for potting an open receiving space of a sensor casing of this kind is also disclosed. The peripheral edge has an outwardly declining slope which allows temporary overfilling of the receiving space during a potting process so as to form a stable convex potting compound surface.

Provided is a microporous film which has a surface A and a surface B opposite to the surface A. In one embodiment, the microporous film has a ratio (F.sub.B/F.sub.A) of a dynamic friction coefficient F.sub.B of the surface B to a dynamic friction coefficient F.sub.A of the surface A of 1.2 to 20. In another embodiment, the microporous film is a single layer having a thickness of 3-18 μm, a number N.sub.A of pores on the surface A is 10-100/μm.sup.2, a number N.sub.B of pores on the surface B is 20-200/μm.sup.2, and N.sub.A/N.sub.B is 0.2-0.96. In addition, a total area S.sub.A of pores on the surface A is 0.02-0.5 μm.sup.2/μm.sup.2, a total area S.sub.B of pores on the surface B is 0.01-0.3 μm.sup.2/μm.sup.2, and S.sub.A/S.sub.B is 1.1-10. Furthermore, in another embodiment, a number W.sub.B of protrusion-like bodies on the surface B is 0.2-1000/100 μm.sup.2.

A bonded composite joint includes a first carbon fiber-reinforced polymer (CFRP) panel; a second CFRP panel; a corrugated structure placed between the first and second CFRP panels; and an adhesive placed between the first and second CFRP panels and in contact with the corrugated structure. The corrugated structure has a shape defined by a given wavelength λ.

A device for producing microstructures, particularly microneedles and more particularly microneedle arrays, including a female mold that has, on a top side, at least one in particular conical depressed portion for producing a microstructure. The female mold is, for example, in the form of a silicone cap and is connected to a hollow cylinder in particular via a holding element. A plunger is disposed movably inside the hollow cylinder.

A three-dimensional geometry of a thermal interface body may be customized to substantially fill an irregular gap along a thermal dissipation pathway in an electronic package. The thermal interface body is fabricated through an additive deposition process, wherein sequential patterns of thermal interface material are coherently connected to other deposited patterns of thermal interface material.

An octogrid structure and method of forming the same for a composite laminate structure is provided. The octogrid sub-structure comprises: a first ply layer comprising a plurality of first elongate tapes oriented in a first direction and a plurality of second elongate tapes oriented in a second direction; and a second ply layer comprising a plurality of third elongate tapes oriented in the first direction and a plurality of fourth elongate tapes oriented in the second direction, the second ply layer being overlaid atop the first ply layer. A first end of each of the elongate tapes is positioned approximately adjacent a midpoint of an adjacently positioned one of the elongate tapes; and a second and opposing end of each of elongate tapes extends freely beyond a central grid portion defined by a length of a portion between the first end and the midpoint of the elongate tapes.

The present invention relates to an enhanced method for the manufacture of a plastic component (135), in particular a cushioning element for sports apparel, the method comprising: opening a mold (100) by a predetermined amount into a loading position, wherein the mold comprises at least two mold parts (110, 112) and wherein the amount by which the mold is opened influences an available loading volume of the mold, loading a material comprising expanded particles (130) into the loading volume, closing the mold into a closed position, wherein during closing of the mold the mold parts are moved together over different distances (140) in different areas of the mold, compressing the expanded particles by closing the mold and fusing at least the surfaces of the expanded particles to mold the plastic component.

A method for the design, manufacture, and assembly of modular lattice structures composed of cuboctahedron unit cells.

A pattern forming method including forming a curable film using a curable composition that contains metal oxide nanoparticles, on a substrate, pressing a mold having a line and space pattern against the curable film to transfer the line and space pattern to the curable film, curing the curable film to which the line and space pattern has been transferred while pressing the mold against the curable film, to form a cured film, and peeling the mold off the cured film to form a line and space pattern on the substrate, in which a line width x of the line and space pattern formed on the substrate in a base portion and a volume average primary particle diameter φ of the metal oxide nanoparticles satisfy an expression of 0.03x<φ<0.08x, and an expression of x≤500 nm.